• Transactions of the Korean Society of Mechanical Engineers A
• /
• v.34 no.2
• /
• pp.245-253
• /
• 2010

The reliability problems of flip chip packages subjected to temperature change during the packaging process mainly occur due to mismatches in the coefficients of thermal expansion as well as features with time-dependent material properties. Resin molding compounds like glass fiber reinforced epoxy composites used as the dielectric layer in printed circuit boards (PCB) strongly exhibit viscoelastic behavior, which causes their Young's moduli to not only be temperature-dependent but also time-dependent. In this study, the stress relaxation and creep tests were used to characterize the viscoelastic properties of the glass fiber reinforced epoxy composite. Using the viscoelastic properties, finite element analysis (FEA) was employed to simulate thermal loading in the pre-baking process and predict thermal warpage. Furthermore, the effect of viscoelastic features for the major polymeric material on the dielectric layer in the PCB (the glass fiber reinforced epoxy composite) was investigated using FEA.

• Korean Journal of Materials Research
• /
• v.10 no.4
• /
• pp.312-316
• /
• 2000

A study has been made to investigate the effects of hot isostatic pressing(HIP ping) on bond strength and elevated temperature characteristics of thermal barrier coating(TBC). The specimens were prepared by HIPping of TBC which is composed of the ceramic top coat(8wt%$Y_2$$O_3$-$ZrO_2$) and the metallic bond coat on the matrix of IN738LC superalloy. The results showed that the porosity and microcracks in the ceramic top coat of TBC were significantly decreased by HIP. As a result, the bond strength of the HIPped coating was increased above 48% compared to that of as-coated specimen and microstructure was homogenized. It was found that the thermal cycle resistance of HIPped coating was inferior to that of as-coated specimen. It was considered that this result was mainly caused by the reduction of internal defects in the top coat layer which could play a role in relaxing the thermal stress due to a large difference in thermal expansion between TBC and matrix.