• Journal of Welding and Joining
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• v.16 no.4
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• pp.92-97
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• 1998

Because of the low melting temperature of solder, each temperature cycle initiates an irrecoverable creep deformation at the solder interconnection which connects the package body with the PCB. The crack starts and propagates from the position where the creep deformation is maximized. This work has tried to compare and analyze the thermal fatigue life of solder interconnection which is affected by the lead material, the size of die pad, chip thickness, and interface delamination of 48-Pin TSOP under the temperature cycle ($0^{\circ}C$~1$25^{\circ}C$). The crack initiation position and thermal fatigue life which are calculated by using FEA method are well matched with the results of experiments. The thermal Fatigue life of copper lead frame is extended around 3.6 times longer than that of alloy 42 lead frame. It is maximized when the chip size is matched with the length of the lead. It tends to be extended as the thickness of chip got thinner. As the interfacial delamination between die pad and EMC is increased, the thermal fatigue life tends to decrease in the beginning of delamination, and increase after the delamination grew after 45% of the length of die pad.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.29 no.4 s.235
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• pp.526-533
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• 2005

Reliability problem in inkjet printhead, one of MEMS devices, is also very important. To eject an ink drop, the temperature of heater must be high so that ink contacting with surface reaches above $280^{o}C$ on the instant. Its heater is embedded in the thin multi-layer in which several materials are deposited. MEMS processes are the main sources of residual stresses development. Residual stress is one of the factors reducing the reliability of MEMS devices. We measured residual stresses of single layers that consist of multilayer. FE analysis is performed using design of experiment(DOE). Transient analysis for heat transfer is performed to get a temperature distribution. And then static analysis is performed with the temperature distribution obtained by heat transfer analysis and the measured residual stresses to get a stress distribution in the structure. Although the residual stress is bigger than thermal stress, thermal stress is more influential on fatigue life.

• Journal of the Microelectronics and Packaging Society
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• v.10 no.2
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• pp.19-26
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• 2003

Plastic and creep deformations of a solder joint on thermal cycle play an important role in the reliability of optical telecommunication components. Solder joint strain is increased with the thermal cycle time and it causes mis-alignments and power loss in the optical component. Furthermore, the component can be failed since the deformation exceed the limitation of the fatigue life. We applied the finite element analysis method to solve the problem of the solder joint reliability on thermal cycle. Plastic and creep deformations are calculated by the finite element method. And, the fatigue lire is predicted by using creep-fatigue prediction models with calculated strains. The temperature conditon of the analysis was referred from the Telcordia reliability schedule (-40 to 75). Also, the three ramp renditions, 1/min, 10/min and 50/min, and dwelling time were considered to analyze the differences of results.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 1999.05a
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• pp.93-98
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• 1999

Generally, the - life of die is limited by fatigue fracture or dimensional inaccuracy originated from wear. In this paper, to predict the fatigue life of the dissimilar materials die, the stress and stxain histories of die can be predicted by the analysis of elasto-plastic finite element neth hod and the elastic analysis of die during the process analysis of workpiece. Using heat shrink fit analysis, initial stress of the k r t die is computed. Also, the stress-life curve of die material can be obtained through experiment. With the above two facts, we propose the analysis method of predicting fatigue life in die. In the proposed model, tlz analysis of elastic-plastic finite element method for material is carried out by using ABAQUS. Surface force resulted from the contacting border of the die and workpiece is tmnsformed into the nodal force of die to implement elastic analysis. Besides, the proposed analysis model of die is applied to the one material and the dissimilar materials extrusion die.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.41 no.2
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• pp.157-164
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• 2017

A parallel slide gate valve (PSGV) is located between the heat recovery steam generator (HRSG) and the steam turbine in a combined cycle power plant (CCPP). It is used to control the flow of steam and runs with repetitive operations such as startups, load changes, and shutdowns during its operation period. Therefore, it is necessary to evaluate the fatigue damage and the structural integrity under a large compressive thermal stress due to the temperature difference through the valve wall thickness during the startup operations. In this paper, the thermal-structural analysis and the fatigue life evaluation of a 16-inch PSGV, which is installed on the HP steam line, is performed according to the fatigue life assessment method described in the ASME B&PVC VIII-2; the method uses the equivalent stress from the elastic stress analysis.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.39 no.5
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• pp.400-407
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• 2011

The stress distribution and stress amplitude of a membrane are major factors to decide the mechanical fatigue life of PEMFC (Polymer Electrolyte Membrane Fuel Cell). In this paper, mechanical stresses under operating hygro-thermal condition of the membrane are numerically modelled. Contact analysis between gas diffusion layer (GDL) and the membrane is performed under various temperature-humidity conditions. The structural model has nonlinear material properties depending on temperature and relative humidity. Several geometric conditions are applied to the model. The numerical analysis results indicate that deformations of the membrane are strongly related with assembly conditions of the fuel cell. The fatigue life is predicted for practical operating condition through experimental data.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.28 no.9
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• pp.1408-1414
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• 2004

The use of flip-chip technology has many advantages over other approaches for high-density electronic packaging. ACF (anisotropic conductive film) is one of the major flip-chip technologies, which has short chip-to-chip interconnection length, high productivity, and miniaturization of package. In this study, thermal fatigue lift of ACF bonding flip-chip package has been predicted. Elastic and thermal properties of ACF were measured by using DMA and TMA. Temperature dependent nonlinear hi-thermal analysis was conducted and the result was compared with Moire interferometer experiment. Calculated displacement field was well matched with experimental result. Thermal fatigue analysis was also conducted. The maximum shear strain occurs at the outmost located bump. Shear stress-strain curve was obtained to calculate fatigue life. Fatigue model for electronic adhesives was used to predict thermal fatigue life of ACF bonding flip-chip packaging. DOE (Design of Experiment) technique was used to find important design factors. The results show that PCB CTE (Coefficient of Thermal Expansion) and elastic modulus of ACF material are important material parameters. And as important design parameters, chip width, bump pitch and bump width were chose. 2$^{nd}$ DOE was conducted to obtain RSM equation far the choose 3 design parameter. The coefficient of determination ($R^2$) for the calculated RSM equation is 0.99934. Optimum design is conducted using the RSM equation. MMFD (Modified Method for feasible Direction) algorithm is used to optimum design. The optimum value for chip width, bump pitch and bump width were 7.87mm, 430$\mu$m, and 78$\mu$m, respectively. Approximately, 1400 cycles have been expected under optimum conditions. Reliability analysis was conducted to find out guideline for control range of design parameter. Sigma value was calculated with changing standard deviation of design variable. To acquire 6 sigma level thermal fatigue reliability, the Std. Deviation of design parameter should be controlled within 3% of average value.

• Journal of the Korean Society for Precision Engineering
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• v.11 no.4
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• pp.114-125
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• 1994

Fatigue behavior and life prediction method were presented for themal-mechanical and isothermal low cycle fatigue of 12 Cr forged steel used for high temperature applications. In-phase and out-of-phase thermal-mechanical fatigue test from 350 .deg. C to 600 .deg. C and isothermal low cycle fatigue test at 600 .deg. C, 475 .deg. C, 350 .deg. C were conducted using smooth cylindrical hollow specimen under strain-control with total strain ranges from 0.006 to 0.015. The phase difference between temperature and strain in thermal-mechanical fatigue resulted in significantly shorter fatigue life for out-of-phase than for in-phase. Thermal-mechanical fatigue life predication was made by partitioning the strain ranges of the hysteresis loops and the results of isothermal low cycle fatigue tests which were performed under the combination of slow and fast strain rates. Predicted fatigue lives for out-of-phase using the strain range partitioning method showed an excellent agreement with the actual out-of-phase thermal-mechanical fatigue lives within a factor of 1.5. Conventional strain range partitioning method exhibited a poor accuracy in the prediction of in-phase range partitioning method in a conservative way. By the way life prediction of thermal-mechanical fatigue by Taira's equivalent temperature method and spanning fartor method showed good agreement within out-of-phase thermal-mechanical fatigue.

• Proceedings of the Korean Society of Propulsion Engineers Conference
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• 2009.05a
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• pp.18-21
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• 2009

The life of components under high thermal load is typically shorter than other components. The turbopump turbine of liquid rocket is operated under these environments like high temperature and high centrifugal dorce due to high rotating velocity during operating time. These conditions may often cause low-cycle fatigue problem in the turbopump turbine. First of all, to analyze heat stress, ABAQUS/CAE is used and Coffin-manson's equation is used to consider elasticity and plasticity strain. S.W.T's method is used to consider the mean stress effect, using strain history, low-cycle fatigue analysis is done for turbopump turbine which may have FCL(fracture critical location). In this paper, strain life method is applied to analyze low-cycle fatigue.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2004.05a
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• pp.49-49
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• 2004

고도화로 정밀해진 현대 과학기기에는 여러 가지 전자 팩키징 제품들이 쓰이고 있으나 이 제품들은 여러 가지 파손인자들의 영향 때문에 고유의 수명을 다하지 못하고 고장이 발생하게 된다. 전자부품 실장에 이용되는 솔더 조인트의 열화에 관련되는 열 피로와 이온 마이그레이션(Migration) 현상이 솔더 조인트의 신뢰성에 영향을 미치는 가장 중요한 인자로 알려져 있고 이러한 인자 이외에도 여러 가지 요인들이 복합적으로 작용하여 솔더의 접합부분에 피로파괴를 일으킨다.(중략)