• Proceedings of the Materials Research Society of Korea Conference
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• 2003.11a
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• pp.25-25
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• 2003

안정화 지르코니아(Stabilized Zirconia)는 산화물 연료전지 (SOFC: Solid Oxide Fuel Cell), 전기화학식 가스센서 등에 널리 사용되고 있는 대표적인 고체전해질이다. SOFC의 효율향상 및 센서의 저온 동작을 위해서는 높은 이온전도도를 갖는 고체전해질이 요구된다. 안정화 지르코니아의 이온 전도도를 향상시키기 위해 MgO, CaO, $Y_2$O$_3$, Yb$_2$O$_3$, Sc$_2$O$_3$ 등의 안정화제가 첨가된 바 있으며, 이들 첨가제의 변화에 의한 전기전도도 향상 연구는 현재 성숙된 단계이다. 지르코니아 고체전해질의 안정화제가 정해진 상태에서 재료의 전기전도도를 향상시키는 다른 방법은 입계에서의 이온전도도를 높이는 것이다. 안정화 지르코니아는 입계가 입내에 비해 저항이 약 100-10000배 정도크기 때문에, 입계가 얇은 두께에도 불구하고 전해질의 저항에서 큰 역할을 한다고 알려져 있다. 일반적으로 입계의 Si-포함상 편석, 입계액상, 공간전하층등이 입계의 저항에 대한 원인으로 받아 들여 지고 있다.

• Proceedings of the KAIS Fall Conference
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• 2009.12a
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• pp.594-596
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• 2009

본 연구에서는 영상센서를 이용한 상황인식 기반의 컴퓨팅 기술이 혼합된, 스쿨존 안전 관리 시스템을 제안한다. 영상센서를 통한 객체 추출과 상황 인식 기술의 조합을 통하여, 초등학교 주위에서 발생할 수 있는 여러 상황 중 초등학생의 유괴나 사고 등을 인식할 경우 모니터링 장치로 전송하여 응급 상황을 관리할 수 있다. 또한 제안된 시스템은 인간의 시각을 필요로 하는 철도 건널목이나, 교통량 통계조사, 공장 자동화 시스템 등 다양한 응용분야에 활용할 수 있는 최적의 선택이라 할 수 있다.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2002.11b
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• pp.234-237
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• 2002

To detect external vibration signals on the latticed fence structure, distributed fiber optic sensor using Sagnac interferometer was fabricated and tested. The latticed structure fabricated with dimension of 170cm in width and 180cm in height, the optical fiber, 50m in length, distributed and fixed on the latticed structure. It was verified the sensitivity of the Sagnac interferometer using the PZT phase modulator. Fiber optic external vibration signal spplied to the latticed fence structure from 100Hz to several kHz. The interferometeric fiber optic sensor detected the excited vibration signal very effectively without any signal processing. The detected optical signals were compared and analyzed to the detected acclerometer signals.

• The Journal of Korean Institute for Practical Engineering Education
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• v.2 no.1
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• pp.42-46
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• 2010

One way of engineering education fiber optic splicing loss was introduced. To make high sensitivity fiber optic sensor it is required low loss of splicing. Hence in this paper splicing loss was selected in the experiments and the splicing loss was evaluated based on the engineering education. After trials in the experiments fiber optic splicing loss depended upon the experimental attitude and its environments.

• Convergence Security Journal
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• v.8 no.1
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• pp.27-33
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• 2008

The object of this paper is to design a heating control system based on sensor networks for the house, integrated with computing technology. The proposed system can manage the heating by sensing and analyzing the temperature and humidity in apartment house and others. This system also is capable of giving a comfortable circumstances because the interior of a house is in heated by the sensory temperature based control system.

• Proceedings of the KSME Conference
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• 2003.04a
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• pp.770-773
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• 2003

To measure discharge breakdown acoustic signal, Fabry-Perot interferometer fiber optic sensor is used. Fiber optic sensor array can measure the partial discharge acoustic signal caused by defect of power facilities such as power cables, transformers and gas insulation. Fabry-Perot interferometer is selected as an fiber optic sensor array. It is shown that Fabry-Perot fiber optic sensor array detected discharge breakdown acoustic signal, effectively.

• Transactions of the Korean Society for Noise and Vibration Engineering
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• v.16 no.7 s.112
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• pp.762-768
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• 2006

To address the need for new intelligent sensing of systems, this study presents a novel strain sensor based on piezoresistivity of carbon nanotube (CNT) and its nanocomposites. Fabrication and characterization of the carbon nanocomposite material are discussed and an electrical model of the CNT strain sensor was derived based on electrochemical impedance spectroscopy analysis and strain testing. The dynamic response of the sensor on a vibrating beam was simulated using numerical analysis and it was compared with experimental test. The simulation showed good agreement with the strain response of the actual sensor.

• Journal of Institute of Control, Robotics and Systems
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• v.2 no.3
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• pp.194-199
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• 1996

평면 배열형 소나 센서에서는 트랜스듀서 상호간의 간섭효과들이 음을 방사하는 각각의 트랜스듀서 및 평면 배열의 빔패턴에 영향을 주게된다. 따라서 음향 방사출력의 계산은 소나용 트랜스듀서의 성능및 효율을 평가하는데 필수적이다. 음향 방사출력을 예측하기 위하여 무한 강성 배플에 고정된 수개의 트랜스듀서를 이론해석의 대상으로 설정하였다. 각 트랜스듀서는 자기방사 임피던스 및 상호방사 임피던스로 구성되어 있으며 이것의 총 방사 임피던스 및 음향반사 출력의 추출은 등가 전기회로 모델을 이용하였다. 이론및 수치해석의 결과에 근거하여 음향방사 출력은 각 트랜스듀서 상호간의 간섭의 양에 의존함을 보였으며 상호간섭에 의한 음향출력 손실은 25.05%에서 최고 51.52%정도임을 확인하였다.

• Journal of Sensor Science and Technology
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• v.13 no.2
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• pp.152-156
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• 2004

The dielectric and piezoelectric properties of 0.36Pb($Sc_{1/2}Nb_{1/2}$)$O_{3}$-0.25Pb($Ni_{1/3}Nb_{2/3}$)$O_{3}$-0.39Pb$TiO_{3}$ (hereafter PSNNT) at the morphotropic phase boundary (MPB) composition were investigated with $0{\sim}2.5$ mot% $MnO_{2}$ doping. Bulk density, dielectric loss and tetragonality of crystal structure were all improved with increasing $MnO_{2}$ additive content. With increasing $MnO_{2}$ additive content, the electromechanical coupling factor and quality factor were also increased: Electromechanical coupling $k_{p}$ and quality factor $Q_{m}$ at 2.0 mol% $MnO_{2}$ doping with were showed highest values of 55.6 % and 252, respectively.

• Journal of Sensor Science and Technology
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• v.20 no.3
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• pp.187-192
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• 2011

Abrasive blaster is similar to sand blaster, and effectively removes hard and brittle materials. Exiting abrasive blaster has applied to rough working such as deburring and rough finishing. As the need for machining of ceramics, semiconductor, electronic devices and LCD are increasing, micro abrasive blaster was developed, and became the inevitable technique to micromachining. This paper describes the performance of the micro blaster in MEMS process of glass and succeed in domestically producing complete micro blaster. Diameter of hole and width of line in this etching is 100 ${\mu}m$ ~ 1000 ${\mu}m$. Experimental results showed good performance in micro channel and hole in glass wafer. Therefore, this micro blaster could be effectively applied to the micro machining of semiconductor, micro PCR chip.