• Title/Summary/Keyword: 이방성 도체 필름

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Effect analysis of thermal-mechanical behavior on fatigue crack of flip-chip electronic package (플립 칩 전자 패키지의 피로 균열이 미치는 열적 기계적 거동 분석)

  • Park, Jin-Hyoung;Lee, Soon-Bok
    • Proceedings of the KSME Conference
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    • 2007.05a
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    • pp.1673-1678
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    • 2007
  • The use of flip-chip type electronic package offers numerous advantages such as reduced thickness, improved environmental compatibility, and downed cost. Despite numerous benefits, flip-chip type packages bare several reliability problems. The most critical issue among them is their electrical performance deterioration upon consecutive thermal cycles attributed to gradual delamination growth through chip and adhesive film interface induced by CTE mismatch driven shear and peel stresses. The electronic package in use is heated continuously by itself. When the crack at a weak site of the electronic package occurs, thermal deformationon the chip side is changed. Therefore, we can measure these micro deformations by using Moire interferometry and find out the crack length.

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Measurement of Deformations in Micro-Area Using High Resolution AFM Scanning Moiré Technique (고분해능 원자 현미경 스캐닝 무아레 기법을 이용한 미소 영역의 변형량 측정)

  • Park, Jin-Hyoung;Lee, Soon-Bok
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.31 no.6 s.261
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    • pp.659-664
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    • 2007
  • $Moire\'{e}$ interferometry is a useful technique to assess the reliability of electronic package because $Moire\'{e}$ interferometry can measure the whole-field and real-time deformations. The shear strain of a small crack site is important to the reliability assessment of electronic package. The optical limitation of $Moire\'{e}$ interferometry makes ambiguous the shear strain of a small area. An atomic force microscope (AFM) is used to measure the profile of a micro site. High resolution of AFM can apply to the $Moire\'{e}$ technique. AFM $Moire\'{e}$ technique is useful to measure the shear strain of a small area. In this research, the method to accurately measure the deformation of a small area by using AFM $Moire\'{e}$ is proposed. A phase-shifting method is applied to improve the resolution of AFM $Moire\'{e}$.

Thermotropic Behavior of Hydroxypropyl Chitosans Bearing Cholesteryl and Acryloyl Groups (콜레스테릴과 아크릴로일 그룹을 지닌 하이드록시프로필 키토산들의 열방성 거동)

  • 김장훈;정승용;마영대
    • Polymer(Korea)
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    • v.28 no.1
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    • pp.41-50
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    • 2004
  • A new hydroxypropyl chitosan capable of forming a thermotropic liquid crystalline phase and two kinds of derivatives based on the hydroxypropyl chitosan (6-cholesteryloxycarbonylpentoxypropyl) chitosans (CHPCTs) and acrylic acid esters of CHPCT (CHPCTEs) were synthesized. The crosslinked films with liquid crystalline order were also prepared by photocrosslinking CHPCTE in mesophase. The liquid crystalline properties for all the samples and the swelling behavior of the crosslinked samples in acetone were investigated. In contrast with the hydroxypropyl chitosan, all the uncrosslinked cholesteryl-bearing samples farmed monotropic cholesteric phases with left-handed helicoidal structures and exhibited reflection colors over the full cholesteric range. This is the first report of a thermotropic cholesteric liquid crystalline chitosan derivative with reflection bands in the visible region. Both the optical pitches (λ$\_$m/'S) of CHPCT and CHPCTE decrease with temperature or with cholesteryl content at a given temperature. However, the λ$\_$m/ of CHPCT was larger than that of CHPCTE at the same temperature and at the same cholesteryl content. All the crosslinked samples did not display reflection colors, indicating that the cholesteric structure of CHPCTE significantly changes upon crosslinking. The two-dimentional anisotropic swelling characteristic of liquid crystalline networks was observed for all the crosslinked samples.