• 마이크로전자및패키징학회지
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• 제26권3호
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• pp.81-88
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• 2019

본 연구에서는 그래핀 산화(graphene oxide, GO) 분말 첨가가 ball grid array(BGA) 패키지와 printed circuit board(PCB)간 Sn-3.0Ag-0.5Cu(SAC305) 무연솔더 접합부의 electromigration(EM) 수명에 미치는 영향에 대하여 보고 하였다. 솔더 접합 직후, Ni/Au표면처리된 패키지 접합계면에서는 $(Cu,Ni)_6Sn_5$가 생성되었으며 organic solderability preservative(OSP) 표면처리 된 PCB 접합계면에서는 $Cu_6Sn_5$ 금속간화합물(intermetallic compound, IMC)이 생성되었다. $130^{\circ}C$, $1.0{\times}10^3A/cm^2$ 전류밀도 하에서 EM 수명평가 결과, GO를 첨가하지 않은 솔더 접합부의 평균 파괴 시간은 189.9 hrs으로 도출되었고, GO를 첨가한 솔더 접합부의 평균 파괴 시간은 367.1 hrs으로 도출되었다. EM에 의한 손상은 패키지 접합계면에 비하여 pad 직경이 작은 PCB 접합계면에서 전자 유입에 의한 Cu의 소모로 인하여 발생하였다. 한편, 첨가된 GO는 하부계면의 $Cu_6Sn_5$ IMC와 솔더 사이에 분포하는 것을 확인하였다. 따라서, SAC305 무연솔더에 첨가된 GO가 전류 집중 영역에서 Cu의 빠른 확산을 억제하여 우수한 EM 신뢰성을 갖는 것으로 생각된다.

• 융합정보논문지
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• 제9권7호
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• pp.94-99
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• 2019

마찰교반용접법(Friction Stir Welding, FSW)은 1991년에 영국 용접연구소 TWI(The Welding Institute)에서 최초 개발된 후 여러 산업분야에 걸쳐 적용연구가 활발히 진행되고 있다. 본 연구에서는 철도차량 차체의 주요 구성 소재인 알루미늄 합금 (Al-6005-T6) 평판 압출재에 대한 마찰교반접합 적용 기초연구를 수행하였다. 접합속도를 500 mm/min으로 고정한 채 회전공구의 회전속도를 600-1600 rpm으로 변화될 때 미세구조와 기계적 물성 변화에 미치는 영향에 대해 평가하였다. 경도 측정 결과 nugget부는 모재의 70% 수준의 경도값을 가지며 설정된 범위 내의 공구 회전속도와 연관성은 관찰되지 않았으며 용접계면에서 약 5 mm 벗어나게 되면 모재의 경도값을 가지는 것으로 확인되었다. 인장시험 결과 회전속도가 올라갈수록 항복강도와 인장강도가 소폭 하락하는 경향을 보였으며 연신률의 변화는 관찰되지 않았다.

• 대한기계학회논문집A
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• 제24권3호
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• pp.676-684
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• 2000

In this study, behavior of $C_t$ which is a well-known fracture parameter characterizing creep crack growth rate, is investigated for weld interface cracks. Finite element analyses were per formed for a C(T) specimen under constant loading condition for elastic-plastic-creeping materials. In modeling C(T) geometry, an interface was employed along the crack plane which simulated the interface between weld and base metals. The $C_t$ versus time relations were obtained under various creep constant combinations and plastic constant combinations for weld and base metals, respectively. A unified $C_t$ versus time curve is obtained by normalizing $C_t$ with $C^*$ and t with $t_T$ for all the cases of material constant variations.

• Journal of Welding and Joining
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• 제18권4호
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• pp.38-47
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• 2000

Characteristics of the interface between tube and tube sheet which were formed by explosive expansion and roll expansion, have been studied in the research. The results are as follows: Optimum amounts of explosives for the expansion of Alloy 600 (19.05mm and 15.88mm) were found to be RDX 3.5-8.5g/m. Because explosive expansion caused les strain hardening and increased bounding strength, characteristics of the explosively expanded were better than those of mechanically expanded. As the transition region of the explosive expansion is inactive, the resistance to the stress corrosion cracking increases by 30∼40% compared to the roll and hydraulic expansion.

• Journal of Welding and Joining
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• 제18권4호
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• pp.64-69
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• 2000

Reliability of PBGA(Plastic Ball Grid Array) package is very weak compared with normal plastic packages. The reliability are the lower resistance to popcorn cracking, which is reduced by moisture absorption in PCB(Printed Circuit Board). This paper adapts plasma treatment process and analyzes their effect. The contents of C and Cl decrease after plasma treatment but O, Ca and N relatively increase. The Plasma treatment to improve the adhesion between EMC(Epoxy Molding Compound) and PCB(solder mask). The degree of improvement was over 100% Max., which is depend on the properties of EMC. Ar+H$_2$as plasma gas show good result. There is a little difference in RF power and treatment time.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2001년도 춘계학술대회논문집A
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• pp.274-279
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• 2001

Creep-fatigue crack growth behavior was experimentally measured particularly when a crack was located in the heat affected region of 1Cr-0.5Mo steel. Load hold times of the tests for trapezoidal fatigue waveshapes were varied among 0, 30, 300 and 3,600 seconds. Time-dependent crack growth rates were characterized by the $C_t$-parameter. It was found that the crack growth rates were the highest when the crack path was located along the fine-grained heat affected zone(FGHAZ). Cracks located in other heat affected regions had a tendency to change the crack path eventually to FGHAZ. Creep-fatigue crack growth law of the studied case is suggested in terms of $(da/dt)_{avg}$ vs. $(C_t)_{avg}$ for residual life assessment.

• Journal of Welding and Joining
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• 제23권2호
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• pp.59-65
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• 2005

A leaky surface acoustic wave (LSAW) velocity was measured using a scanning acoustic microscope on the ceramic/metal interface in order to investigate material properties. The inverse Fourier transform (IFFT) of the V(z) curve contains the reflectance function of a liquid-specimen interface. So, the longitudinal, transverse, and Rayleigh wave velocities for each layer are obtained by the inversion of the V(z) curve at the same time. This paper contains mainly the experimental procedure for measurements of the LSAW velocity, and the results obtained for the velocity variation of individual layer after the thermal shock. It is shown that this method is useful in measuring the material properties under external stress.

• Journal of Welding and Joining
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• 제14권4호
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• pp.62-70
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• 1996

Al or Al-alloy have been known to be able to be claded on various materials by using explosive welding process, however, the intermetallic layer frequently formed along the interface have made this process very complicated. In this study, it was focussed to select the process variables, which can get rid of interfacial layer in the Al-claded steel plate. As a result, it was demonstrated that there was a certain range of explosive thickness which did not form the intermetallic phase as well as the non-bonded area. On the other hand, ultasonic tests performed for identifying the presence of interfacial layer nondestructively showed that it could be applied for the intended purpose but its result was weakly related with the microstructural quality of interface.

• Journal of Welding and Joining
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• 제29권5호
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• pp.90-94
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• 2011

Ag metallic particles from nano-scale to submicron-scale are combined with organic solvent to provide fine circuits and interconnection. Ink-jet printing with Ag nano particle inks demonstrated the potentials of the new printed electronics technology. The bonding at the interface between the Ag wiring layer and the various substrates is very important. In this study, the details of interfaces in Ag wiring are investigated primarily by microstructure observation. By adjusting the materials and sintering conditions, nicely formed interfaces between Ag wiring and Cu, Au or organic substrates are achieved. In contrast, transmission electron microscope (TEM) image clearly shows interface debonding between Ag wiring and Sn substrate. Sn oxides are formed on the surface of the Sn plating. The formation of these is a root cause of the interface debonding.

• 열처리공학회지
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• 제32권2호
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• pp.79-85
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• 2019

To investigate the influence of heat treatment on the growth intermetallic compounds (IMCs) at the joint interface of friction-welded Cu-Al, several heat treatments are performed at three different temperature with different times. The experiments reveal three different IMCs layers which are significantly influenced by atomic diffusion of Cu and Al with heat treatment conditions. Since the formation of these IMCs layers can affect mechanical properties of friction-welded Cu-Al interfaces, the relationship between the microstructure of IMCs layers and the tensile strength is analyzed according to heat treatment temperature and times.