• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 1995.10a
• /
• pp.199-203
• /
• 1995

The technology of Semi-Solid Forging (SSF) has been actively developed to fabricate near-net- shape products using light and hardly formable materials, the SSF process is composed of slug heating, forming, compression holding and ejecting step. After forming step in SSF, the slug is compressed during a certain holding time in order to be completely filled in the die cavity and be accelerated in solidification rate. The compression holding time that can affect mechanical properties and shape of products is important to make decision, where it is necessary to find overall hert transfer coefficeient properly which has large effect on heat transfer between slug and die. This paper presents the procedure to predict compression holding time of octaining the final shaped part with information of temperature and solid fraction for a cylindrical slug at compression hoiding step in closed-die compression process using heat transfer analysis considering latent heat by means of finite element method. The influence of the predicted compression hoiding time on mechanical properties of products is finally investigated by experiment.

• Journal of the Microelectronics and Packaging Society
• /
• v.22 no.2
• /
• pp.5-9
• /
• 2015

Thermal management becomes serious in 3D stacked IC because of higher heat flux, increased power generation, extreme hot spot, etc. In this paper, we reviewed the recent developments of thermal management for 3D stacked IC which is a promising candidate to keep Moore's law continue. According to experimental and numerical simulation results, Cu TSV affected heat dissipation in a thin chip due to its high thermal conductivity and could be used as an efficient heat dissipation path. Other parameters like bumps, gap filling material also had effects on heat transfer between stacked ICs. Thermal aware circuit design was briefly discussed as well.

• Magazine of the Korea Concrete Institute
• /
• v.8 no.4
• /
• pp.191-199
• /
• 1996

Cracks occur in mass concrete structures during construction if temperature of the concrete due to heat of hydration is suddenly changed. The temperature is also changed after placement of mass concrete by construction environments on structures. However, methods which can analyze the temperature history of mass concrete considering the construction environments have not been developed yet. In this research, an algorithm and finite element analysis program is developed for the analysis of temperature rise history of mass concrete considering quantitatively heat transfer coefficient and construction environmental conditions such as climate conditions, curing conditions, forms and form removal, and additive curing. By comparing analysis results of the program with experimental data, other research data, and analysis results by a finite element program ADINAT, validity and accuracy of the program is verified.

• Progress in Superconductivity and Cryogenics
• /
• v.7 no.1
• /
• pp.42-46
• /
• 2005

The resistive type high temperature superconducting fault current limiter (HTSFCL) limits the fault current using the resistance generated by fault current. The generated resistance by fault current makes large pulse power which makes the operation of HTSFCL unstable. So, the cryogenic cooling system of the resistive type HTSFCL must diffuse and eliminate the pulse energy very quickly. Although the best way is to make wide direct contact area between HTS winding and coolant as much as possible, HTS winding also needs the impregnation layer which fixes and protects it from electromagnetic force. This paper deals with the thermal conductivity and dielectric strength of some epoxy compounds for the impregnation of high temperature superconducting (HTS) winding in liquid nitrogen. The measured data can be used in the optimal design of impregnation for HTS winding. Aluminar filling increased the thermal conductivity of epoxy compounds. Hardener also affected the thermal and electric characteristic of epoxy compounds.

• Applied Microscopy
• /
• v.25 no.3
• /
• pp.90-98
• /
• 1995

In the Fe-Si system, a mixture of a($Fe_{2}Si_5$) - and ${\epsilon}$(FeSi)-composition powders was sintered and heat-treated subsequently at various temperatures and time to get thermoelectric ${\beta}$-phase($FeSi_2$) compacts. The different transformational sequences depending on the heat treating temperature were found through the investigation into phase transformation and microstructural development. That is, a rapid eutectoid decomposition of ${\alpha}{\to}{\beta}+Si$ occurred together with a accompanying slow reaction between the dispersed Si formed by above decomposition and the preexisted ${\epsilon}$ phase at temperatures below $830^{\circ}C$. The unreacted Si and the micropores formed due to the density change upon the transformation coarsened as heat treating time elapsed. At temperatures above $880^{\circ}C$, however, transformation was proceeded by a peritectoid reaction of ${\alpha}+{\epsilon}{\to}{\beta}$. It took at least 200min. to achieve 90% volume fracion of transformed ${\beta}$ phase, and the growth of micro-pores was also observed in this transformational sequence with prolonged heat treating time.

• Journal of Industrial Technology
• /
• v.19
• /
• pp.107-113
• /
• 1999

The microstructural evolution during mechanical alloying of elemental Fe and Si powders, average composition $Fe_{30}Si_{70}$ and $Fe_{50}Si_{50}$, has been investigated by X-ray diffraction (XRD), Scanning electron microscopy (SEM) and Differential scanning calorimetry (DSC). Mechanical alloying was performed by using a SPEX 8000 Mixer/Mill under argon atmosphere with/without hexane as a process control agent (PCA). In the presence of PCA, the milling process was dominated by fracture resulting in the decrease in particle size to about $1{\mu}m$. The structural development with milling time depended on the average composition of starting powders. The mixture of $Fe_{50}Si_{50}$ and $Fe_{30}Si_{70}$ resulted in the formation of FeSi(${\varepsilon}$ - phase) and $FeSi_2$(${\beta}$ - phase), respectively. In the case of $Fe_{33.3}Si_{66.7}$, a mixture and $FeSi_2({\beta})$ was formed. These results were discussed by considering the thermodynamics and kinetics concerning the milling process.

• Fire Science and Engineering
• /
• v.27 no.3
• /
• pp.72-79
• /
• 2013

Recently, building constructions have been developed toward high-rise, long span, and multi-complexed using the high strength materials, optimized section. But the structural behavior of steel structural members built with a high strength steel at fire condition is not clarified because of lacking of information of related references such as mechanical and thermal properties at high temperature situation. In this paper, to evaluate the structural stability of member or frame of steel framed building at fire situation through the engineering method, the mechanical and thermal experimental coupon tests have conducted at various high temperatures and the comparison to those of ordinary strength steels were done.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2011.02a
• /
• pp.166-166
• /
• 2011

연료전지 핵심 부품 가운데 하나인 분리판(Bipolar plate)는 막전극체(MEA), 기체확산층(GDL)과 함께 발생한 전류의 수집 및 전달, 반응 가스의 수송, 반응/생성물의 수송 및 제거, 반응열 제거 등을 위한 냉각수 전달 등의 다양한 역할을 담당한다. 이러한 역할을 위하여 분리판은 우수한 전기전도성, 열전도성, 화학적 안정성이 요구되어 진다. 기존의 연료전지용 분리판은 흑연계 소재 및 수지와 흑연을 혼합한 복합 흑연 재료를 통해 제조하여 요구 되어지는 물성을 만족시켜 왔으나 흑연계 분리판의 경우 강도 및 가스 밀폐성 측면에서 낮은 특성을 보이며 특히 고가의 제조 공정 비용과 낮은 양산성으로 인하여 자동차 연료전지 상용화에 수많은 해결 과제를 안고 있었다. 흑연계 분리판의 이러한 문제점을 대체하기 위한 연구로 최근 금속계 분리판의 적용 및 개발이 활발하게 진행되고 있다. 특히 금속계 분리판은 양산 제조 공정이 적용 가능하여 대량생산이 가능하며 자동차 연료전지 스택의 경량화 및 박판화가 가능하다는 장점을 가지고 있다. 그러나, 박판의 스테인리스강을 소재로 적용한 금속분리판의 양산을 위하여 반드시 선행되어야 할 연구가 바로 금형 코팅 연구이다. 일반 자동차 생산 금형을 평균 약 50만타로 예측한다면 연료전지 금속계 분리판 성형 금형의 현재 수명은 약 10만타로 추정 가능하다. 이러한 원인은 고하중의 프레스 사용과 정밀 금형으로 인한 극한 공정 조건으로 야기된 결과이며 문제 해결을 위하여 성형 금형에 PVD 코팅 적용 연구를 진행하였다. 성형 금형의 PVD 코팅 적용을 통하여 금형 교체 주기 감소를 통한 생산 원가 절감 및 이형성 개선을 통한 성형성 확보를 목표로 본 연구를 진행하였다.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2011.02a
• /
• pp.291-291
• /
• 2011

플라즈마에 노출된 재료 표면의 온도 증가는 다음과 같은 요인에 의해서 결정된다. 이온의 충돌에 의한 역학적 에너지, 이온의 중성화, 라디칼의 안정화에 의한 에너지 방출(잠열, latent heat), 플라즈마에서 방출된 빛의 흡수. 이중 식각을 위한 기판 바이어스에 의해서 주로 결정되는 이온 충돌 에너지와 잠열의 방출이 300 mm wafer용 유도 결합 플라즈마 식각 장치에서 소스 전력과 바이어스 전력에 따라서 어떻게 변화하는지 전산 유체 역학 모사 프로그램인 CFD-ACE를 이용하여 상용 식각 장비인 AMAT사의 DPS II를 대상으로 온도 분포의 변화를 계산하였다. 실험 결과와 비교를 위하여 다섯 곳에(상, 하, 좌, 우, 중심) 열전대를 부착한 온도 측정 웨이퍼를 기판의 위치에 설치하고 여러 가지 실험 조건에 대해서 온도의 변화를 측정하였다. Ar 10 mTorr에서 2열 병렬 안테나의 전력을 300 W에서 시간에 따른 온도의 변화를 측정하였다. 이때 wafer의 평균 온도는 $28.9^{\circ}C$에서 $150^{\circ}C$까지 12분 내에 상승하였으며 최고 온도에 도달한 다음에는 거의 일정하게 유지 되었다. Si의 식각에서 온도의 영향을 가장 크게 받는 반응은 F 라디칼에 의한 Si의 직접 식각이며 Arrhenius 식의 형태로 표현하면 0.116*exp (-1250/T)의 형태로 된다. 문헌에 보고된 계수를 이용해서 $29^{\circ}C$의 식각 속도와 플라즈마에 의한 가열 최고 온도인 $150^{\circ}C$ 때의 값을 비교해보면 3.3배의 차이가 난다. 따라서 4%내의 식각 균일도를 목표로 하는 폴리 실리콘 게이트 식각 장비의 설계에서는 플라즈마에 의한 가열 불균일을 상쇄 할 수 있는 히터와 냉각 구조의 최적 설계가 필요하다.

• Journal of Powder Materials
• /
• v.17 no.2
• /
• pp.107-112
• /
• 2010

Carbon-nanotube-embedded bismuth telluride (CNT/$Bi_2Te_3$) matrix composites were fabricated by a powder metallurgy process. Composite powders, whereby 5 vol.% of functionalized CNTs were homogeneously mixed with $Bi_2Te_3$ alloying powders, were successfully synthesized by using high-energy ball milling process. The powders were consolidated into bulk CNT/$Bi_2Te_3$ composites by spark plasma sintering process at $350^{\circ}C$ for 10 min. The fabricated composites showed the uniform mixing and homogeneous dispersion of CNTs in the $Bi_2Te_3$ matrix. Seebeck coefficient of CNT/$Bi_2Te_3$ composites reveals that the composite has n-type semiconducting characteristics with values ranging $-55\;{\mu}V/K$ to $-95\;{\mu}V/K$ with increasing temperature. Furthermore, the significant reduction in thermal conductivity has been clearly observed in the composites. The results showed that CNT addition to thermoelectric materials could be useful method to obtain high thermoelectric performance.