• Journal of the Institute of Electronics Engineers of Korea SC
• /
• v.47 no.6
• /
• pp.80-85
• /
• 2010

BGA 409 chip currently the most as a visual inspection of the exterior inspection is conducted. Human depending on visual inspection of the exterior inspection of the current state of testers, depending on how the test results because the change is difficult to expect reliable results. Therefore, the challenges of visual inspection of BGA solder balls to improve the visual inspection technique was developed. However, BGA solder ball size of the microstructure and the characteristics of the distinction between hard test the accuracy of the fall orientation error has a problem. In this paper BGA solder balls exterior inspection of the accuracy to improve the edge detection algorithm, the complement of features and only the comparison proposed a pattern-matching techniques, based on the characteristics of spatial configuration of the area by improving the standard error of the orientation proposed improvements.

• Journal of the Korea Institute of Information and Communication Engineering
• /
• v.23 no.2
• /
• pp.127-132
• /
• 2019

In this paper, we propose a visual inspection method of automotive parts for injection molding to improve the appearance quality and productivity of automotive parts. Exterior inspection of existing injection molding automobile parts was generally done by manual sampling inspection by human. First, we applied the edge-tolerance vision inspection algorithm ([1] - [4]) for vision inspection of electronic components (TFT-LCD and PCB) And we propose a new visual inspection method to overcome the problem. In the proposed visual inspection, the inspection images of the parts to be inspected are aligned on the basis of the reference image of good quality. Then, after partial adaptive binarization, the binary block matching algorithm is used to compare the good binary image and the test binary image. We verified the effectiveness of the edge-tolerance vision check algorithm and the proposed appearance vision test method through various comparative experiments using actual developed equipment.

• Proceedings of the Korea Information Processing Society Conference
• /
• 2012.11a
• /
• pp.482-485
• /
• 2012

본 논문은 평면 디스플레이 패널 외관 검사의 무인 자동화를 위한 전처리 단계의 알고리즘으로 패널 외관 검사 영역의 정합성 향상 및 자동 설정하는 알고리즘 기술에 관한 것이다. 평면디스플레이 패널의 제조 공정 중, 점등 검사 공정 단계에서는 Line 불량, Point 불량, 얼룩 불량, 외관 불량, Pol 불량 등 다양한 불량들을 검출한다. 이중 외관 불량 검사를 자동화하기 위한 전처리 단계로써 획득한 영상 내에서의 검사 영역을 설정함에 있어서 영상에서의 패널 위치의 변화, 패널의 Rotation/tilt, 패널 에지에 불량이 결부될 경우에도 실제 절단면을 정확하게 추출하여 불량 측정 오차를 최소화하는 알고리즘 을 제안한다.

• Proceedings of the Korea Institute of Convergence Signal Processing
• /
• 2000.08a
• /
• pp.261-264
• /
• 2000

본 논문에서는 이동 통신용 단말기에 주로 사용되는 RF-chip inductor의 자동 외관검사를 위한 시스템 개발에 필요한 알고리즘을 제안하였다. 본 논문에서 제안한 방법은 영상취득 후 처리과정에서 동적 이진화 방법, 가산투영 등 영상처리에 관련된 방법을 이용해 코일 부분과 코어부분을 분리한 후 세선화 방법, 라벨링 방법 등을 적용하여 분리된 코일부분에 대해 코일의 감긴 회수와 피치간격의 불균일 검사를 수행하고 기준값 이상의 오차를 갖는 소자를 불량으로 처리하는 보다 개선된 처리방법을 제안하였으며 모의실험을 통해 성능을 검증하였다.

• Journal of the Institute of Electronics Engineers of Korea SC
• /
• v.46 no.4
• /
• pp.58-63
• /
• 2009

The appearance inspection of various electronic products and parts was executed by the eyesight of human. The appearance inspection is applied to the most electronic component of LCD Panel, flexible PCB and remote control. If the appearance of electronic products of small and minute size is inspected by the eyesight of human, we can't expect the stable inspection result because inspection result is changed by condition of physical and spirit of the checker. Therefore currently machine vision systems are used to many appearance inspection fields instead of inspection by human. The many problems of inspection by the checker are not occurred in machine vision circumstance. However, the inspection by automatic machine vision system is mainly influenced by illumination of workplace. In this paper, we propose a histogram transform method for improving accuracy of machine visual inspection.

• Journal of the KSME
• /
• v.21 no.6
• /
• pp.428-438
• /
• 1981

초음파탐상은 방사선비파괴검사와 비교할 때, 객관성이 뒤지고 검사기술자의 능력에 따라 탐상 결과가 틀리며 실제로 적용하는 곳도 방사선비파괴검사보다 많지 않다. 또 자분 및 침투탐상검 사도 파이프라인에는 그렇게 많이 적용되지 않는다. 그리고 표면결함을 조사하기 위해서는 육만 또는 외관검사 처리하게 된다. 그러면 가장 많이 이용되고 있는 방사선비파괴감사에 대한 상세한 내용을 설명하기로 한다.

• Proceedings of the KWS Conference
• /
• 2001.10a
• /
• pp.242-246
• /
• 2001

• Journal of the Institute of Electronics Engineers of Korea SC
• /
• v.44 no.5
• /
• pp.11-17
• /
• 2007

The appearance inspection of various electronic products and parts has been executed by the eyesight of human. But inspection by eyesight can't bring about uniform inspection result. Because the appearance inspection result by eyesight of human is changed by condition of physical and spirit of the checker. So machine vision inspection system is currently used to many appearance inspection fields instead of the checker. However the inspection result of machine vision is changed by the illumination of workplace. Therefore we have used a power-law transformation and histogram specification in this paper for improvement of vision inspection accuracy. As a result of these power-law transformation and histogram specification algorithm, we could increase the exactness of vision inspection and prevent system error from physical and spirit condition of human. Also this system has been developed only using PC, CCD Camera and Visual C++ for universal workplace.

• Proceedings of the Korea Information Processing Society Conference
• /
• 2001.04b
• /
• pp.1237-1240
• /
• 2001

최근 제품의 초소화와 반도체의 고집적화로, 작은 크기로 많은 리드를 제공하기 위해, 부품 밑면에 격자형태로 볼이 배열되어 있는 BGA나 CSP부품들이 최근 많이 이용되고 있다. 하지만, BGA는 한번 PCB에 장착되면, 볼 외관검사가 원천적으로 불가능하므로, 부품을 장착하기 전에 볼 품질의 검사와 부품의 정밀한 위치 및 각도의 측정이 요구된다. 본 논문에서는 BGA부품의 위치 및 각도를 추출하기 위한 방법과 볼을 검사하기 위한 알고리즘을 소개한다.

• Journal of the Korean Institute of Gas
• /
• v.19 no.2
• /
• pp.45-53
• /
• 2015

In order to improve the performance of the visual inspection process, in addition to existing automatic visual inspection machine and human inspectors have developed a new process configuration using a Naive Bayes classifier. By applying the classifier, defect leakage and human inspector's work amount could be improved at the same time. New classification method called AMPB was applied instead of conventional methods based on MAP classification. By experimental results using the filter product for camera modules, it was confirmed that it is possible to configure the process at the level of leakage ratio 1.14% and human inspector's work amount ratio 75.5%. It is significant that the result can be applied in such a wide range as gas leak detection which is the collaboration process between inspection machine and human inspector's