• Journal of the Korea Academia-Industrial cooperation Society
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• v.16 no.2
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• pp.947-951
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• 2015

The objective of this study is to numerically investigate the cooling characteristics of the heat sink as a cooling device for the amplifier. In order to analyze the heat transfer performances of the heat sink, the steady-state thermal model of the ANSYS software was used and analyzed with the fin thickness, fin pitch and fin number of the heat sink. As a result, the temperature at the junction of heat sink was decreased with the increase of fin thickness and fin number. In addition, the thermal resistances of the heat sinks were enhanced from $0.764^{\circ}C/W$ to $0.739^{\circ}C/W$ and $1.254^{\circ}C/W$ to $0.610^{\circ}C/W$, respectively, with the increase of the fin thickness from 1 mm to 3 mm and fin number from 9 to 20, respectively.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.11 no.3
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• pp.391-400
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• 1999

The efficiency and capacity of an air source heat pump system decrease as the ambient temperature drops. One strategy of avoiding the decrease of the efficiency and capacity in air source heat pump system is to switch to another thermal energy source. Water can be a good candidate for the heat source. This paper presents the results of the performance analysis of heat pump system with a single unit dual source(SUDS) evaporator The heat exchanger combines two separated evaporators into a single evaporator and the object of the SUDS evaporator is to recover energy from dual heat sources, i.e. air and water. Simulation program is developed for the dual source heat pump system with a SUDS evaporator and experimental data are obtained and compared with the simulation results. Differences in heating capacity and COP are 7% and 8% respectively. Simulation results are in good agreement with the test results. Therefore, the developed program is effectively used for the design and performance prediction of the dual source heat pump system with a SUDS evaporator.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.36 no.6
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• pp.571-578
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• 2012

In this paper, an experimental investigation is performed to estimate the thermal performance of a natural convective heat sink with plate fins subject to the uniform wall temperature condition. Extensive experiments are performed with various input powers, fin spacings, and heights of the natural convective heat sinks with plate fins. In particular, the effect of the inclination angle on the thermal performance of the heat sink is studied. In order to validate the experimental data, the experimental results are compared with results from previous studies. Based on the experimental results, the appropriate ranges of the previous correlations between the input power, the fin spacing, the fin height, and the inclination angle for the natural convective heat sink with plate fins are evaluated.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.15 no.7
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• pp.4072-4080
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• 2014

The Peltier Module has been used to dissipate the heat from electronic devices and electronic components. In this module, a heat sink is used to release the operating heat into the air outside. This study addressed the heat transfer characteristics for a heat sink with an inner tunnel. Under forced and natural convection conditions, the heat transfer characteristics were different. Therefore, the cooling and heating performances were studied for the heat sink, which has an inner tunnel. The heat transfer conditions were also evaluated by performing an experimental test, which investigated the heat transfer characteristics related to the variance in time and temperature distribution. Experiments on the heat transfer characteristics of the heat sink were conducted based on the forced and natural convection and temperature distribution changes. In the cooling experiment, the A- and B-shaped cooling pin heat sinks decreased the temperature of the forced convection than the temperature of natural convection. In the forced and natural convection, the A- and B-shaped decreased to a minimum of $-15^{\circ}C$. Under the forced and natural convection conditions, A- and B-shaped cooling pin heat sinks decreased the temperature when the voltage was increased. In the heating experiment, the A- and B-shaped cooling pin heat sinks increased the temperature of the forced convection than the temperature of natural convection. In forced convection, when the voltage was $15^{\circ}C$, the temperature of the A-shaped cooling pin heat sink increased to $150^{\circ}C$, and the temperature of the B-shaped cooling pin heat sink increased to $145^{\circ}C$. Under forced and natural convection conditions, the A- and B-shaped cooling pin heat sinks showed an increase in temperature with increasing voltage.

• Journal of Advanced Marine Engineering and Technology
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• v.37 no.1
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• pp.35-39
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• 2013

This paper reports numerical study results with respect to the thermal behavior of a natural convection cooled hybrid fin heat sink (HFH). The HFH consists of hybrid fins, hollow pin fins integrated with plate fins. The thermal performance of the HFH was numerically investigated by employing a commercial CFD software package and compared with that of the pin fin heat sink (PFH). Numerical study has found that array-based and mass-based heat transfer coefficients of the HFH are 12% and 37% greater than those of the PFH, respectively. Extended surface area and lighter weight may explain the better thermal performance of the HFH than the PFH.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.13 no.10
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• pp.4398-4404
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• 2012

This thesis was conducted a numerical analysis on the radiant heat performance according to factors of design of heat sink for cooling of the automotive LED head lamp. The heat sinks were designed with 5 different types to fit the limited internal space by formula based on an existing product (Type 1). Designed heat sinks of five types were analyzed by ANSYS CFD V12.1, and the analysis results were compared with the existing type. The results of simulation were analyzed temperature distribution and average temperature, air flow characteristic, heat flux etc. This thesis was researched on the correlation of the cooling performance according to the heat sink structure and the fin shape. Through numerical analysis, could be confirmed heat sink Type 2 as the best results.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.42 no.9
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• pp.789-794
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• 2014

The FPGA is used to the high speed digital satellite communication on the Digital Signal Process Unit of the next generation GEO communication satellite. The high capacity FPGA has the high power dissipation and it is difficult to satisfy the derating requirement of temperature. This matter is the major factor to degrade the equipment life and reliability. The thermal control at the equipment level has been worked through thermal conduction in the space environment. The FPGA of CCGA or BGA package type was mounted on printed circuit board, but the PCB has low efficient to the thermal control. For the FPGA heat dissipation, the heat sink was applied between part lid and housing of equipment and the performance of heat sink was confirmed via thermal vacuum test under the condition of space qualification level. The FPGA of high power dissipation has been difficult to apply for space application, but FPGA with heat sink could be used to space application with the derating temperature margin.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.15 no.8
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• pp.4749-4755
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• 2014

In this study, to maximize the heat release from the heat generating environment, such as a high-capacity inverter, the heat release performance of the extruded-type heat sinks with the variation of the base thickness were investigated using the experimental and numerical methods. The base thickness was varied from 5 to 14 mm. The heat release was characterized by the amount of heat released through the heat sink, the surface temperature of heat sink base between the heat sources, and temperature of heat sources. The surface temperatures between heat sources and the amounts of heat release were improved more as the base thickness was decreased. In contrast, the temperatures of the heat sources decreased with increasing base thickness. Based on the case study of these heat sinks, it is believed that a heat sink with a 9.5mm-thick base was optimized for the heat release.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.36 no.4
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• pp.385-390
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• 2012

A radial heat sink, adopted to LED(light emitting diode) downlight, was optimized. Discrete transfer radiation model (DTRM) was used to calculate radiation heat transfer, and numerical model was verified with experimental results. The effects of number of fin, long fin length and middle fin length on overall thermal resistance and radiation heat transfer were analyzed. As the emissivity increased, thermal resistance decreased due to the increment of radiation heat transfer. The radial heat sink was optimized and optimum number of long fins is 19~28, optimum length of long fin is about half of radius of heat fink and optimum fin ratio is 0.4~0.7.

• Journal of Advanced Marine Engineering and Technology
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• v.40 no.9
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• pp.786-790
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• 2016

This paper discusses numerically explored orientation effects on the thermal performance of hollow hybrid fin heat sinks (HHFHSs) under natural convection. A HHFHS consists of an array of hollow pin fins concatenated with plate fins and having perforations near the fin bases. Orientation effects on the footprint-based and mass-based thermal performance of the HHFHS were numerically studied for orientation angles ranging from $0^{\circ}$ to $180^{\circ}$. The performance of the HHFHS was compared with that of a pin fin heat sink (PFHS) having similar physical parameters. The results show that the thermal resistance of the HHFHS did not vary considerably from $0^{\circ}$ to $45^{\circ}$. The thermal resistance increased from $45^{\circ}$ to $90^{\circ}$, reached its maximum at $90^{\circ}$, and decreased consistently from $90^{\circ}$ to $180^{\circ}$. Dissimilar behaviors of the thermal resistance of the HHFHS vs. the PFHS resulted mainly from the effect of heat pumping induced by the internal flows of the hollow fins. Despite various orientations, the mass-based thermal resistance of the HHFHS was found to be nearly 30% smaller than that of the PFHS. This result shows the feasibility of the HHFHS for the lightweight thermal management of electronics under natural convection.