• Korean Journal of Materials Research
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• v.7 no.9
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• pp.789-794
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• 1997

7050AI합금의 미세조직 및 기계적성질에 미치는 2단시효처리의 영향을 투과전자현미경, 열분석, 경도시험 및 인장 시험을 통하여 조사하였다. 12$0^{\circ}C$에서 6시간 1차 시효처리한 후 1$65^{\circ}C$와 175$^{\circ}C$에서 2차 시효처리하였을때 1$65^{\circ}C$에서는 6시간 시효시 최대경도값 201.3Hv를 나타내었고, 175$^{\circ}C$에서는 3시간 시효처리하였을때 최대경도값 197Hv를 나타내었다.

• Journal of Welding and Joining
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• v.12 no.1
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• pp.38-43
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• 1994

고강도 알루미늄합금은 중량이 가벼우면서 인장강도와 항복강도가 높고 가공성, 성형성이 좋아 항공기, 자동차, 선박 등 수송용 재료로 각광을 받고 있으며, 이 중 Al-Zn-Mg계(7000계) 알루미늄 합금은 용접 구조물용 경량소재로 활용범위가 높다. Al-Zn-Mg계 알루미늄 합금은 고온에서 용체화 처리후 저온으로 급냉시킨 재료를 자연시효 또는 인공시효처리를 하여 이 때 석출되는 시효 석출물에 의해 강도를 증가시킨 석출 경화형 합금이다. 그런데, 7000계열 알루미늄합금은 적절한 열처리 작업을 통해 최적의 기계적 성질이 얻어지도록 합금설계가 되어있기 때문에 구조물 제작시 용접에 의한 ARC 열을 받게 되면 열이력(thermal cycle)에 의해 모재의 미세조직이 변화하고 용접 결함이 발생하며 강도의 약화와 함께 내식성 등이 저하한다. 따라서 고강도 알루미늄합금의 용접성을 향상시키기 위해서는 용접부의 미세조직거동과 용접부에 발생하는 용접결함의 현상을 조사하여 용접용 고강도 합금에 필수적으로 요구되는 용접성에 대한 검토가 충분히 이루어져야 한다. 따라서 본 고에서는 알루미늄합금, 특히 7000계열 알루미늄합금에 주목하여, 용접방법, 각종 결함과 대책, 용접부의 시효경화와 응력부식균열 및 기계적 성질 등을 지금까지 보고된 각종 자료를 기초로 하여 3회에 걸쳐 기술하고자 한다.

• Restorative Dentistry and Endodontics
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• v.33 no.1
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• pp.45-53
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• 2008

The purpose of this study was to determine the effects on the elastic moduli of the adhesive and the hybrid layer from thermocycling. Twenty one human molars were used to create flat dentin surfaces. Each specimen was bonded with a light-cured composite using one of three commercial adhesives (OptiBond FL [OP], Clearfil SE Bond [CL], and Xeno III [XE]). These were sectioned into two halves and subsequently cut to yield 2-mm thickness specimens; one specimen for immediate bonding test without thermocycling and the other subjected to 10,000 times of thermocycling. Nanoindentation test was performed to measure the modulus of elasticity of the adhesive and the hybrid layer, respectively, using an atomic force microscope. After thermocycling, XE showed a significant decrease of the modulus in the adhesive layer (p < 0.05). Adhesives containing hydrophilic monomers are prone to hydrolytic degradation. It may result in the reduced modulus of elasticity, which leads to the mechanically weakened bonding interface.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.2
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• pp.49-55
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• 2011

The failure of electronic instruments is mostly caused by heat and shock. This shock causes the crack initiation at the solder joint interface of PCB component which is closely related with the formation of intermetallic compound(IMC). The Ag content in Pb-free Sn-xAg-0.5Cu solder alloy used in this study was 1.0, 1.2 and 3.0 wt.%, respectively. After soldering with PCB component, isothermal aging was performed to 1000 hrs. The growth of IMC layer was observed during isothermal aging. The drop impact property of solder joint was evaluated by impact bending test method. The solder joint made with the solder containing lower Ag content showed better impact bending property compared with that with higher Ag content. On the contrary to this result, the solder joint made with solder containing higher Ag content showed better impact bending property after aging. It should be caused by the formation of fine $Ag_3Sn$, which relieved the impact. It showed consequently the different effect of fine $Ag_3Sn$ and coarse $Cu_6Sn_5$ particles formed in the IMC layer on the impact bending property.

• Proceedings of the Korean Institute of Industrial Safety Conference
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• 2003.10a
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• pp.107-112
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• 2003

형상기억합금(shape memory alloy; SMA)은 소성가공을 통하여 원하는 형태로 변형시킨 이후에도(현재로서는 최대 10%미만의 변형) 일정조건의 열을 가하면 원래의 형상으로 복원되는 합금을 말한다. 형상기억효과는 고상(solid state)에서의 금속조직이 오스테나이트(austenite: 이하 A 또는 B2상)로부터 마르텐사이트(martensite: 이하 M 또는 B19'상)로, 다시 역으로 마르텐사이트에서 오스테나이트로의 변태에 기인되는 것으로 밝혀지고 있으며 이러한 변태는 온도유기변태(temperature induced transformation)와 응력유기변태(stress induced transformation)로 분류할 수 있다.(중략)

• Journal of the Microelectronics and Packaging Society
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• v.17 no.1
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• pp.25-31
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• 2010

In this study, we investigated the morphology and thermal stability of interfacial phases in joint between lead free solder(Sn-3.0Ag-0.5Cu) and electroless Ni-W-P under bump metallizations(UBM) with different tungsten contents as a function of thermal aging. Content of phosphorus of each deposits was fixed at 8 wt.%, and content of tungsten was variated each 0, 3, 6 and 9 wt.%. Specimens were prepared by reflowing at $255^{\circ}C$, aging range was $200^{\circ}C$ and up to 2 weeks. After reflow process, in the electroless Ni(W)-P/solder joint, the interfacial intermetallic compound(IMC) was showed both $(Cu,Ni)_6Sn_5$ and $(Ni,Cu)_3Sn_4$. UBM and generated IMC at the interface of lead free solder was proportionally increased with aging time. The thickness of IMC was increased because the generation rate of $Ni(W)_3P$ decreased with increasing contents of W.

• Journal of Advanced Marine Engineering and Technology
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• v.26 no.1
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• pp.68-75
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• 2002

Stellite 12 alloy-powders were overlaid on 410 stainless steel valve seat by plasma transferred arc(PTA)process. Variation of microstructure and hardness of overlaid deposit with aging time at $750^{\circ}C$ was investigated. The deposit showed hypoeutectic microstructure, which was consisting of primary cobalt dendrite and networked $M_{7}C_{3}$type eutectic carbides. After aging new M_{23}C_{6}$ carbide was formed by the partial decomposition of $M_7C_3$ type eutectic carbides and finely dispersed $M_{23}C_6$ type carbides were also precipitated in the matrix. Hardness of the deposit was increased with increase of aging time at $750^{\circ}C$ and showed maximum value at 35hours. After showing maximum value, it was fallen down again at 70hours because of overaging. The increase of hardness in aging is ascribed to the formation of new stable $M_{23}C_6$ type carbide by the partial decomposition of $M_7C_3$ type eutectic carbides and also precipitation of finely dispersed $M_{23}C_6$ carbides in matrix.

• Proceedings of the Materials Research Society of Korea Conference
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• 2010.05a
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• pp.46.2-46.2
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• 2010

최근 수송기기 및 전자부품산업에서의 성능향상 요구에 따라 경량고강도 비철금속재료의 수요가 증대되고 있다. 특히, 세계적으로 에너지 절약 및 환경 공해 규제가 대폭 강화됨에 따라 자동차, 항공기 등 수송기기의 소재경량화 소재로 낮은 밀도 기계적 가공성이 우수한 마그네슘 합금이 각광을 받고 있다. 그러나 Mg합금은 알루미늄 합금과는 달리 보호성 산화피막이 형성되지 않아 내식성 및 고온강도가 매우 취약하다. 이를 보안하기 위해서 본 연구에서는 마그네슘의 강도 개선을 위한 원소로써 고용강화 원소로 많이 쓰이는 Zn과 입자 미세화로 인한 항복강도를 증가시키는 Mn의 3원계 합금에 고온에서 안정한 Mg2Sn상이 형성되는 Sn을 첨가하여 시효처리에 따른 기계적 특성과 미세조직을 관찰하였다. 실험 이전에 Pandat Program에 의한 열역학적 분석을 바탕으로 Mg-Zn-Mn 및 Mg-Zn-Mn-Sn의 상태도 계산 및 MgZn와 Mg2Sn 석출분율을 예측하였다. 열역학 계산을 통해 도출된 석출온도를 통해 Mg-Zn-Mn 및 Mg-Zn-Mn-Sn 합금의 열처리에 따른 경도 및 미세구조를 관찰하였다. 또한, 기계적 특성을 평가하기 위해 상온 및 고온 인장시험을 실시하였고 XRD, SEM을 이용하여 석출상을 분석하였다.

• Journal of the Korean Society of Safety
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• v.30 no.6
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• pp.7-11
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• 2015

The present study investigates the impact shear strength of thermal aged Sn-3Ag-0.5Cu lead-free solder joints at impact speeds ranging from 0.5 m/s to 2.5 m/s. The specimens were thermal aged for 24, 100, 250 and 1000 hours at $100^{\circ}C$. The experimental results demonstrate that the shear strength of the solder joint decreases with an increase in the load speed and aging time. The shear strength of the solder joint aged averagely decreased by 43% with an increase in the strain rate. For the as-reflowed specimens, the mode II stress intensity factor ($K_{II}$) of interfacial IMC between Sn-3.0Ag-0.5Cu and a copper substrate also was found to decrease from $1.63MPa.m^{0.5}$ to $0.97MPa.m^{0.5}$ in the speed range tested here. The degradations in the shear strength and fracture toughness of the aged solder joints are mainly caused by the growth of IMC layers at the solder/substrate interface.

• Restorative Dentistry and Endodontics
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• v.31 no.6
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• pp.415-426
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• 2006

In this study, the changes in the degree of conversion (DC) and the microtensile bond strength (MTBS) of self-etching adhesives to dentin was investigated according to the time after curing. The MTBS of Single Bond (SB, 3M ESPE, USA), Clearfil SE Bond (SE, Kuraray, Japan), Xeno-III (XIII, Dentsply, Germany), and Adper Prompt (AP, 3M ESPE, USA) were measured at 48h, at 1 week and after thermocycling for 5,000 cycles between 5$^{\circ}$C and 55$^{\circ}$C. The DC of the adhesives were measured immediately, at 48h and at 7 days after curing using a Fourier Transform Infra-red Spectrometer. The fractured surfaces were also evaluated with scanning electron microscope. The MTBS and DC were significantly increased with time and there was an interaction between the variables of time and material (MTBS, 2-way ANOVA, p = 0.018; DC, Repeated Measures ANOVA, p < 0.001). The low DC was suggested as a cause of the low MTBS of self-etching adhesives, XIII and AP, but the increase in the MTBS of SE and AP after 48h could not be related with the changes in the DC. The microscopic maturation of the adhesive layer might be considered as the cause of increasing bond strength.