• Transactions of the Korean Society of Mechanical Engineers A
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• v.38 no.7
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• pp.809-815
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• 2014

The induction heating bending process, which has been recently applied to nuclear piping, can generate residual stresses due to thermomechanical mechanism during the process. This residual stress is one of the crack driving forces that have important effects on crack initiation and propagation. However, previous studies have focused only on geometric shape variations such as the change in thickness and ovality. Moreover, very few studies are available on the effects of process variables on residual stresses. This study investigated the effects of process variables on the residual stress distributions of induction heating bended austenitic stainless steel (316 series) piping using parametric finite element analysis. The results indicated that the heat generation rate and feed velocity have significant effects on the residual stresses whereas the moment and bending angle have insignificant effects.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.2
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• pp.89-94
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• 2021

The mechanical reliability of flexible devices has become a major concern on their commercialization, where the importance of reliable bonding is highlighted. In terms of component materials' properties, it is important to consider thermal damage of polymer substrates that occupy large area of the flexible device. Therefore, room temperature bonding process is highly advantageous for implementing flexible device assemblies with mechanical reliability. Conventional epoxy resins for the bonding still require curing at high temperatures. Even after the curing procedure, the bonding joint loses flexibility and exhibits poor fatigue durability. To solve this problems, low-temperature and adhesive-free bonding are required. In this work, we develop a room temperature bonding process for polymer substrates using carbon nanotube heated by microwave irradiations. After depositing multiple-wall carbon nanotubes (MWNTs) on PET polymer substrates, they are heated locally with by microwave while the entire bonding specimen maintains room temperature and the heating induces mechanical entanglement of CNT-PET. The room temperature bonding was conducted for a PET/CNT/PET specimen at 600 watt of microwave power for 10 seconds. Thickness of the CNT bonding joint was very thin that it obtains flexibility as well. In order to evaluate the mechanical reliability of the joint specimen, we performed lap shear test, three-point bending test, and dynamic bending test, and confirmed excellent joint strength, flexibility, and bending durability from each test.