• 한국신재생에너지학회:학술대회논문집
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• 2011.05a
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• pp.113.2-113.2
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• 2011

Sn-Ag계 합금은 대표적인 무연 솔더 조성으로 전자제품의 실장 및 접합에 적용되어 왔으며, 태양전지 분야에서도 모듈의 전극과 bus바로 사용되는 등 다양한 분야에서 사용되고 있다. 그러나 최근 Ag 가격의 급격한 상승과 솔더 접합부의 신뢰성을 보다 향상시키고자 Ag의 함량을 줄이고 다원계 합금 조성의 무연 솔더 연구가 활발히 진행되고 있다. 본 실험에서는 기존의 연구 결과를 바탕으로 Sn-1.0Ag-0.5Cu-0.4In 4원계 무연솔더 조성에 Bi를 첨가하여 최적의 융점과 용융구간을 가지는 5원계 Sn-Ag-Cu-In-Bi 계 솔더 합금을 설계하였다. 이 설계된 합금은 기존의 유연 솔더인 Sn-Pb와 대표적인 무연 솔더인 Sn-3.5Ag와 각각의 특성을 비교 분석하였다. 젖음성을 평가하기 위하여 wetting balance tester를 이용하여 실험을 행하였고 Differential Scanning Calorimetry(DSC)를 분석하여 젖음 정도와 조성 분석 및 고상점과 액상점 등의 녹음 거동을 확인하였다. 또한 각각의 조성별 전단응력에 따른 파괴 거동을 분석하였다.

• Applied Biological Chemistry
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• v.34 no.4
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• pp.334-338
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• 1991

Synthesis of $(D-Phe^7\;-Leu^8)$ bradykinin and bradykinin by solid phase method using a new reaction vessel was carried out. Coupling was performed by dicyclohexylcarbodiimide. After cleavage with dried HBr the peptides were purified by high pressure liquied chromatography. Their purify was assayed by paper and thin layer chromatography, melting point and amino acid analysis. $(D-Phe^7\;-Leu^8)$ bradykinin and bradykinin were incubater in vitro endopeptidase $({\alpha}-chymotrysis)$ and exopeptidase(carboxypeptidase A, leucine aminopeptidase) in order to study the degradation pattern of peptides. $(D-Phe^7\;-Leu^8)$ bradykinin and bradykinin were rapidly degradated by ${\alpha}-chymotrypsin$ and carboxypeptidase A $(D-Phe^7\;-Leu^8)$ bradykinin and bradykinin coution$(D-Phe^7\;-Leu^8)$ bradykinin and bradykinin contain imino peptide bound from proline at N-terminal and therefore they were not attacted by leucine aminopeptidase.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.33 no.4
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• pp.41-46
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• 2005

In this paper, a new method for suppressing microwelding on the RF MEMS (Radio Frequency Microelectromechanical System) direct contact switches is introduced. Two kinds of refractory metals, tungsten and molybdenum were coated onto the contact point of the switches and the effect of the coating was examined. The changes in insertion loss and isolation at the switch were measured by using network analyzer and power loss was evaluated by power measurement. The results revealed that while tungsten and molybdenum showed higher contact resistance than gold in low input power range, they enhanced the power handling capability and reliability of the switches in high input power region.