• Title/Summary/Keyword: 열압착

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Cu Thickness Effects on Bonding Characteristics in Cu-Cu Direct Bonds (Cu 두께에 따른 Cu-Cu 열 압착 웨이퍼 접합부의 접합 특성 평가)

  • Kim, Jae-Won;Jeong, Myeong-Hyeok;Carmak, Erkan;Kim, Bioh;Matthias, Thorsten;Lee, Hak-Joo;Hyun, Seung-Min;Park, Young-Bae
    • Journal of the Microelectronics and Packaging Society
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    • v.17 no.4
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    • pp.61-66
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    • 2010
  • Cu-Cu thermo-compression bonding process was successfully developed as functions of the deposited Cu thickness and $Ar+H_2$ forming gas annealing conditions before and after bonding step in order to find the low temperature bonding conditions of 3-D integrated technology where the interfacial toughness was measured by 4-point bending test. Pre-annealing with $Ar+H_2$ gas at $300^{\circ}C$ is effective to achieve enough interfacial adhesion energy irrespective of Cu film thickness. Successful Cu-Cu bonding process achieved in this study results in delamination at $Ta/SiO_2$ interface rather than Cu/Cu interface.

Characterization and observation of Cu-Cu Thermo-Compression Bonding using 4-point bending test system (4-point bending test system을 이용한 Cu-Cu 열 압착 접합 특성 평가)

  • Kim, Jae-Won;Kim, Kwang-Seop;Lee, Hak-Joo;Kim, Hee-Yeon;Park, Young-Bae;Hyun, Seung-Min
    • Journal of the Microelectronics and Packaging Society
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    • v.18 no.4
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    • pp.11-18
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    • 2011
  • The quantitative interfacial adhesion energy of the Cu-Cu direct bonding layers was evaluated in terms of the bonding temperature and Ar+$H_2$ plasma treatment on Cu surface by using a 4-point bending test. The interfacial adhesion energy and bonding quality depend on increased bonding temperature and post-annealing temperature. With increasing bonding temperature from $250^{\circ}C$ to $350^{\circ}C$, the interfacial adhesion energy increase from $1.38{\pm}1.06$ $J/m^2$ to $10.36{\pm}1.01$ $J/m^2$. The Ar+$H_2$ plasma treatment on Cu surface drastically increase the interfacial adhesion energy form $1.38{\pm}1.06$ $J/m^2$ to $6.59{\pm}0.03$ $J/m^2$. The plasma pre-treatment successfully reduces processing temperature of Cu to Cu direct bonding.

Analysis of nutrients and antioxidants of sterilized and non-heat-pressed perilla oil (살균 및 비가열압착한 들깨오일의 영양성분 및 항산화 분석)

  • Kim, Yang-Hee;Chang, Ji-Hwe;Ha, Seo-Yeong;Park, Su-Jin;Park, Seon-Young;Jung, Tae-Hwan;Hwang, Hyo-Jeong;Shin, Kyung-Ok
    • Korean Journal of Food Science and Technology
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    • v.54 no.3
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    • pp.264-271
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    • 2022
  • In this study, the nutritional properties of sterilized and non-heat-pressed raw perilla oil (SRPO) were studied and its potential as a functional food was evaluated. The copper, cobalt, and calcium levels were high in sterilized and SRPO. The total polyphenol content and ABTS radical scavenging activity were the highest in SRPO, whereas nitrite scavenging activity was the highest in 45℃ cold pressed perilla oil (CPPO). The above results confirmed that sterilized and non-heat-pressed perilla oil had high mineral and total polyphenol contents, as well as ABTS radical scavenging activity and nitrite scavenging ability. The peroxide value of SRPO decreased as the storage period increased, and the acid value of low-temperature pressed perilla oil over 65℃ (LPPO) significantly increased. This work also provided an opportunity to develop a new method for manufacturing perilla oil, and it is hoped that these experiments will form a basis for the commercialization of perilla oil.

Fabrication of Porous Cu Layers on Cu Pillars through Formation of Brass Layers and Selective Zn Etching, and Cu-to-Cu Flip-chip Bonding (황동층의 형성과 선택적 아연 에칭을 통한 구리 필라 상 다공성 구리층의 제조와 구리-구리 플립칩 접합)

  • Wan-Geun Lee;Kwang-Seong Choi;Yong-Sung Eom;Jong-Hyun Lee
    • Journal of the Microelectronics and Packaging Society
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    • v.30 no.4
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    • pp.98-104
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    • 2023
  • The feasibility of an efficient process proposed for Cu-Cu flip-chip bonding was evaluated by forming a porous Cu layer on Cu pillar and conducting thermo-compression sinter-bonding after the infiltration of a reducing agent. The porous Cu layers on Cu pillars were manufactured through a three-step process of Zn plating-heat treatment-Zn selective etching. The average thickness of the formed porous Cu layer was approximately 2.3 ㎛. The flip-chip bonding was accomplished after infiltrating reducing solvent into porous Cu layer and pre-heating, and the layers were finally conducted into sintered joints through thermo-compression. With reduction behavior of Cu oxides and suppression of additional oxidation by the solvent, the porous Cu layer densified to thickness of approximately 1.1 ㎛ during the thermo-compression, and the Cu-Cu flip-chip bonding was eventually completed. As a result, a shear strength of approximately 11.2 MPa could be achieved after the bonding for 5 min under a pressure of 10 MPa at 300 ℃ in air. Because that was a result of partial bonding by only about 50% of the pillars, it was anticipated that a shear strength of 20 MPa or more could easily be obtained if all the pillars were induced to bond through process optimization.

The Study on Skin Adhesive Technology for Automotive Interior Using the Vacuum Suction Process (진공흡착공정을 이용한 자동차 내장부품의 표피재 접착기술에 관한 연구)

  • Kim, Key-Sun;Kim, Sung-Wha
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.12 no.3
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    • pp.1045-1050
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    • 2011
  • This study proposed the new pressing method under heat for the plastic automotive interior part in order to make embossing on the skin of the raw material of the part. The raw material is laid on the lower mold and it is pressed by the upper one with embossing shape. The air is suctioned from the inside of both molds for producing tension and making embossing shapes on the skin of the part without its breakage. The corresponding molds and test machines are made and the proposed manufacturing process is validated.

Research on Co-processing Effect of Acanthopanax Leaves with Soybean Processing by-products (콩가공부산물 활용한 가시오가피 잎의 효과 증진 가공연구)

  • Ji Yun Ko;Su Ye Ahn;Hee Soon Cheon;Byung Hun Um
    • Proceedings of the Plant Resources Society of Korea Conference
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    • 2020.08a
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    • pp.102-102
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    • 2020
  • 가시오가피(Acanthopanax senticosus)는 오갈피나무과(두릅나무과, Araliaceae)에 속한 낙엽관목인 가시오갈피나무 Acanthopanax senticosus Seem. 또는 기타 동속 식물의 뿌리 및 줄기 껍질이다. Acanthopanax 속 식물의 잎에 대한 약리 연구로는 위장보호작용, 항산화작용, 소염진통작용, 항암작용, 항균작용, 심근경색 개선 작용, 혈당강하작용 등에 대한 탁월한 효과가 알려져 있다. 그 중 가시오가피는 모든 오갈피 나무를 통틀어 약효가 가장 높고 보약의 역할을 한다. 인삼의 가공 과정을 적용하여 가시오가피를 증숙하면 수배에서 수십배까지 생이용성과 생리활성이 증진되나, 이렇게 제조하기 위해서는 증숙 및 냉각하는 공정을 반복적으로 가하고 효소 처리하는 증 가공 공정으로 의해 가격이 증가하게 된다. 콩단백은 콩기름이나 두부를 제조하고 남은 부산물로 영양학적으로 쇠고기 단백질과 비견할 만큼 우수한 영양학적 가치를 가지지만, 이용되는 양은 현저히 적어 이에 따른 활용도가 요구되고 있다. 압착대두 단백은 압착방식으로 기름을 짜고 남은 부산물을 파우더 형태로 가공하여 6% 가량의 지방질과 Glutamic acid, Arginine, Aspartic acid, Alanine 등 여러 가지 필수 아미노산을 제공한다. 이에, 본 연구에서는 압착대두단백과 두부건조분말을 가시오가피 소재의 기능증진 소재로 활용하고자 한다. 건조 가시오가피와 콩단백 분말의 비율을 1:0, 1:1, 1:10, 10:1로 하여, 고온고압 혼합 가공한 효과를 측정하였다. 가시오가피 단독 가공한 것에 비하여, 가시오가피-콩단백 가공물에서 가시오가피 단독 열가공에 비해, 가시오가피의 항산화도가 약 2-4배 증가하였고, 가시오가피 사포닌의 생이용성이 현격하게 증가함을 확인하였다. 본 연구는 콩가공 부산물의 고부가가치 산업화에 기여할 뿐만 아니라, 가시오가피 산업 활성에도 기여할 수 있을 것으로 기대된다.

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Thermo-compression Bonding of Electrodes between RPCB and FPCB using Sn-Pb Solder (Sn-Pb 솔더를 이용한 경연성 인쇄 회로 기판간의 열압착 본딩)

  • Choi, Jung-Hyun;Lee, Jong-Gun;Yoon, Jeong-Won;Jung, Seung-Boo
    • Journal of the Microelectronics and Packaging Society
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    • v.17 no.3
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    • pp.11-15
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    • 2010
  • In this paper, we focused on the optimization of bonding conditions for the successful thermo-compression bonding of electrodes between the RPCB and FPCB with Sn-Pb solder. The peel strength was proportionally affected by the bonding conditions, such as pressure, temperature, and time. In order to figure out an optimized bonding condition, fracture energies were calculated through F-x (force-displacement) curves in the peel test. The optimum condition for the thermo-compression bonding of electrodes between the RPCB and FPCB was found to be temperature of $225^{\circ}C$ and time of 7 s, and its peel strength was 22 N/cm.

The Purification of Korean Traditional Soybean Sauce by Ultrafiltration Membrane (한외여과막을 이용한 재래식 간장의 정제)

  • 신재균;장재영;김정학;황기호
    • Proceedings of the Membrane Society of Korea Conference
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    • 1994.04a
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    • pp.24-25
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    • 1994
  • 한식간장은 콩을 주원료로 하여 콩속의 성분을 수용성단백질 및 아미노산으로 변화시켜만든 조미료로서, 콩으로 메주를 만든다음 20일 동안 배양해서 만든 종국(Seed)과 혼합후 발효시킴으로써 제조되며 발효공정을 통해 Total Nitrogen이 증가되게 된다. 이러한 한식간장은 탈지대두를 사용하는 양조간장과는 달리 메주를 쑤어서 만들기 때문에 탈지가 되지 않은 제조과정으로 인하여 여과 및 공정중 발생하는 잡물질의 제거가 어렵게 된다. 제조공정중 여과공정을 거치게 되는데 여과포를 사용한 압착공정으로 이루어지며 여과된 간장에는 발효에 사용된 균$\cdot$효모등이 $10^7$개/ml 수준으로 존재하여 저장안정성 및 품질보전을 위해 열처리 과정을 거치게 된다. 이 열처리가 끝난 간장은 방치$\cdot$냉각시켜 첨가제를 혼합한 후 포장된다. 냉각과정중 2차 침전물이 생성되기도 하며 멸균이 확실치 않거나 2차 오염등으로 인한 발효로 인해 $CO_2$ Gas가 발생하기도 하여 품질이 나빠지는 원인이 된다. 이러한 열살균방식은 에너지를 많이 소비하고 열살균시 간장성분으로 인한 Scale 형성등 문제점을 안고 있다. 또한 열살균을 통해 살균은 할 수 있지만 사균, 분해물질, 간장에 함유된 고약한 냄새를 풍기는 잡성분의 제거는 불가능하다.

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Characteristics of Pressure Distribution of Journal Bearing according to Lining Material (라이닝 재료에 따른 저널 베어링의 압력 분포 특성)

  • Shin, Sang-Hoon;Rim, Chae Whan;Ko, Dae-Eun
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.18 no.9
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    • pp.480-485
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    • 2017
  • The main reason for the heat induced accidents occurring at the after stern tube journal bearing is the excessive local pressure caused by the deflection of the propulsion shaft due to the propeller loads. It is expected that the contact area could beenlarged and the local pressure reduced accordingly by using a lining material having alow Young's modulus instead of the existing white metal. The purpose of this work is to investigate the characteristics of the pressure distribution and determine the allowable pressure value in the case where bearing products made of materials having a low Young's modulus are used. In this study, the propeller loads, heat effect, and hull deflection are considered in the evaluation of the local pressure of the ship propulsion shaft. Also, the Hertzian contact condition was applied. From the analysis results in the case where a lining material with a low Young's modulus was used, it was found that a robust design could be achieved and the local pressure could be reduced effectively independent of the load conditions. It will be possible to producenew products made of materials having a low Young's modulus if the manufacturer confirms the performance specifications drawn by this study.