• Title/Summary/Keyword: 우선 배향성

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The Properties of GaN Grown by BVPE Method on the Si(111) Substrate with Pre-deposited Al Layer (Al 박막이 증착 된 Si(111) 기판 위에 HVPE 방법으로 성장한 GaN의 특성)

  • Shin Dae Hyun;Baek Shin Young;Lee Chang Min;Yi Sam Nyung;Kang Nam Lyong;Park Seoung Hwan
    • Journal of the Korean Vacuum Society
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    • v.14 no.4
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    • pp.201-206
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    • 2005
  • In this work, we tried to improve the fabrication process in HVPE (Hydride Vapor Phase Epitaxy) system by using Si(111) substrate with pre-deposited Al layer. PL measurements was done for samples with and without pre-deposited Al on Si and it was also examined the dependence of the optical characteristic properties on AlN buffer thickness for GaN/AIN/Al/Si. A sample with thin Al nucleation layer on Si substrate reveals a better optical property than the other. And it suggests that the thickness for AlN buffer layer with thin Al nucleation layer on Si(111) substrate is most proper about $260{\AA}$ to grow GaN in HVPE system. The surface morphology of GaN clearly shows the hexagonal crystallization. The XRD pattern showed strong peak at GaN{0001} direction.

Properties of Yttrium Manganates with MFS Structure Fabricated on Various Substates (MFS 구조로 적층된 Yttrium Manganates의 기판 변화에 따른 특성 연구)

  • 강승구
    • Journal of the Korean Ceramic Society
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    • v.40 no.2
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    • pp.206-211
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    • 2003
  • Effects of substrates and buffer layer upon the formation of crystalline phases and ferroelectricity of $YMnO_3$ thin films were investigated. The hexagonal $YMnO_3$ was easily formed on Si(100) while the mixed phases, hexagonal and orthorhombic $YMnO_3$, on $Pt(111)/TiO_2/SiO_2/Si$ substrate. When the $Y_2O_3$ buffer layer of 70 nm thick was inserted between the substrates and the $YMnO_3,$ the c-axis oriented hexagonal single phase formed on both substrates, Si(100) and $Pt(111)/TiO_2/SiO_2/Si$. The leakage current density of the hexagonal $YMnO_3$ thin films was lower than that consisting of mixed phases, hexagonal and orthorhombic. Furthermore the hexagonal $YMnO_3$ with c-axis preferred orientation showed the lowest leakage current density. The remnant polarization from a P-E hysteresis curve for the $YMnO_3$ formed on Si(100) was 0.14 without buffer layer and $0.24_{mu}C/cm^2$ for that with buffer layer. For the $Pt(111)/TiO_3/SiO_3/Si$ substrates, the specimen without $Y_2O_3$buffer layer did not show the hysteresis curve, while the buffer-layered has the remnant polarization of $1.14_{mu}C/cm^2$. It was concluded that the leakage current density and the ferroelectricity for the $YMnO_3$ thin films could be controlled by varying crystalline phases and their preferred orientation which depend on the kind of substrates and whether the $Y_2O_3$buffer layer exist or not.

Ferroelectric Properties of ErMnO3 Thin Film Prepared by Sol-gel Method (졸겔법으로 제조한 ErMnO3 박막의 강유전 특성)

  • Kim, Yoo-Taek;Kim, Eung-Soo;Chae, Jung-Hoon;Ryu, Jae-Ho
    • Journal of the Korean Ceramic Society
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    • v.39 no.9
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    • pp.829-834
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    • 2002
  • Ferroelectric properties of $ErMnO_3$ thin films deposited on Si(100) substrate using Sol-gel process with metal salts were investigated. $ErMnO_3$ thin films with a (001) preferred orientation were crystallized at 800$^{\circ}C$. The $ErMnO_3$ thin film post-annealed at 800$^{\circ}C$ for 1 h showed the dielectric constant(k) of 26 and the dielectric loss(tan ${\delta}$) of 0.032 at the frequency range from 1 to 100 KHz. The grain size of $ErMnO_3$ thin film post-annealed at 800 for 1 h was 10∼30 nm. The remanent polarization($P_r$) of the $ErMnO_3$ thin films increased with increasing (001) preferred orientation. The $ErMnO_3$ thin films post-annealed at 800$^{\circ}C$ for 1 h showed the remanent polarization($P_r$) of 400 nC/$cm^2$, with the increase of post-annealing time at 800$^{\circ}C$, the coercive field($E_c$) of thin films was lowered because the dense and homogeneous thin films were obtained.

STM Study of Self Assembled Monolayer Formed from Binary Mixtures of Substituted Alkyl Chains (치환된 알킬 사슬 혼합물의 자기조립 단분자막 구조지 STM 연구)

  • Son S.B.;Lee H.;Jeon I.C.;Hahn J.R.
    • Journal of the Korean Vacuum Society
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    • v.15 no.2
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    • pp.145-151
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    • 2006
  • The molecular assembly of p-iodo-phenyl octadecyl ether (I-POE), p-iodo-phenyl docosyl ether (I-PDE) and a binary mixture of these two molecules on graphite has been studied using a scanning tunneling microscope. Each molecular system self-assembles on the graphite surface to form a stable monolayer with a head-to-tail configuration. For the binary system, the I-POE and I-PDE molecules do not mix on the surface, preferring instead to form isolated monolayer domains. Here, the I-POE molecules are preferentially adsorbed on the graphite surface, due to the effects of alkyl chain length and the functional group on the monolayer structure.

A Study on the Magnetic Properties and Microstructure of CoCr Thin Films Growing under Magnetic Field (자장하에서 성장한 CoCr박막의 자기적 특성 및 미세구조에 관한 연구)

  • Lee, Yu-Gi;Jang, Pyeong-U;Lee, Taek-Dong;Lee, Gye-Won
    • Korean Journal of Materials Research
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    • v.4 no.5
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    • pp.581-589
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    • 1994
  • Magnetic properties and microstructures of the $Co_{83}Cr_{17}$ films growing under the applied magnetic field were studied. In comparison, those of the films growing without magnetic field were also studied. Magnetic field does not affect saturation magnetization and in-plane coercivity of the films. On the contrary perpendicular coercivity and effective perpendicular anisotropy field decreased. Grain size and the thickness of the so-called transition layer were not affected and the C-axis alignment of the films was slightly deteriorated due to magnetic field. Also, microstructures of the sputtered films showed larger grain sizes of strong (002) preferred orientation for thicker film specimens independent of applied magnetic field.

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RF Magnetron Co-sputtering법으로 형성된 GZO & IGZO 박막의 불순물 농도에 따른 광학적 전기적 특성 연구

  • Hwang, Chang-Su;Park, In-Cheol;Kim, Hong-Bae
    • Proceedings of the Korean Vacuum Society Conference
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    • 2011.02a
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    • pp.85-85
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    • 2011
  • RF magnetron co-sputtering을 이용하여 RF power 및 공정 압력에 따라 GZO 및 IGZO 박막을 유리기판 위에 제작하고 투명전극으로 구조적, 광학적, 전기적 특성을 조사하였다. 박막 증착 조건의 초기 압력은 $1.0{\times}10^{-6}Torr$, 증착온도는 상온으로 고정하였으며 기판은 Corning 1737 유리기판을 사용하였다. 소결된 타겟으로 ZnO, $In_2O_3$$Ga_2O_3$을 이용하였으며, 각각의 타겟은 독립 된 RF파워를 변화시키며 투명전극의 성분비를 조절하였으며, 증착 압력은 10 m에서 100 mTorr까지, 기판과의 거리는 25 mm에서 65 mm까지 변화시키며 박막을 제작하였다. 유리기판 위에 불순물이 첨가된 모든 ZnO 박막에서 (002) 면의 우선배향성이 관찰되었고, 3.4eV에서 3.5eV 정도의 광학적 밴드갭을 가지며 80% 이상의 투과율을 나타내었다. GZO 박막의 경우 증착 조건에 따라 투명전극에 요구되는 $5*10^{-3}{\Omega}-cm$ 이하의 전기적특성을 가짐을 보였으며, gallium 성분이 0%에서 6%로 증가함에 따라 3.3eV에서 3.5eV로 blue-shift하였으며, 비저항은 0.02에서 $0.005{\Omega}cm$로 낮아졌으며 이동도는 $4.7cm^2V^{-1}s^{-1}$에서 $2.7cm^2V^{-1}s^{-1}$로 보이며 GZO 물질이 투명전극으로서 기존의 ITO 물질 대체 가능성을 확인하였다. IGZO 박막은 In과 Ga의 함량에 따라 저항률의 변화가 크게 나타났으며, In의 함량이 많을수록 이동도, 캐리어 농도의 증가로 저항률은 감소하였다.

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금 나노입자를 이용한 단일벽 탄소나노튜브의 합성

  • Lee, Seung-Hwan;Jeong, Gu-Hwan
    • Proceedings of the Korean Vacuum Society Conference
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    • 2011.08a
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    • pp.355-355
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    • 2011
  • 이론적으로 단일벽 탄소나노튜브(SWNT)는 무산란 전도가 가능하여 실리콘을 대체할 차세대 나노소자의 기본소재로서 많은 각광을 받아왔다. 이러한 SWNT의 전기전자적 특성을 좌우하는 주요인자로는 직경과 비틀림도(chirality)가 있으며, 이를 제어하기 위한 많은 방법들이 제시되어왔다. 특히, SWNT 합성 시 필요한 촉매 나노입자의 크기와 튜브직경과의 연관성이 제기된 후부터, 합성단계에서 촉매 나노입자의 형태(또는 크기)를 제어함으로써 SWNT의 직경을 제어하고자 하는 직접적인 방법들도 주요방법의 한 축으로 이어지고 있다. 한편, SWNT의 합성촉매로는 철, 코발트, 니켈 등의 전이금속이 주로 사용되어 왔으나, 최근에는 금, 은, 루테늄, 팔라듐, 백금 등의 귀금속에서부터 다양한 금속산화물 나노입자에 이르기까지 그 범위가 확장되었다. 본 연구에서는, 촉매 나노입자의 크기제어를 통하여 SWNT의 직경을 제어할 목적으로, 전이금속에 비해 상대적으로 융점이 낮아 비교적 낮은 온도의 열처리를 통해서도 입자의 크기를 제어할 수 있는 금 나노입자를 선정하여 SWNT의 합성거동을 살펴보았다. 합성은 메탄을 원료가스로 하는 CVD방법을 이용하였고, 합성되는 SWNT의 다발화(bundling) 등을 방지하기 위하여 수평배향 성장을 도모하였으며, 이를 위하여 퀄츠 웨이퍼를 사용하였다. 우선, 콜로이드상인 금 나노입자의 스핀코팅 조건을 최적화하여 퀄츠 위에 단분산(monodispersion) 된 금 나노입자를 얻었으며, 열처리 온도 및 시간의 제어를 통하여, 1~5 nm 범위 내에서 특정 직경을 갖는 금 나노입자를 얻는 것이 가능하게 되었다. 합성 후 금 나노입자의 크기와 합성된 SWNT 직경과의 관계를 면밀히 조사한 결과, 튜브보다 나노입자의 크기가 약간 큰 것을 확인할 수 있었으며, 금 나노입자의 크기에 따라 SWNT의 합성효율이 크게 좌우되는 것을 확인하였다.

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The Evolution of Preferred Orientation and Morphology of NiO Thin Films under Variation of Plasma gas and RF Sputtering Power (플라즈마 가스와 RF 파워에 따른 NiO 박막의 우선배향성 및 표면형상 변화)

  • Ryu Hyun-Wook;Choi Gwang-Ryo;Noh Whyo-Sup;Park Yong-Ju;Kwon Yong;Park Jin-Seong
    • Korean Journal of Materials Research
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    • v.14 no.2
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    • pp.121-125
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    • 2004
  • Nickel oxide (NiO) thin films were deposited on Si(100) substrates at room temperature by RF magnetron sputtering from a NiO target. The effects of plasma gas and RF power on the crystallographic orientation and surface morphology of the NiO films were investigated. X-ray diffraction (XRD), field emission scanning electron microscopy (FE-SEM) and atomic force microscopy (AFM) were employed to characterize the deposited film. It was found that the type of plasma gases affected the crystallographic orientation, deposition rate, surface morphology, and crystallinity of NiO films. Highly crystalline NiO films with (100) orientation were obtained when it was deposited under Ar atmosphere. On the other hand, (l11)-oriented NiO films with poor crystallinity were deposited in $O_2$. Also, the increase in RF power resulted in not only higher deposition rate, larger grain size, and rougher surface but also higher crystallinity of NiO films.

A Study of carrier gas and ligand addition effect on MOCVD Cu film deposition (운반기체와 Ligand의 첨가가 MOCVD Cu 증착에 미치는 영향에 관한 연구)

  • 최정환;변인재;양희정;이원희;이재갑
    • Journal of the Korean Vacuum Society
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    • v.9 no.3
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    • pp.197-206
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    • 2000
  • The deposition characteristics of MOCVD Cu using the (hfac)Cu(1,1-COD)(1,1,1,5,5,5-hexafluoro-2,4-pentadionato Cu(I) 1,5-cyclooctadine) have been investigated in terms of the effects of carrier gas such as hydrogen and argon as well as the effects of H(hfac) ligand addition. MOCVD Cu using a hydrogen carrier gas led to a higher deposition rate and lower resistivity than an argon carrier gas system. The improvement in the surface roughness of the MOCVD Cu films and the (111) preferred orientation texture was obtained by using a hydrogen carrier gas. However, the adhesion characteristics of the films showed relatively weaker compared to the Ar carrier gas system, probably due to the larger amount of F content in the films, which was confirmed by the AES analyses. When an additional H(hfac) ligand was added, the deposition rate was significantly enhanced in the case of an argon + H(hfac) carrier gas system while significant change in the deposition rate of MOCVD Cu was not observed in the case of the hydrogen carrier gas system. However, the addition of H(hfac) in both carrier gases led to lowering the resistivity of the MOCVD Cu films. In conclusion, this paper suggests the deposition mechanism of MOCVD Cu and is expected to contribute to the enhancement of smooth Cu films with a low resistivity by manipulating the deposition conditions such as the carrier gas and addition of H(hfac) ligand.

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Microstructural ananalysis of AlN thin films on Si substrate grown by plasma assisted molecular beam epitaxy (RAMBE를 사용하여 Si 기판 위에 성장된 AIN 박막의 결정성 분석)

  • 홍성의;한기평;백문철;조경익;윤순길
    • Journal of the Korean Vacuum Society
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    • v.10 no.1
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    • pp.22-26
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    • 2001
  • Microstructures of AlN thin films on Si substrates grown by plasma assisted molecular beam epitaxy were analyzed with various growth temperatures and substrate orientations. Reflection high energy electron diffraction (RHEED) patterns were checked for the in-situ monitoring of the growth condition. X-ray diffraction(XRD), double crystal X-ray diffraction (DCXD), and transmission electron microscopy/diffraction (TEM/TED) techniques were employed to characterize the microstructure of the films after growth. On Si(100) sub-strates, AlN thin films were grown mostly along the hexagonal c-axis orientation at temperature higher than $850^{\circ}C$. On the other hand the AlN films on Si(111) were epitaxially grown with directional coherencies in AlN(0001)/Si(111), AlN(1100)/Si(110), and AlN(1120)/Si(112). The microstructure of AlN thin films on Si(111) substrates, with a full width at half maximum of almost 3000 arcsec at 2$\theta$=$36.2^{\circ}$, showed that the single crystal films were grown, even if they includ a lot of crystal defects such as dislocations and stacking faults.

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