Comparative Study on the Characteristics of Heat Dissipation using Silicon Carbide (SiC) Powder Semiconductor Module (탄화규소(SiC) 반도체를 사용한 모듈에서의 방열 거동 해석 연구)
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- Journal of the Microelectronics and Packaging Society
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- v.25 no.4
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- pp.89-93
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- 2018