• Journal of Navigation and Port Research
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• v.29 no.10 s.106
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• pp.871-876
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• 2005

Application of semiconductor sensors has been widely spreaded into various industries because those have several merits like easy miniaturization and batch production comparison with previous mechanical sensors. But external conditions such as thermal and repetitive load have a bad effect on sensors's lifetime. Especially, this paper was focused on fatigue life of a interconnect made by various materials. Firstly we implemented the stress analysis for interconnect under thermal load and wording pressure. And the fatigue lifetime of each material was induced by Manson & Coffin Equation using the plastic stress-strain curve obtained by the plastic-elastic Finite Element Analysis. The Fatigue lifetime in its bottom is smaller than others and bending load have not an effect on the fatigue lifetime of the interconnect but the stress distribution.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.39 no.1
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• pp.11-17
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• 2015

High-density polyethylene (HDPE) piping, which has recently been applied to safety class III piping in nuclear power plants, can be butt-joined through the thermal fusion process, which heats two fused surfaces and then subject to axial pressure. The thermal fusion process generates bead shapes on the butt fusion. The stress concentrations caused by the bead shapes may reduce the fatigue lifetime. Thus, investigating the effect of the thermal butt fusion beads on fatigue behavior is necessary. This study examined the fatigue behavior of thermal butt fusion via a tensile fatigue test under stress-controlled conditions using finite element elastic stress analysis. Based on the results, the presence of thermal butt fusion beads was confirmed to reduce the fatigue lifetime in the low-cycle fatigue region while having a negligible effect in the medium- and high-cycle fatigue regions.

• Journal of the Korean Society of Propulsion Engineers
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• v.21 no.6
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• pp.73-82
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• 2017

Low-cycle thermal fatigue problem resulting from multiple use of a liquid rocket engine has to be considered for the development of a reusable launch vehicle. In this study, life prediction equations suggested by previous researchers were compared as applied to various copper alloy cases to predict fatigue lives from tensile test data. The present study has revealed that among the presently considered life prediction methods, universal slopes method provides the best life prediction result for the copper alloys, and the modified Mitchell's method provides the best life prediction result for oxygen free high conductivity (OFHC) copper.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.36 no.8
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• pp.835-841
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• 2012

We measured the mechanical and thermal properties of four types of cast irons used for manufacturing the brake discs of railway vehicles. It was found that these properties could be controlled by varying the composition of Ni, Cr, and Mo. Thermal fatigue tests were carried out by using a thermal fatigue tester in which thermal cycles could be controlled. Thermal crack initiation and propagation were measured on cylindrical specimens. Finally, we simulated the thermal fatigue test procedure by finite element analysis and calculated the thermal fatigue lifetimes by Manson-Coffin's equation and the maximum principal strain. The estimated thermal fatigue lifetimes corresponded to the measured lifetimes when the total crack length was $40{\mu}m{\sim}1mm$.

• The tire
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• s.65
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• pp.10-17
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• 1976

아민계열화방지제(이하 아민이라고 한다)를 첨가한 천연고무 순고무가유물에 대해서 고온으로 반복대신장피로를 주어서 응력변화, 피로수명에 주는 열화방지제의 영향을 조사하였다. 아민첨가시료에 대해서 고온으로 반복 신장피로를 가하면 무첨가시료와 동양, 화학응력 연화가 출현했다. 아민첨가시료의 화학응력연화의 임계온도는 NR-DPG로 110℃, NR-MBTS로 110℃, NR-TT로 130℃이며 가교구조의 내열성에 일치하며 무첨가시료의 임계온도보다도 10~30℃높아졌다. 아민첨가시료의 반복신장피로수명은 60℃로 극대화 되어 (NR-DCP만이 40℃이었으나) 무첨가시료의 피로수명은 40℃에서 극대화됐다. 전보에서 보고한 피로수명과 변형률과의 관계식(F=A(εb-ε)n)은 100℃에서 아민첨가시료에 대해서만이 성립하고 무첨가시료에 대해선 성립되지 않았다. 이들의 결과는 아민을 고무에 첨가함으로써 고무의 열산화반응이 억제되었음에 원인하고 있다고 생각된다.

• Journal of Energy Engineering
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• v.9 no.3
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• pp.184-191
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• 2000

본 연구에서는 국내 10MW급 기력발전소의 소형 터빈 로터에 대한 응력 해석을 실시하였다. 터빈 로터의 기하학적 형상, 증기의 온도 및 압력 등의 기동조건 변화, 로터 재료의 온도에 따른 물성값 등을 고려하여 대류 열 전달계수를 계산하는 사용자 부프로그램을 구성하였으며, 이를 바탕으로 열해석을 실시하여 로터의 온도 분포를 결정하였다. 이 온도분포 조건에서 시간 경과에 따른 열응력 해석을 실시하여 로터의 응력 분포를 결정하였으며 그 결과 취약부위에서의 응력변동 범위 및 가동중 정상상태 응력수준을 결정하였다. 이 취약부위의 응력값과 운전이력을 이용하여 크리프 수명과 피로수명을 계산하고 로터의 잔여수명을 결정하는 방법을 논의하였다.

• Proceedings of the Korean Nuclear Society Conference
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• 1995.05b
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• pp.943-949
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• 1995

원자력 발전소의 설비중 가압기 밀림관 노즐의 피로 잔존 수명에 대해 연구하였다. 원자력발전소 운전중 발생하는 각종 천이상태에 의해 밀림관 노즐에 작용하는 열응력과 역학적 응력을 상용 유한요소법 펙케지를 이용하여 계산하였다. 계산된 응력값들과 ASME Boiler and Pressure Vessel Code를 이용하여 가압기 밀림관 노즐의 피로 잔존 수명을 평가하였다.

• Journal of the Computational Structural Engineering Institute of Korea
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• v.21 no.1
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• pp.35-42
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• 2008

In the nuclear power plant, early detection of fatigue crack by non-destructive test (NDT) equipment due to the thermal cyclic load is very important in terms of strict safety regulation. To this end, many efforts are exerted to the fabrication of artificial cracked specimen for practicing engineers in the NDT company. The crack of this kind, however, cannot be made by conventional machining, but should be made under thermal cyclic load that is close to the in-situ condition, which takes tremendous time due to the repetition. In this study, thermal loading condition is investigated to minimize the time for fabricating the cracked specimen using simulation technique which predicts the crack initiation and propagation behavior. Simulation and experiment are conducted under an initial assumed condition for validation purpose. A number of simulations are conducted next under a variety of heating and cooling conditions, from which the best solution to achieve minimum time for crack with wanted size is found. In the simulation, general purpose software ANSYS is used for the stress analysis, MATLAB is used to compute crack initiation life, and ZENCRACK, which is special purpose software for crack growth prediction, is used to compute crack propagation life. As a result of the study, the time for the crack to reach the size of 1mm is predicted from the 418 hours at the initial condition to the 319 hours at the optimum condition, which is about 24% reduction.

• Journal of the Microelectronics and Packaging Society
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• v.10 no.1
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• pp.45-50
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• 2003

Global full 3D finite element analysis fatigue models are constructed for flip-chip BGA on system board to predict the creep fatigue life of solder joints during the thermal cycling test. The fatigue model applied is based on Darveaux's empirical equation approach with non-linear viscoplastic analysis of solder joints. The creep life was estimated the creep life as the variations of the four kinds of thermal cycling test conditions, pad structure, composition and size of solder ball. The shortest fatigue life was obtained at the thermal cycling test condition from $-65^{\circ}C$ to $150^{\circ}C$. It was increased about 3.5 times in comparison with that from $0^{\circ}C$ to $100^{\circ}C$. At the same conditions, the fatigue life of SMD structure as the change of pad structure increased about 5.7% as compared with NSMD structure. Consequently, it was confirmed that the fatigue life became short as the creep strain energy density increased in solder joint.

• Proceedings of the Korean Institute of Navigation and Port Research Conference
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• 2005.10a
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• pp.283-288
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• 2005

Application of semiconductor sensors has widely spreaded into various industries because those have several merits like easy miniaturization and batch production comparison with previous mechanical sensors. But external conditions such as thermal and repetitive load have a bad effect on sensors's lifetime. Especially, this paper was focused on fatigue life of a interconnect made by various materials. Firstly we implemented the stress analysis for interconnect under thermal load and wording pressure. And the fatigue lifetime of each material was induced by Manson & Coffin Equation using the plastic stress-strain curve obtained by the plastic-elastic Finite Element Analysis.