• Title/Summary/Keyword: 유리(Glass) 기판

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The Fluxless Wetting Properties of TSM-coated Glass Substrate to the Pb-free Solders (TSM(Top Surface Metallurgy)이 증착된 유리기판의 Pb-free 솔더에 대한 무플럭스 젖음 특성)

  • 홍순민;박재용;박창배;정재필;강춘식
    • Journal of the Microelectronics and Packaging Society
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    • v.7 no.2
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    • pp.47-53
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    • 2000
  • The fluxless wetting properties of TSM-coated glass substrate were evaluated by the wetting balance method. We could estimate the wettability of the TSM with new parameters obtained from the wetting balance test for one side-coated specimen. It was more effective in wetting to use Cu as a wetting layer and Au as a protection layer than to use Au itself as a wetting layer. The SnSb solder showed better wettability than SnAg, SnBi, and SnIn solders. The contact angle of the one side-coated glass substrate to the Pb-free solders could be calculated from the farce balance equation by measuring the static force and the tilt angle.

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Ultrasound-Aided Monolayer Assembly of Spherical Silica Nanobeads (초음파 방법을 이용한 실리카 나노비드의 단층 정렬에 관한 연구)

  • Yoon, Sang-Hee;Yoon, Seo Young;Lee, Jin Seok
    • Journal of the Korean Vacuum Society
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    • v.22 no.6
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    • pp.298-305
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    • 2013
  • Uniform silica nanobeads were synthesized by St$\ddot{o}$ber method and assembled in the form of monolayer on glass substrate using sonication method. Before the assembly of silica nanobeads, glass substrates were treated with molecular linkers, such as CP-TMS and PEI, and nanobeads were dispersed in toluene. In attachment test, SO (sonication without stacking) method and SS (sonnication with stacking) method was used and sonication time was controled. After the experiment, microbalance was use to measure deviation between before and after the attachment experiment then calculate percent of coverage. Minutely observe with SEM (Scanning Electron Microscopy) then select the most close-packed and monolayer assembled cover glass and calculate DOC (Degree of Coverage). In SO method, DOC increased very sharply and reach over 140 percent point, also got lots of multi-layer region. On the other hand, in SS method DOC increased slower than SO method but more close-packed and monolayer assembled.

Alignments of Reactive Mesogen Using Rubbed Glass Substrates (러빙한 유리 기판을 이용한 반응성 액정 배향)

  • Lee, Mongryong;Bae, Jin Woo;Kim, Anna;Yun, Hyeong Seuk;Song, Kigook
    • Polymer(Korea)
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    • v.39 no.1
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    • pp.174-179
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    • 2015
  • Alignments of photo-reactive mesogen were induced using bare glass substrates without a polymer alignment layer. It was found by using polarized FTIR spectroscopy, polarized microscopy, and birefringence measurement experiments that the reactive mesogen could be aligned along the rubbing direction although the glass substrate without an alignment layer was used. The induction mechanism of the rubbed bare glass is ascribed to that polymers from rubbing clothes are coated on the glass substrate along the rubbing direction and lead the alignment of liquid crystals through intermolecular interactions.

Low dielectric mullite/glass composite (저 유전성 Mullite/Glass 복합체에 관한 연구)

  • 백용혁;김주영;강선명
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.9 no.6
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    • pp.606-611
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    • 1999
  • Low dielectric Mullite/Glass composites for substrates were fabricated by mullite by synthesized from kaolin and alumina, and borosilicate glass. By the liquid-sintering, the composites were densified at low sintering temperature in air, allowing confiring with Cu, Ag, Au and Ag-Pd. Crystallization of the borosilicate glass was not occurred. The mullite/50 wt% glass composites fired between 950 and $1100^{\circ}C$ showed good properties for high-performed substrate, such as low dielectric constant (5.2~5.4, at 1MHz), low coefficient of thermal expansion (5.3~$5.7{\times}10^{-6}{\cdot}^0C^{-1}$), and bending strength of 130 MPa.

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Fracture Behavior of Glass/Resin/Glass Sandwich Structures with Different Resin Thicknesses (서로 다른 레진 두께를 갖는 유리/레진/유리샌드위치 구조의 파괴거동)

  • Park, Jae-Hong;Lee, Eu-Gene;Kim, Tae-Woo;Yim, Hong-Jae;Lee, Kee-Sung
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.34 no.12
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    • pp.1849-1856
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    • 2010
  • Glass/resin/glass laminate structures are used in the automobile, biological, and display industries. The sandwich structures are used in the micro/nanoimprint process to fabricate a variety of functional components and devices in fields such as display, optics, MEMS, and bioindustry. In the process, micrometer- or nanometer-scale patterns are transferred onto the substrate using UV curing resins. The demodling process has an important impact on productivity. In this study, we investigated the fracture behavior of glass/resin/glass laminates fabricated via UV curing. We performed measurements of the adhesion force and the interfacial energy between the mold and resin materials using the four-point flexural test. The bending-test measurements and the load-displacement curves of the laminates indicate that the fracture behavior is influenced by the interfacial energy between the mold and resin and the resin thickness.

Interfacial Defects in $SiO_2$-Glass Bond During VCR Head Fabrication (VCR 헤드 제조시 $SiO_2$박막과 유리의 계면 결함)

  • Yun, Neung-Gu;Hwang, Jae-Ung;Go, Gyeong-Hyeon;An, Jae-Hwan;Je, Hae-Jun;Hong, Guk-Seon
    • Korean Journal of Materials Research
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    • v.4 no.1
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    • pp.31-36
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    • 1994
  • The bonding behavior of $SiO_{2}$ thin film and glass during VCR head fabrication was investigated, varying the surface roughness of substrate and the sputtering parameter. Insufficient fillings of grooves In the $SiO_{2}$ film with glass was postulated to give rise to the generation of bubble in the glass. The surface roughness of $SiO_{2}$ film was found to depend on that of substrate. The lower the deposition rate, the smoother the surface of film. The bubble free glass after bonding could be obtained using substrate polished with 0.05$\mu\textrm{m}$ $Al_2O_3$ powder under the sputtering condition of 10% oxygen pressure.

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Thermal Deformation of Glass Backplane during Flash Lamp Crystallization Process of Amorphous Silicon (플래시 램프를 이용한 비정질 실리콘 결정화 공정에서의 유리기판 열변형)

  • Kim, Dong-Hyun;Kim, Byung-Kuk;Kim, Hyoung-June;Chung, Ha-Seung;Park, Seung-Ho
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.36 no.10
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    • pp.1025-1032
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    • 2012
  • The flash lamp annealing (FLA) process has been considered highly promising for manufacturing low-temperature polysilicon on large-scale backplanes. Based on a theoretical estimation, this study clarifies the critical mechanisms of glass backplane deformation during the FLA process. A simulation using a commercial FEM code with viscoelastic models shows that the local region, whose temperature is larger than the glass softening point, undergoes permanent structural shrinkage owing to stress relaxation. For larger backplanes (4th Gen), structural shrinkages and gravitational deflection are critical to deformation in the FLA process, resulting in an "M" shape; in smaller backplanes (0th Gen), the latter is negligible, resulting in a "U" shape.

Self Assembled Patterns of Ag Using Hydrophobic and Hydrophilic Surface Characteristics of Glass (유리기판의 친수.소수 상태 변화를 이용한 자기정렬 Ag Pattern 형성 연구)

  • Choo Byoung-Kwon;Choi Jung-Su;Kim Gun-Jeong;Lee Sun-Hee;Park Kyu-Cang;Jang Jin
    • Journal of the Korean Vacuum Society
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    • v.15 no.4
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    • pp.354-359
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    • 2006
  • Recently, the interest in lithography without photo exposure has been increased compare to the conventional photolithography in nano meter and micrometer size patterning area. We studied a self aligned dipping of Ag solution through micro contact printing (${\mu}-CP$) with octadecyltrichlorosilane (OTS) treated polydimethylsiloxane (PDMS) soft mold. The OTS monolayer on the patterned PDMS was formed by dipping it into OTS solution. We transferred the OTS monolayer from PDMS mold to the glass. The OTS monolayer changed the surface energy from hydrophilic surface to hydrophobic surface, And then we made self aligned Ag solution patterns just after dipping the substrate, using adhesion difference of Ag solution between OTS treated hydrophobic area and non-OTS treated hydrophilic area. We finally get the Ag patterns through only dip-coating after the ${\mu}-CP$ process. And we observed surface energies on the glass substrate through the contact angle measurements as time goes on.

고투과성과 방오 기능을 갖는 태양전지 보호용 유리기판 제작

  • Sin, Ju-Hyeon;Han, Gang-Su;Lee, Heon
    • Proceedings of the Materials Research Society of Korea Conference
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    • 2009.05a
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    • pp.55.1-55.1
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    • 2009
  • 나노 임프린트 리소그래피 기술은 고집적된 나노 구조물을 경제적으로 형성시킬 수 있는 유망한 차세대 리소그래피 기술 중 하나로써 광학 소자 뿐만 아니라 반도체, 디스플레이, 바이오 소자 등 다양한 분야에 적용이 가능하다. 본 연구에서는 태양전지 보호층으로 사용되는 유리 기판의 투과도 향상을 위해 나노 크기의 패턴을 형성하여 표면 반사를 최소화 하였으며, 보호층의 유지보수 부담을 줄이기 위해 패턴 표면에 방오 기능을 갖는 hydrophobic SAM(Self Assembled Mono-layer)을 형성하였다. 또한, SAM coated nano-sized pattern 형성을 위해 사용 된 $SiO_2$ 증착층과 SAM이 투과도에 끼치는 영향을 확인하기 위하여 bare glass, $SiO_2$ deposited glass, SAM coated glass 그리고 SAM/$SiO_2$ coated glass를 제작하였으며, 각각의 투과도를 측정하여 비교 분석 하였다. 투과도를 측정하기 위해 UV-Vis spectrophotometer를 사용하였으며, 방오 기능을 측정하기 위해 접촉각 측정장치를 사용하였다. 접촉각의 측정을 통해 이형처리(SAM coating)를 한 기판 표면이 소수성으로 바뀌어 물이나 먼지가 잘 묻지 않게 되는 것을 확인하였다.

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Plasma Surface Modification of Glass Fiber and Fabrication of the Glass Fiber/Fluoro-Polymer Composite (유리섬유의 플라즈마 표면개질과 유리섬유/불소고분자 복합재료의 형성)

  • 이승구;박영민;최성신;김동철;주창환
    • Proceedings of the Korean Fiber Society Conference
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    • 2002.04a
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    • pp.485-488
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    • 2002
  • 최근 산업용 유리섬유는 고부가가치 응용분야로 대형 막구조(membrane structure)와 의공학 부품, 인쇄회로기판 등에 응용되고 있으며, 광통신의 주체인 광섬유로 활용되며 점차 그 용도를 넓혀가고 있다. 특히, 근래에 관심을 모으는 유리섬유 복합재료를 이용한 대형 막구조물은 경제성과 건축의 용이성 및 신속성 면에서 기존 건축구조보다 유리하고, 내구성도 우수하기 때문에 그 활용이 증가하고 있다. (중략)

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