• Title/Summary/Keyword: 우선배향

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ZnO Film Deposition on Aluminum Bottom Electrode for FBAR Filter Applications and Effects of Deposition Temperature on ZnO Crystal Growth (FBAR 필터 응용을 위한 Al 하부전극 상에서 ZnO 박막 증착 및 온도가 ZnO 결정의 성장에 미치는 영향)

  • ;;;Mai Linh
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.7 no.2
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    • pp.255-262
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    • 2003
  • In this paper, an investigation on the ZnO film deposition using radio-frequency magnetic sputtering techniques on aluminum bottom electrode for film bulk acoustic wave resonator (FBAR) filter applications and the temperature effects on the ZnO film growth is presented. The investigation on how much impact the actual process temperature may have on the crystal growth is more meaningful if it is considered that the piezoelectricity property of ZnO films plays a dominant role in determining the resonance characteristics of FBAR devices and the piezoelectricity is determined by the degree of the c-axis preferred orientation of the deposited ZnO films. In this experiment, it was found that the growth of ZnO crystals has a strong dependence on the deposition temperature ranged from room temperature to $350^{\circ}C$ regardless of the RF powers applied and there exist 3 temperature regions divided by 2 critical temperatures according to the degree of the c-axis preferred orientation. Overall, below $200^{\circ}C$, ZnO deposition results in columnar grains with a highly preferred c-axis orientation. With this ZnO film, a multilayered FBAR structure could be realized successfully.

Magnetic Properties of CrO2 Thin Films Deposited by Thermal Deposition (열분해법으로 형성된 산화크롬 박막의 자기적 특성)

  • Choi, Hyun-Ju;Lim, Dae-Soon;Lee, Jeon-Kook
    • Journal of the Korean Ceramic Society
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    • v.41 no.9
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    • pp.653-656
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    • 2004
  • We report the magnetic properties, microstructures, and crystal orientations of the CrO$_2$ thin films on TiO$_2$ single crystals. CrO$_2$ thin films were deposited by thermal decompositions with CrO$_3$ source materials. The microstructure of (110) oriented CrO$_2$ thin films deposited on (110) TiO$_2$ single crystals were uniform. As the oxygen flow rates increased, the resistivity, coercive field, and remnant magnetization of the CrO$_2$ thin films on TiO$_2$ single crystals decreased.

The Growth of Pt(200) Thin Films on Si Substrate by DC Magnetron Sputtering (Si 기판상에 DC 마그네트론 스퍼터링방식에 의한 Pt(200) 박막의 배향성장)

  • Jang, Ji-Geun;Kim, Min-Yeong;Park, Yong-Ik;Jang, Ho-Jeong
    • Korean Journal of Materials Research
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    • v.9 no.3
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    • pp.229-233
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    • 1999
  • DC마그네트론 스퍼터링 방식으로 $Ti/SiO_2$/Si 구조 위에 Pt(200) 박막을 배향 성장시키기 위해 증착조건(스퍼터링 가스의 종류와 압력, 기판의 온도)과 후속열처리(RTA, Furnace annealing)에 따른 Pt 박막의 전기, 결정학적 특성을 조사하였다. 실험결과, 20mTorr의 Ar+O$_2$(20%)의 혼합가스 분위기에서 기판온도를 $500^{\circ}C$로 유지하여 Pt박막을 증착하고$ 600^{\circ}C$에서 30초간 급속 열처리를 실시한 경우, 90% 이상의 결정 배항도를 갖는 Pt(200) 박막을 제작할 수 있었다. 제작된 Pt(200) 박막은 $30~40\mu$Ω.cm의 낮은 전기저항율과 우수한 열적 안정성을 나타내었으며$ 600^{\circ}C$의 고온에서 장시간 열처리를 실시하여도 전기저항율이나 우선 배향성의 변화, 박막내 미세 결함 및 열적응집현상 등이 발생되지 않았다.

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The C-Axis Preferred Orientation Characteristic of AIN Thin Film as Sputtering parameter of Presputtering (Presputtering 공정변수에 따른 AIN 박막의 c축 배향특성)

  • 박영순;김덕규;소병문;박춘배
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2000.11a
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    • pp.246-250
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    • 2000
  • Reactive radio frequency (RF)magnetron sputter has been used to deposit AlN thin film on a Si substrate. (002)Preferred orientation of AlN thin film has been obtained at low sputtering pressure and high $\textrm{N}_2$ concentration. Also it has been shown that properties of AlN thin film are affected by presputtering time. As presputtering time increased aluminum and nitride concentration of AlN thin film decreased. But oxygen concentration and grain size increased. The good preferred orientation was shown with the short presputtering time.

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Orientation Characteristics of AIN Thin Film using RF Magnetron Sputtering wish Incident Angle (입사각을 가진 RF 마그네트론 스퍼터링법으로 증착한 AIN 박막의 배향 특성)

  • 박영순;김덕규;송민종;박춘배
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2000.07a
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    • pp.395-398
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    • 2000
  • Reactive radio frequency (RF)magnetron sputter with incident angle has been used to deposit AlN thin film on a crystalline Si substrate. (002)Preferred orientation of AlN thin film has been obtained at low sputtering pressure. Also it has been shown that depostion rate of AIN thin film is affected by fraction Ar and $N_2$ partial pressure. But substrate temperature didn't affect depostion rate of AIN thin film . As sputtering pressure increased preferred orientation degraded. The internal stress changed from tensile stress to compressive stress as fraction of $N_2$ partial pressure increased. At low nitrogen partial pressure cermet$^{[1]}$ AIN thin film is obtained.

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Effect of $Ar/H_2$ Mixed Gas Sputtering on the Exchange Coupling of NiFe/WeMn Interface (스퍼터링 가스내 수소첨가에 의한 NiFe/FeMn의 교환결합력 향상에 관한 연구)

  • 이성래;박병준;김성훈;김영근
    • Journal of the Korean Magnetics Society
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    • v.11 no.4
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    • pp.146-150
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    • 2001
  • The effect of H$_2$ content in Ar sputtering gas on exchange coupling field(H$_{ex}$) for NiFe/FeMn interface was studied. When NiFe layer of Si(100)/Ta(50 $\AA$)/NiFe(60 $\AA$)/FeMn(250 $\AA$)Ta(50 $\AA$) was deposited at 8% H$_2$ in sputtering gas, the maximum exchange coupling field(H$_{ex}$) and minimum coercivity(H$_{c}$) were obtained. When Si(100)/Ta(50 $\AA$)/NiFe(60 $\AA$)/FeMn(250 $\AA$)/NiFe(70 $\AA$)/Ta(50 $\AA$) was deposited at 5% H$_2$ in sputtering gas, the maximum exchange coupling field(H$_{ex}$) of 148 Oe was obtained. The (111) preferred orientation and grain size of underlayer NiFe were increased and the internal stress was reduced by H$_2$ in sputtering gas. And the (111) preferred orientation and grain size of FeMn layer were also increased.d.ased.

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Preparation of tetragonal phase L10 FePt thin films with H2 annealing atmosphere (수소 분위기 중 열처리법을 이용한 고자기이방성 L10 FePt 박막 제작)

  • Kong, Sok-Hyun;Kim, Kyung-Hwan
    • Journal of the Korean Vacuum Society
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    • v.16 no.5
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    • pp.343-347
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    • 2007
  • Fe thin films exhibited (100) preferential orientation when they were deposited at low deposition rate of $0.1{\AA}/s$ on glass substrates by using facing target sputtering system. The (100) oriented Fe layer induces (100) orientation of Pt layer deposited on it owing to hetero-epitaxial growth. After annealing at $600^{\circ}C$ in $H_2$ atmosphere, FePt films exhibited f.c.t. (001) texture in the whole film caused by inter-diffusion between atoms. We have also confirmed that the homogeneously inter-diffused compositional modulation in the film after the annealing process. Furthermore, annealing process in $Ar+H_2$ atmosphere at $400^{\circ}C$ during Pt deposition was effective for attaining Pt (100) texture. The annealing process during Pt deposition also induced in low annealing temperature and decreased annealing time for attaining the FePt f.c.t. (001) structure.

Control of a- and c-plane Preferential Orientations of p-type CuCrO2 Thin Films

  • Kim, Se-Yun;Seong, Sang-Yun;Jo, Gwang-Min;Hong, Hyo-Gi;Kim, Jeong-Ju;Lee, Jun-Hyeong;Heo, Yeong-U
    • Proceedings of the Korean Vacuum Society Conference
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    • 2011.02a
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    • pp.119-120
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    • 2011
  • Kawazoe는 1997년 p-type TOS를 만들기 위해서는 3가지가 충족되어야 한다고 언급한바 있다. 첫 번째, 가시광영역에서 투명하기 위해서 cation의 d10s0이 가득 차야 한다. 가득 차지 않은 d10 shell은 광 흡수가 가능하여 투과도를 떨어뜨린다. N-type을 예로 들어 ZnO, TiO, In2O3가 각각 Zn2+, Ti4+, In3+가 되어 d shell을 가득 차게 만드는 것을 볼 수 있다. 두 번째, cation d10s0 shell은 산소의 2p shell과 overlap 되어야 한다. 이 valence band는 홀 전도를 더욱 좋게 한다. 예를 들어 Cu1+(3d), Ag1+(4d)가 해당한다. 세 번째로, 양이온과 산소간의 공유결합을 강하게 하기 위해서 결정학적 구조는 매우 중요하다. Delafossite 구조는 산소가 pseudo-tetrahedral 구조로서 공유결합에 유리하다. 이러한 환경은 O2- (2p6)을 형성하고 홀의 이동도를 증가시킨다. 예를 들어 Cu2O의 경우 앞의 2가지를 만족시키지만 광학적 특성에서 좋지 않다. 그 이유가 3번째 언급한 결정학적인 요인에 있다. 결정 계의 환경은 Cu2O를 따라가면서 3차원적인 연결을 2차원적으로 변형된 delafossite 구조에서는 quantum well이 형성되어 band gap이 커진다. 본 연구에서는 전기적 이방성을 가지고 있는 delafossite CuCrO2 상에서 우선배향을 일으키는 인자 중 기판을 변화시켜 실험을 진행하였다. 결과적으로 기판변화를 통해 우선배향조절이 가능하였으며 CuCrO2 박막을 시켰으며, 결정방향에 따른 전기적 물성의 이방성에 관한 연구는 계속 진행 중에 있다. c-plane sapphire 기판위에는 [00l]로 성장하는 반면, c-plane STO 기판 위에는 [015] 방향으로 성장하는 것을 확인하였다. 이러한 원인은 기판과 증착되는 박막간의 mismatch를 최소화 하여 strain을 줄이고, 계면에서의 Broken boning 수를 줄여 계면에너지를 낮추는 방법이기 때문일 것으로 예상된다. C-plane sapphire 기판위에 증착될 경우 증착온도가 증가함에 따라 c-축으로의 성장이 온전해지며 이에 따라 캐리어농도의 감소와 모빌리티의 증가가 급격하게 변하는 것을 확인할 수 있다. 반면 c-plane STO 기판에서는 증착온도에 따른 박막의 배향변화가 없으며 전기적 물성 변화 또한 비교적 작은 것을 간접적으로 확인하였다.

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Thickness Dependence of Orientation, Longitudinal Piezoelectric and Electrical Properties of PZT Films Deposited by Using Sol-gel Method (솔젤법에 의해 제조한 PZT(52/48) 막의 두께에 따른 우선배향성의 변화 및 이에 따른 압전 및 전기적 물성의 변화 평가)

  • Lee, Jeong-Hoon;Kim, Tae-Song;Yoon, Ki-Hyun
    • Journal of the Korean Ceramic Society
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    • v.38 no.10
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    • pp.942-947
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    • 2001
  • Thickness dependence of orientation on piezoelectric and electrical properties was investigated by PZT (52/48) films by diol based sol-gel method. The thickness of each layer by spinning at one time was $0.2{\mu}m$ and crack-free films could be successfully deposited on 4 inches Pt/Ti/$SiO_2$/Si substrates by 0.5 mol solutions in the range from $0.2{\mu}m$ to $3.8{\mu}m$. Excellent P-E hysteresis curves were achieved, which were attributed to the well-densified PZT films and columnar grain without pores or any defects between interlayers. The (111) preferred orientation of films were shown in the range of thickness below $1{\mu}m$. As the thickness increased, the (111) preferred orientation disappeared from $1{\mu}m$ to $3{\mu}m$ region, and the orientation of films became random above $3{\mu}m$. Dielectric constants and longitudinal piezoelectric coefficient, $d_{33}$, measured by pneumatic method were saturated around the value of about 1400 and 300 pC/N respectively above the thickness of $1{\mu}m$.

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Characteristics of Zinc Eelctroplated Steel Sheets (전기아연도금강판의 표면특성에 미치는 도금조건의 영향)

  • Kim, Yeong-Geun;Song, Yeon-Gyun
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2008.11a
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    • pp.36-36
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    • 2008
  • 염화물욕으로부터 얻은 전기아연도금강판의 표면특성을 도금조건 변화에 따라 분석한 결과, 도금층은 아연수산화물, 아연산화물, 프리즘과 피라미드면 그리고 기저면 순으로 가장 바깥층부터 위치하고 있었으며 유기첨가제는 도금조직의 형태와 크기 및 우선배향성을 결정하는 중요한 인자로 나타났고, 특히 기저면은 도금층의 가공성은 우수하나 강판 자체의 가공성에서는 불리한 특성을 가지고 있었다.

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