• Composites Research
• /
• v.34 no.6
• /
• pp.357-372
• /
• 2021

The energy harvesting device is known to be promising as an alternative to solve the resource shortage caused by the depletion of petroleum resources. In order to overcome the limitations (environmental pollution and low mechanical properties) of piezoelectric elements capable of converting mechanical motion into electrical energy, many studies have been conducted on a polymer matrix-based composite piezoelectric energy harvesting device. In this paper, the output performance and related applications of the reported piezoelectric composites are reviewed based on the applied materials and processes. As for the piezoelectric fillers, zinc oxide, which is advantageous in terms of eco-friendliness, biocompatibility, and flexibility, as well as ceramic fillers based on lead zirconate titanate and barium titanate, were reviewed. The polymer matrix was classified into piezoelectric polymers composed of polyvinylidene fluoride and copolymers, and flexible polymers based on epoxy and polydimethylsiloxane, to discuss piezoelectric synergy of composite materials and improvement of piezoelectric output by high external force application, respectively. In addition, the effect of improving the conductivity or the mechanical properties of composite material by the application of a metal or carbon-based secondary filler on the output performance of the piezoelectric harvesting device was explained in terms of the structure of the composite material. Composite material-based piezoelectric harvesting devices, which can be applied to small electronic devices, smart sensors, and medicine with improved performance, can provide potential insights as a power source for wireless electronic devices expected to be encountered in future daily life.

• Transactions of the Korean Society of Mechanical Engineers A
• /
• v.36 no.12
• /
• pp.1563-1568
• /
• 2012

Printed electronics is a technology used for forming electronic circuits or devices, and it is used in the manufacture of many products such as RFID tags, solar cells, and flexible display panels with a much lower cost than in the case of semiconductor process technology. Web-guide-type printing such as roll-to-roll printing is a method used to produce printed electronic devices in a large volume. To commercialize such products, highly precise alignment between printed layers is required. In this study, a highly precise alignment system is proposed, and some experimental results are compared with those obtained using a laser surface vibrometer to illustrate the reliability of the proposed system. The robustness of the proposed system to web deformation is also considered experimentally.

• Journal of Adhesion and Interface
• /
• v.21 no.3
• /
• pp.107-112
• /
• 2020

Recently, the atomically thin transition-metal dichalcogenide (TMD) semiconductors have attracted much attention owing to their remarkable properties such as tunable bandgap with high carrier mobility, flexibility, transparency, etc. However, because these TMD materials have a significant drawback that they are easily degraded in an ambient environment, various attempts have been made to improve chemical stability. In this research article, I report a method to improve the air stability of WSe₂ one of the TMD materials via surface passivation with an h-BN insulator, and its application to field-effect transistors (FETs). With a modified hot pick-up transfer technique, a vertical heterostructure of h-BN/WSe₂ was successfully made, and then the structure was used to fabricate the top-gate bottom-contact FETs. The fabricated WSe₂-based FET exhibited not only excellent air stability, but also high hole mobility of 150 ㎠/Vs at room temperature, on/off current ratios up to 3×10⁶, and 192 mV/decade of subthreshold swing.

• Journal of the Korea Academia-Industrial cooperation Society
• /
• v.11 no.2
• /
• pp.443-448
• /
• 2010

Rapid advance in information technology requires high performance devices with compact size. Integrated multi-layer electronic element with different functions enables those compact devices to possess various performances and powerful capabilities. In mass production, the multi-layer electronic element is manufactured as a bulk type with a large number of parts for productivity. However, this may cause the electronic part to be damaged in the cutting process of the bulk elements to separate into each part. Therefore the cutting performance of multi-layer element bulk is playing an important role in the view of production efficiency. This study focuses on the cutting characteristics of multi-layer electronic elements. In order to increase the efficiency, the vibration cutting method was applied to the blade cutting machine. Flexure hinge structure, which is an physical amplifier of increasing displacement, was attached to the vibration cutting device for machining efficiency. The behaviors of flexure hinge were modeled with Lagrange equation and simulated with finite element method (FEM). Performance of hinge structure was verified by experimental modal analysis (EMA) for hinge structure to be tuned to the specific mode of vibrations. Cutting experiments of multi-layer elements were conducted with the proposed vibrating cutting module, and the characteristics was analyzed.

• Journal of the Korean Society for Precision Engineering
• /
• v.31 no.11
• /
• pp.975-979
• /
• 2014

Transparent conductive films (TCF) with excellent electrical properties and high mechanical flexibility have been widely studied because of their potential for application in optoelectronic devices such as light-emitting diodes, paper displays and organic solar cells. In this paper, we report on low-resistance and high-transparent TCF for flexible device applications. To fabricate a high-resolution roll imprinted TCF, the following steps were performed: the design and manufacture of an electroforming stamp mold, the fabrication of high-resolution roll imprinted on flexible film, the manufacture of Ag-nano paste which was filled into patterned film using a doctor blade process. Also, we was demonstrated with the successful application(ITO free organic photovoltaic) of the developed flexible TCF.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2015.08a
• /
• pp.238.1-238.1
• /
• 2015

2차원 탄소나노재료인 그래핀은 본연의 우수한 물성으로 인하여 전자소자, 에너지 저장매체, 유연성 전도막 등 다양한 분야로의 응용가능성이 제기되었다. 그러나 실제적인 응용을 위해서는 그래핀의 구조적인 결함을 최소화하며, 특성을 자유로이 제어하거나 향상시키는 공정의 개발이 필요하다. 일반적으로 화학적 도핑은 그래핀의 전기적 특성을 제어하는 효율적인 방법으로 알려져 있다. 화학적 도핑의 방법으로는 그래핀을 특정 가스 분위기에서 고온 열처리하거나 활성종들이 존재하는 플라즈마에 노출시킴으로써, 그래핀을 구성하는 탄소원자를 이종원자로 치환하거나 표면에 흡착시켜 기능화 된 그래핀을 얻는 방법 등이 제시되었다. 특히 플라즈마를 이용한 도핑방법은 저온에서 단시간의 처리로 효율적인 도핑이 가능하고, 인가전력, 처리시간 등의 플라즈마 변수를 변경하여 도핑정도를 수월하게 제어할 수 있다는 장점을 가지고 있다. 그러나 플라즈마 내에 존재하는 극성을 띄는 다양한 활성종들로 인하여 그래핀에 구조적인 결함을 형성하여 오히려 특성이 저하될 수 있어 이를 고려한 플라즈마 공정조건의 설정이 필수적이다. 따라서 본 연구에서는 플라즈마에 노출된 그래핀의 Raman 특성을 고찰함으로써 화학적 도핑과 구조적인 결함의 경계를 확립하고 구조결함의 형성을 최소화한 효율적인 도핑조건을 도출하였다. 고품질 그래핀은 물리적 박리법을 이용하여 300 nm 두께의 실리콘 산화막이 존재하는 실리콘 웨이퍼 위에 제작하였으며, 평행 평판형 직류 플라즈마 장치를 이용하여 전극의 위치, 인가전력, 처리시간을 변수로 암모니아(NH3) 플라즈마를 방전하여 그래핀의 Raman 특성변화를 관찰하였다. 그래핀의 구조적 결함 및 도핑은 라만 스펙트럼의 D, G, D', 2D밴드의 강도비와 G밴드의 위치와 반치폭(Full width at half maximum; FWHM)의 변화를 통해 확인하였다. 그 결과, 인가전력과 처리시간이 증가함에 따라 그래핀의 도핑레벨이 증가되고, 이후에는 도핑효과가 없어지고 결함의 정도가 상승하는 천이구역이 존재하며, 이를 넘어서는 너무 높은 인가적력의 처리는 그래핀에 결함을 형성하여 구조적인 붕괴를 야기함을 확인하였다.

• The Journal of the Korea institute of electronic communication sciences
• /
• v.9 no.5
• /
• pp.617-624
• /
• 2014

Recently, photovoltaic inverter is received attention in photovoltaic with introduction of feed-in tariff. However, this inverter has problems such as inability to respond flexible at climate change due to its opening, and decrease of efficiency and lifetime due to its abnormal operation. To solve the problem, we desire to develop the eco-inverter which has a temperature control to respond easily on the change of temperature, and use the sealed structure not to affect the environment. In addition, we derive the optimal position of cooling system which is placed inside of inverter to minimize the power consumption, and proposed the effective measure to improve the efficient of inverter by deciding the number of cooling system.

• Journal of the Microelectronics and Packaging Society
• /
• v.29 no.2
• /
• pp.121-127
• /
• 2022

Micro-LED is a light-emitting diode smaller than 100 ㎛ in size. It attracts much attention due to its superior performance, such as resolution, brightness, etc., and is considered for various applications like flexible display and VR/AR. Micro-LED display requires a mass transfer process to move micro-LED chips from a LED wafer to a target substrate. In this study, we proposed a vacuum chuck method as a mass transfer technique. The vacuum chuck was fabricated with MEMS technology and PDMS micro-mold process. The spin-coating approach using a dam structure successfully controlled the PDMS mold's thickness. The vacuum test using solder balls instead of micro-LED confirmed the vacuum chuck method as a mass transfer technique.

• Journal of the Korean Vacuum Society
• /
• v.8 no.4A
• /
• pp.445-449
• /
• 1999

We studied the properties of the InAs epitaxial layers grown of (100)-oriented GaAs ($2^{\circ}$tilted toward[011]) by molecular beam epitaxy. From DCX (double-crystal x0ray), the better crystal quality was shown in InAs epitaxial layers on about 2500$\AA$ GaAs epitaxial layers on GaAs, we obtained the high mobility of InAs epitaxy in As/In BEP ratio (1.2~2.0) from Hall effect measurement. The electron mobility increased as electron concentration increases, until Si cell temperature $960^{\circ}C$$(N_D=2.21\times10^{-17}\textrm{cm}^{-3})$. The mobility decreases as the Si cell temperature increases, at the temperature over $960^{\circ}C$. We obtained the high mobility (1.10$\times$104cm2/V.s) at Si electron concentration of $N_D=2.21\times10^{-17}\textrm{cm}^{-3}$.

• The Journal of the Korea institute of electronic communication sciences
• /
• v.17 no.2
• /
• pp.279-290
• /
• 2022

A superconducting fault current limiter(SFCL) is a power device that exploits superconducting transition to control currents and enhances the flexibility, stability and reliability of the power system within a few milliseconds. With a high phase transition speed, high critical current densities and little AC loss, high-temperature superconducting (HTS) wires are suitable for a resistive-type SFCL. However, HTS wires due to the lack of optimization research are rather inefficient to directly apply to a fault current limiter in terms of the design and capacity, for the existing method relied the characteristics. Therefore, in order to develop a suitable wire for an SFCL, it is necessary to enhance critical current uniformity, select optimal stabilizer materials and conducted research on the development of uniform stabilizer layering technology. The high temperature superconducting wires manufactured by this study get an average critical current of 804 A/12mm-width at the length of 710m; therefore, conducted research was able to secure economic performance by improving efficiency, reducing costs, and reducing size.