• Journal of the Microelectronics and Packaging Society
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• v.29 no.3
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• pp.43-48
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• 2022

In this study, simulation method was developed to improve the accuracy of the warpage simulation based on the equivalent anisotropic viscoelastic model. First, a package with copper traces and bumps was modeled to implement anisotropic viscoelastic behavior. Then, equivalent anisotropic viscoelastic properties and thermal expansion coefficient for the bump region were derived through the representative volume element model. A thermal cycle of 0 to 125 degrees was applied to the package based on the derived mechanical properties, and the warpage according to the thermal cycle was simulated. To verify the simulation results, the actual package was manufactured, and the warpage with respect to the thermal cycle was measured through shadow moiré interferometer. As a result, by applying the equivalent anisotropic viscoelastic model, it was possible to calculate the warpage of the package within 5 ㎛ error and predict the shape of the warpage.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.2
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• pp.17-28
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• 2012

It is known that thermo-mechanical properties of solder material and molding compound in WB-PBGA packages are considerably affected by not only temperature but elapsed time. In this paper, finite element analysis (FEA) taking material nonlinearity into account was performed for more reliable prediction on deformation behavior of a lead-free WB-PBGA package, and the results were compared with experimental results from moire interferometry. Prior to FEA on the WB-PBGA package, it was carried out for two material layers consisting of molding compound and substrate in terms of temperature and time-dependent viscoelastic effects of molding compound. Reliable deformation analysis for temperature change was then accomplished using viscoplastic properties for solder ball and viscoelastic properties for molding compound, and the analysis was also verified with experimental results. The result showed that the deformation of WB-PBGA packages was strongly dependent on material model of molding compound; thus, temperature and time-dependent viscoelastic behavior must be considered for the molding compound analysis. In addition, viscoelastic properties of B-type molding compound having comparatively high glass transition temperature of $135^{\circ}C$ could be recommended for reliable prediction on deformation of SAC lead-free WB-PBGA packages.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.21 no.4
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• pp.53-59
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• 2022

In this study, an enhanced first-order shear deformation theory is proposed to efficiently and accurately predict the thermo-mechanical-viscoelastic coupled behavior of laminated composite structures. To this end, transverse shearstress and displacement fields are independently assumed, and the strain-energy relationship between these fields issystematically established using the mixed variational theorem (MVT). In MVT, the transverse shear stress fields are obtained from the third-order zigzag model, whereas the displacement fields of the conventional first-order model are considered to amplify the benefits of numerical efficiency. Additionally, a transverse displacement field with a smooth parabolic distribution is introduced to accurately predict the thermal behavior of composite structures. Furthermore, the concept of Laplace transformation is newly employed to simplify the viscoelastic problem, similar to the linear-elastic problem. To demonstrate the performance of the proposed theory, the numerical results obtained herein were compared with those available in the literature.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.4
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• pp.1-7
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• 2007

Nanoimprint lithography (NIL) is an emerging technology enabling cost-effective and high-throughput nanofabrication. To successfully imprint a nano-sized pattern, the process conditions such as temperature, pressure, and time should be appropriately selected. This starts with a clear understanding of polymer material behavior during the NIL process. In this work, the squeezing of thin polymer films into nanocavities during the thermal NIL has been investigated based upon a two-dimensional viscoelastic finite element analysis in order to understand how the process conditions affect a pattern quality. The simulations have been performed within the viscoelastic plateau region and the stress relaxation effect has been taken into account.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.26 no.8
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• pp.1653-1665
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• 2002

One of the most significant problems in the processing of composite materials is residual stresses. The residual stresses may be high enough to cause cracking in the matrix even before external loads are applied and can degrade the integrity of composite structures. In this study, thermo-viscoelastic residual stresses occurred in the polymeric composite cylinder are investigated. This type of structure is used for the launch vehicle fuselage. The time and degree of cure dependent thermo-viscoelastic constitutive equations are developed and coupled with a thermo-chemical process model. These equations are solved with the finite element method to predict the residual stresses in the composite structures during cure. A launch vehicle experiences high thermal loads during flight and re-entry due to aerodynamic heating or propulsion heat, and the thermal loads may cause thermal buckling on the structure. In this study the thermal buckling analysis of composite cylinders are performed. Two boundary conditions such as all clamped and all simply supported are used for the analysis. The effects of laminates stacking sequences, shapes and residual stresses on the critical buckling temperatures of composite cylinders are investigated. The thermal buckling analysis is performed using ABAQUS.

• Transactions of the Korean Society of Mechanical Engineers
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• v.15 no.2
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• pp.396-403
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• 1991

A solution is presented for the computation of the elastic-creep stresses in a hollow cylinder subjected to nonaxisymmetric temperature distribution. The creep problem is treated by the Maxwell creep model. Laplace transformation is used for reformation of the governing equation of elastic problem and Hooke's law in a function of .gamma. , .theta. , and creep constant. The governing equation is set up using the Airy stress function which leads to the biharmonic equation. The solution is obtained by using Fourer series method and Laplace inverse method used to obtain the stress components which include the variation of time. This solution shows excellent agreement with Lamkin's and Boley & Weiner's solution. The viscoelastic stresses are also obtained for the fuel rob tube subjecting nonaxisymmetric thermal load.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.34 no.2
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• pp.245-253
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• 2010

The reliability problems of flip chip packages subjected to temperature change during the packaging process mainly occur due to mismatches in the coefficients of thermal expansion as well as features with time-dependent material properties. Resin molding compounds like glass fiber reinforced epoxy composites used as the dielectric layer in printed circuit boards (PCB) strongly exhibit viscoelastic behavior, which causes their Young's moduli to not only be temperature-dependent but also time-dependent. In this study, the stress relaxation and creep tests were used to characterize the viscoelastic properties of the glass fiber reinforced epoxy composite. Using the viscoelastic properties, finite element analysis (FEA) was employed to simulate thermal loading in the pre-baking process and predict thermal warpage. Furthermore, the effect of viscoelastic features for the major polymeric material on the dielectric layer in the PCB (the glass fiber reinforced epoxy composite) was investigated using FEA.

• Journal of the Microelectronics and Packaging Society
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• v.31 no.2
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• pp.23-27
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• 2024

In this study, the time-dependent warpage behavior caused by the viscoelastic properties of prepreg in a printed circuit board (PCB) was analyzed by finite element method (FEM). The accurate viscoelastic properties of the prepreg were measured by stress relaxation test, which were then incorporated into constructed warpage analysis model. When the PCB was subjected to repeated thermal cycles, the warpage of the PCB was restored to its initial state when only the elastic properties of the prepreg were considered, but when the viscoelastic properties were also considered, the warpage was not restored and permanent warpage change occurred. The warpage analysis for three different types of prepreg was conducted to compare their mechanical reliability, and the results showed that materials with elastic properties dominating over viscoelastic properties experienced less warpage, resulting in better mechanical reliability.

• Journal of Aerospace System Engineering
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• v.18 no.1
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• pp.1-10
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• 2024

In a previous study, a structure of a superplastic yoke consisting of a thin FR4 layer laminated with viscoelastic tape on both sides of a shape memory alloy (SMA) was proposed to reduce residual vibration generated by a deployable solar panel during high motion of a satellite. Damping properties of viscoelastic tapes will change with temperature, which can directly affect vibration reduction performance of the yoke. To check damping performance of the yoke at different temperatures, free damping tests were performed under various temperature conditions to identify the temperature range where the damping performance was maximized. Based on above temperature test results, this paper predicts temperature of the yoke through orbital thermal analysis so that the yoke can have effective damping performance even if it is exposed to an orbital thermal environment. In addition, the thermal design method was described so that the yoke could have optimal vibration reduction performance.

• Elastomers and Composites
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• v.36 no.3
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• pp.153-161
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• 2001

The rubber pads era tank which undergo dynamic deformations with the sufficient amplitudes and frequencies lead to a considerable internal temperature rise due to the heat generation. The heat generation which is dependent on the viscoelastic characteristics or a rubber is due to the conversion of partial mechanical energy into thermal energy identical to the area oi hysteresis loop. Heat generation without adequate heat dissipation leads to heat build-up and the excessive temperature rite exerts a bad influence upon the performance and the life of rubber products. In this paper, temperature distributions of the rubber pads of a tank track subjected to dynamic loads are obtained under the assumption of the steady state. Heat generation rates used in this finite element analysis are acquired through experiments and the computed temperature fields are displayed in isothermal contour regions.