• Journal of Advanced Marine Engineering and Technology
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• v.35 no.8
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• pp.1041-1047
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• 2011

In this study, two types of die material cast iron was treated for surface hardening by using high power diode laser to improve mechanical properties of die which is using as essential production technology in the parts manufacturing in virtually all the infrastructure industries now. First of all, the heat treatment characteristics of FCD550 material which is spheroidal graphite cast iron, and through the heat treatment of HCI350 material which is flake graphite cast iron, the heat treatment characteristics of the two materials were compared. The hardness of hardened zone increased over 3 times over base material for both specimens, but as for required heat input, HCI350 was higher than FCD550 material depending on the heat conductivity of the materials by the content amount and shape of graphite contained in the material.

• Proceedings of the KSAR Conference
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• 2003.06a
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• pp.83-83
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• 2003

돼지 난자의 유리화 동결 처리 방법 중 난자를 담는 용기(loading vessel)의 재료로 최근에 알려진 것으로 open-pulled straws(OPS)[Vajta등, Mol Reprod Dev, 51:53-58, (1998)], electron microscope grids(EMG) [Martino등,Biol Reprod, 54:1059-1069, (1996)〕, nylon loop system(NLS) [Lane등, Fertil Steril,72: 1073-1078, (1999)] 등이 보고되고 있다. OPS는 1/4cc straws를 열을 가하여 길게 뽑아 내벽을 얇게 함으로써 filing된 난자나 수정란이 액체 질소와 접촉했을 때 유리화가 신속하게 되도록 하는 방법으로 돼지에서는 별로 보고된 것이 없다. EMG는 열전도가 예민한 전자현미경용 copper grid를 이용한 방법으로 최근 국내 기술진의 연구성적을 포함한 몇몇 학자들에 의하여 보고되었고 NLS는 0.5mm직경의 nylon loop를 이용하여 급속 동결한 성적이 보고되었으나, 돼지 난자에 응용 된 것은 없다. 따라서 이와 같은 동결 재료는 사람과 반추류, mouse외에 돼지 난자에 대하여는 전혀 시도되지 않았지만 유리화 동결기술에서 가장 중요한 실험으로 생각된다. 성공적인 유리화 동결을 위해서는 수정란이 냉각의 전도성이 빠르고, 작은 용액을 수정란과 같이 filling해야 하며 모든 동작이 신속 간편해야 하며 융해 방법도 초급속도의 융해가 요구되므로 이에 부합되어야 한다. 연구 목적은 돼지 난자를 유리화 동결/융해 시 동결 재료-straw/glass, copper grid, nylon 3가지에 대한 제작 방법, 난자 loading, 동결 처리, 보관 방법, 융해 방법 등을 난자의 회수, 수정 후 생존율을 비교 조사하여 가장 우수한 방법을 선택할 목적이었다. 수행 내용은 3가지의 재료의 sample을 제작하고 소독한 다음 준비된 돼지 COCs을 40시간동안 IVM한 후 난자를 5~l5개 정도로 선정 하여 준비된 VS 용액에 평형처리 하였다. 각 재료의 용기에 loading 한 후 동결/보관하였고, 융해는 역순으로 평형하여 maturation 배지에 3~4시간 배양한 다음 경검하고 IVF한 후 NCSU-23 배지에 담아 IVC 배양하면서 cell cleavage상태를 확인하였다.

• Journal of Adhesion and Interface
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• v.15 no.4
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• pp.169-173
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• 2014

The effect of filler sizes on the thermal diffusivity of Nylon 66/SiC composites was investigated. By loading 60 vol% of SiC fillers on Nylon 66, the thermal diffusivity of the composites increased more than 10 times than that of unfilled Nylon 66 and the thermal diffusivity of composites with filler sizes of $24{\mu}m$ and $76{\mu}m$ increased to $2.2{\times}10^{-2}cm^2/sec$ and $1.75{\times}10^{-2}cm^2/sec$, respectively. It is speculated that the smaller filler size ($24{\mu}m$) of SiC is more favorable for the formation of thermal conductive path that the larger size ($76{\mu}m$) of filler composites. The thermal diffusivity of Nylon 46/SiC 400 (60 vol%) composites was $1.61{\times}10^{-2}cm^2/sec$ that was lower than that of Nylon 66/SiC (60 vol%) composites.

• Journal of the Korean Wood Science and Technology
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• v.48 no.2
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• pp.217-230
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• 2020

Global warming has increased interest in reducing greenhouse gas emissions. And a policy has effort to reduce energy consumption as a greenhouse gas reduction plan. In Korea, 25% of total energy is consumed in the building sector. In order to reduce energy consumption of buildings, it is possible to expand the utilization of wood as a structural material or thermal insulation materials with low thermal conductivity. It is also reported that when used as an interior finishing material, the energy consumption of the building is reduced by up to 7% by insulation performance. In this study, the heat transfer characteristics and the heat capacity were compared according to the three type of finishing materials(cement, paulownia coreana, medium density fiberboard) normally used as indoor finish materials. Through this study, most of the heat transfer volumes are transferred in the form of radiant heat, and the result was derived from the highest amount of energy and heat transfer in the use of paulownia coreana. When indoor finishing materials are used as wood, it is deemed that energy efficiency inside the building will be improved.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.21 no.4
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• pp.596-601
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• 2020

Silicon carbide is considered a potentially useful material for high-temperature electronic devices because of its large band gap energy and p-type or n-type conduction that can be controlled by impurity doping. Accordingly, the thermoelectric properties of -SiC powder prepared by refined diatomite were investigated for high value-added applications of natural diatomite. -SiC powder was synthesized by a carbothermal reduction of the SiO₂ in refined diatomite using carbon black. An acid-treatment process was then performed to eliminate the remaining impurities (Fe, Ca, etc.). n-Type semiconductors were fabricated by sintering the pressed powder at 2000℃ for 1~5h in an N2 atmosphere. The electrical conductivity increased with increasing sintering time, which might be due to an increase in carrier concentration and improvement in grain-to-grain connectivity. The carrier compensation effect caused by the remaining acceptor impurities (Al, etc.) in the obtained -SiC had a deleterious influence on the electrical conductivity. The absolute value of the Seebeck coefficient increased with increasing sintering time, which might be due to a decrease in the stacking fault density accompanied by grain or crystallite growth. On the other hand, the power factor, which reflects the thermoelectric conversion efficiency of the present work, was slightly lower than that of the porous SiC semiconductors fabricated by conventional high-purity -SiC powder, it can be stated that the thermoelectric properties could be improved further by precise control of an acid-treatment process.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.15 no.8
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• pp.4802-4808
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• 2014

A plate-fin tube type heat exchanger has a lighter weight, approximately 30%, than the conventional circular-fin type condenser of household refrigerator. Because the low weight means low cost, it can have significant effects on the growth of related businesses if similar performance can be guaranteed. To check the possibility of the use of such a plate fin-tube condenser, experimental evaluations were performed in this study. Four different condensers including a conventional circular fin-tube condenser were used for the test. A well designed refrigerant supply system was used to supply similar conditions with a refrigerator, and the heat transfer rate and pressure drops of air side were measured precisely. As a result, the plate fin-tube type condensers showed a lower heat transfer rate of more than 13% than the conventional circular fin-tube type condenser, but the air side pressure drop was reduced and the heat transfer per unit weight was increased. Therefore, it shows the possibility of the use of a plate fin-tube type condenser after optimizing the air flow path and increasing the air flow to make a similar heat transfer rate.

• Applied Chemistry for Engineering
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• v.1 no.1
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• pp.83-90
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• 1990

The semiconducting $(Pb_1\;_xSn_x)_1$ $_yTe_y$, one of the low - temperature thermoelectric materials, has been prepared and its chemical composition and nonstoichiometry has been analyzed. The content of Pb in the specimens was determined by the complexometric back - titration method with EDTA and Pb(II) standard solutions. Te - content was analyzed with the redox titration method. The electrical conductivity and the thermoelectric power have also been measured by the DC 4 - probe and the heat-pulse technique, respectively. All of the specimens showed a nonstoichiometric behavior in their chemical compositions (Te excess), thus gave rise to a p - type semiconducting property, and the nonstoichoimetry became bigger as the Sn - content increased. The thermoelectric power vs. temperature results have been analyzed upon the basis of the Fermi level vs. temperature profiles in the saturation regime. The specimen of x=0.1 evolved a transition from p - to n - type property at about 670K, which has been explained by the fact that the mobility of electrons is bigger than that of holes in the temperature range of the intrinsic regime.

• Journal of the Korean Geotechnical Society
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• v.28 no.12
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• pp.5-15
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• 2012

In this study, a series of CFD (Computational Fluid Dynamics) numerical analyses were performed in order to evaluate the thermal performance of six full-scale closed-loop vertical ground heat exchangers constructed in a test bed located in Wonju. The circulation HDPE pipe, borehole and surrounding ground formation were modeled using FLUENT, a finite-volume method (FVM) program, for analyzing the heat transfer process of the system. Two user-defined functions (UDFs) accounting for the difference in the temperatures of the circulating inflow and outflow fluid and the variation of the surrounding ground temperature with depth were adopted in the FLUENT model. The relevant thermal properties of materials measured in laboratory were used in the numerical analyses to compare the thermal efficiency of various types of the heat exchangers installed in the test bed. The simulation results provide a verification for the in-situ thermal response test (TRT) data. The CFD numerical back-analysis with the ground thermal conductivity of 4 W/mK yielded better agreement with the in-situ thermal response tests than with the ground thermal conductivity of 3 W/mK.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.20 no.3
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• pp.29-34
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• 2019

Silicon carbide is considered to be a potentially useful material for high-temperature electronic devices, as its large energy band gap and the p-type and/or n-type conduction can be controlled by impurity doping. Particularly, electric conductivity of porous n-type SiC semiconductors fabricated from ${\beta}-SiC$ powder at $2000^{\circ}C$ in $N_2$ atmosphere was comparable to or even larger than the reported values of SiC single crystals in the temperature region of $800^{\circ}C$ to $1000^{\circ}C$, while thermal conductivity was kept as low as 1/10 to 1/30 of that for a dense SiC ceramics. In this work, for the purpose of decreasing sintering temperature, it was attempted to fabricate porous reaction-sintered bodies at low temperatures ($1400-1600^{\circ}C$) by thermal decomposition of polycarbosilane (PCS) impregnated in n-type ${\beta}-SiC$ powder. The repetition of the impregnation and sintering process ($N_2$ atmosphere, $1600^{\circ}C$, 3h) resulted in only a slight increase in the relative density but in a great improvement in the Seebeck coefficient and electrical conductivity. However the power factor which reflects the thermoelectric conversion efficiency of the present work is 1 to 2 orders of magnitude lower than that of the porous SiC semiconductors fabricated by conventional sintering at high temperature, it can be stated that thermoelectric properties of SiC semiconductors fabricated by the present reaction-sintering process could be further improved by precise control of microstructure and carrier density.

• Fire Science and Engineering
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• v.33 no.1
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• pp.60-68
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• 2019

The paper reports the characteristics of conduction heat transfer to the backside part according to the heating temperature of a composite wall in a lightweight partition used for indoor space compartments. Stud partitions, SGP partitions, sandwich panels, urethane foam panels, and glass wool panels. which are generally used as light-weight partition walls, were selected as experiment samples, and the characteristics of conduction heat transfer to the backside part as the top surface were analyzed by applying heating temperatures of $200^{\circ}C$, $300^{\circ}C$, $400^{\circ}C$, and $500^{\circ}C$ to the bottom surface for 1800 s. According to the experimental results, the maximum backside temperatures at the maximum heating temperature of $500^{\circ}C$ was $51.6^{\circ}C$, $63.6^{\circ}C$, $317.2^{\circ}C$, $124.9^{\circ}C$, and $42.2^{\circ}C$ for the stud partition, SGP partition, sandwich panel, urethane foam panel, and glass wool panel, respectively. The maximum conduction heat- transfer rates at $500^{\circ}C$ were 17.16 W, 18.39 W, 136.65 W, 14.34 W, and 5.57 W for the stud partition, SGP partition, sandwich panel, urethane foam, and glass wool panel, respectively.