• Composites Research
• /
• v.30 no.6
• /
• pp.410-415
• /
• 2017

This paper predicted deformation due to thermal residual stress in composites using finite element analysis. Temperature cycle, Model shape, Laminate angle, Stacking sequence, chemical shrinkage of resin, and thermal expansion are affect composite deformation. Compare the results of the analytical model with the actual model of the same shape. This paper suggests that the analytical results can be applied to actual Model.

• Transactions of the Korean Society of Mechanical Engineers B
• /
• v.38 no.6
• /
• pp.443-449
• /
• 2014

Thermoacoustic (TA) models have been widely used to predict combustion instability characteristics in a gas turbine lean premixed combustor. However, these techniques have shown some limitations in improving the model accuracy related to an over-simplification of the combustion system and flame geometry. Efforts were made in the current study to improve the limitations of the TA models. One strategy was to modify the actual flame location in the model, and another was to consider the heat release distribution through the flames. The modified TA model results show better accuracy in predicting the growth rate of instabilities compared with the previous results.

• Proceedings of the Korea Institute of Convergence Signal Processing
• /
• 2000.08a
• /
• pp.289-292
• /
• 2000

선형 자귀회귀(AR) 모델을 근거로한 HRV 파워 스펙트럼해석은 비침습적으로 자율신경의 반응을 정량화하는데 폭넓게 사용된다. 본 연구는 단구간(2분 미만)의 심전도와 맥파 신호로부터 시계열 HRV의 파워스펙트럼을 추정한다. 시계열은 정상인을 대상으로 검출한 심전도와 맥파신호의 특징점 시간간격(RRI, PPI)으로부터 구하였다. 발생된 시계열은 다항식 보간법에 의해 AR모델에 적합하게 재구성하였으며, AR모델 계수는 Burg법에 의해 계산하였다. AR모델을 적용한 단구간의 심전도와 맥파의 심박변동에 대한 파워스펙트럼밀도는 저주파수(LF)와 고주파수(HF)에서 매끄러운 스펙트럼 파워를 나타내고 있다. 또한 동일한 피험자의 심전도와 맥파의 파워스펙트럼밀도를 비교한 결과 동일한 모양을 나타내었다.

• Journal of Korean Society of Steel Construction
• /
• v.19 no.3
• /
• pp.291-301
• /
• 2007

The overlay model is a certain kinds of numerical analysis method to present the material non-lineariy which is represented the baushinger effect and the strain hardening. This model simulates the complex behavior of material by controlling the properties of the layers which like the hardening ratio, the section area and the yield stress. In this paper, the constitutive equation and plastic flow rule of each layer which are laid in the plane stress field are obtained by using the thermodynamics. Two numerical examples were tested for the validity of proposed method in uniaxial stress and plane stress field with comparable experimental results. The only parameter for the test is the yield stress distribution of each layers.

• Journal of the Institute of Electronics and Information Engineers
• /
• v.53 no.8
• /
• pp.39-48
• /
• 2016

In this paper, we propose thermal resistance compact model of FinFET structure that has hexagon shaped source/drain. The heating effect and thermal properties were increased by reduced size of the device, and thermal resistance is an important factor to analyze the effect and the properties. The heat source and each contact that is moved heat out were set up in transistor, and domain is divided by the heat source and the four parts of contacts : source, drain, gate, substrate. Each contact thermal resistance model is subdivided as a easily interpretable structure by analyzing the temperature and heat flow of the TCAD simulation results. The domains are modeled based on an integration or conformal mapping method through the structure parameters according to its structure. First modeled by analyzing the thermal resistance to a single fin, and applying the change in the parameter of the channel increases to improve the accuracy of the thermal resistance model of the multi-fin/ finger. The proposed thermal resistance model was compared to the thermal resistance by analyzing results of the 3D Technology CAD simulations, and the proposed total thermal resistance model has an error of 3 % less in single and multi-finl. The proposed thermal resistance model can predict the thermal resistance due to the increase of the fin / finger, and the circuit characteristics can be improved by calculating the self-heating effect and thermal characterization.

• Journal of the Korean Society for Aeronautical & Space Sciences
• /
• v.39 no.5
• /
• pp.466-473
• /
• 2011

The purpose of satellite thermal control design is to maintain all the elements of a spacecraft system within their temperature limits for all mission phases. The thermal analysis model for Low Earth Orbit satellite payload level simulation is established by considering thermal vacuum test environment condition, thermal vacuum chamber configuration, and satellite's payload inner thermal environment. The established thermal analysis model is used to determine thermal vacuum test conditions and test case requirements.

• Journal of the Korean Society for Aeronautical & Space Sciences
• /
• v.33 no.8
• /
• pp.99-104
• /
• 2005

The major role of a spacecraft structure is to keep and support the spacecraft safely in all the launch environment, on-orbit condition and during ground-transportation and handling. In a satellite development, a structural and thermal model (STM) is developed for two goals ; demonstration of a structural and a thermal stability. In the structure point of view, STM is used to verify the static/dynamic characteristics of structure in the initial stage of development. In this paper, the structure design/analysis of high resolution LEO earth observation satellite STM is described. Also, a low level sine vibration test is performed and compared to the results of finite element analysis.

• Journal of Korean Tunnelling and Underground Space Association
• /
• v.19 no.2
• /
• pp.121-141
• /
• 2017

The thermal analysis of an underground power conduit for electrical cables is essential to determine their current capacity with an increasing number of demands for high-voltage underground cables. The temperature rises around a buried cable, caused by excessive heat dissipation, may increase considerably the thermal resistance of the cables, leading to the danger of "thermal runaway" or damaging to insulators. It is a key design factor to develop the mechanism on thermal behavior of backfilling materials for underground power conduits. With a full-scale field test, a numerical model was developed to estimate the temperature change as well as the thermal resistance existing between an underground power conduit and backfill materials. In comparison with the field test, the numerical model for analyzing thermal behavior depending on density, moisture content and soil constituents is verified by the one-year-long field measurement.

• Tunnel and Underground Space
• /
• v.21 no.1
• /
• pp.66-81
• /
• 2011

In this study, it was aimed to develop a thermal-hydraulic-mechanical coupled fracture mechanics code that models a fracture initiation, propagation and failure of underground rock mass due to thermal and hydraulic loadings. The development was based on a 2D FRACOD (Shen & Stephasson, 1993), and newly developed T-M and H-M coupled analysis modules were implemented into it. T-M coupling in FRACOD employed a fictitious heat source and time-marching method, and explicit iteration method was used in H-M coupling. The validity of developed coupled modules was verified by the comparison with the analytical result, and its applicability to the fracture initiation and propagation behavior due to temperature changes and hydraulic fracturing was confirmed by test simulations.

• Bulletin of the Korean Space Science Society
• /
• 2005.04a
• /
• pp.129-132
• /
• 2005

This paper describes BAUSAT-2 orbital thermal analysis and preliminary design of thermal control subsystem. To design thermal control subsystem of HAUSAT-2, we have considered active & passive thermal control method based on basic theory and themal equilibrium equation. Using this result, suitable thermal control method and material have been selected. We have designed thermal control subsystem based on analysis of HAUSAT-2's thermal environments on sun synchronous orbit with altitude 650km, inclination $98^{\circ}$ and thermal distribution and range expectation of each HAUSAT-2's surface. Thermal analysis consists of system level, box level and board level analysis. We have completed system level and box level analysis. Till now, board level analysis of main heat dissipation board in progress. Thermal control subsystem has designed according to thermal analysis result. This design is to maintain all of the HAUSAT-2 components within the allowable temperature limits. In future, STM