• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2005.09a
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• pp.83-88
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• 2005

유기 절연층을 갖는 유기 박막트랜지스터 (organic TFT)를 제작하여 소자 성능을 조사하였다. 유기 절연층의 형성에서는 polyvinyl 계열의 PVP(poly-4-vinylphenol)와 PVT(polyvinyltoluene)를 용질로, PGMEA (propylene glycol mononethyl ether acetate)를 용매로 사용하였다. 또한, 열경화성 수지인 poly(melamine-co-formaldehyde)를 경화제로 사용하여 유기 절연층의 cross-link 를 시도하였다. MIM 구조로 유기 절연층의 특정을 측정한 결과, PVT는 PVP에 비해 절연 특성이 떨어지는 경향을 보였다. 게이트 절연막의 제작에서 PVP를 cobpolymer 방식과 cross-linked 방식으로 실험 해 본 결과, cross-link 방식에서 낮은 누설전류 특성을 나타내었다. OTFT 제작에서는 PVP를 용질로, poly(melanine-co-formaldehyde)를 경화제로 사용한 cross-linked PVP 를 게이트 절연막으로 이용하였다. PVP copolymer($20\;wt\%$)에 $10\;wt\%$ poly(melamine- co-formaldehyde)를 혼합한 cross-linked PVP 를 게이트 절연막으로 사용하여 top contact 구조의 OTFT를 제작한 결과 약 $0.23\;cm^2/Vs$의 정공 이동도와 약 $0.4{\times}10^4$의 평균 전류점멸비를 나타내었다.

• Korean Chemical Engineering Research
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• v.51 no.1
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• pp.111-115
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• 2013

The optimum synthetic conditions of poly(p-phenylphenol) by horseradish peroxidase in dioxane:water (80:20 v/v) mixtures were studied. The stability against thermal degradation and structural properties of the synthesized phenolic resins were investigated by thermogravimetric analysis (TGA) and differential scanning calorimetry (DSC), respectively. The synthetic yield of poly(p-phenylphenol) increased upon the increase of the amount of enzyme up to 0.25 mg HRP/mL, then leveled off for further increase of the enzyme usage. When sodium acetate (100 mM, pH 4~6) and sodium phosphate (100 mM, pH 7~9) were used as the buffering salts for the aqueous component (20% v/v), the synthetic yield of the resin increased at higher pH of the aqueous buffer. But when the pHs of the aqueous buffer were 6 and 9, the synthetic yield strongly depended on the types of the buffering salts; if sodium phosphate was used instead of sodium acetate at pH 6, the yield decreased by about 15% and if sodium bicarbonate was used instead of sodium phosphate, the yield decreased by almost 20%. When the pH range of the aqueous buffer was from 4 to 7, the addition of a radical mediator, 2,2'-azinobis (3-ethylbenzothiazoline-6-sulfonate) (ABTS), up to 2 mM improved the synthetic yield of the resin by about 10%. TGA experiments revealed that the thermal stability of the resin synthesized in dioxane:water (100 mM sodium phosphate, pH 9) (80:20 v/v) was high having the char yield of 47% upon the heating at $800^{\circ}C$. DCS results showed that the structures of the polymers synthesized in acidic aqueous buffers were different from those of the polymers synthesized in the basic aqueous buffers. However, all the synthesized resins were found to have the property of the thermosetting resins.

• Polymer(Korea)
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• v.25 no.1
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• pp.71-77
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• 2001

Unsaturated polyester(UP) resin is one of the major thermosetting resins. It is very useful as the matrix resin of the composite material because of its low viscosity. The polymer resin, however, has several drawbacks; The volume shrinkage occurs during the crosslinking reaction of the UP resin with styrene monomer and the resulting polymer is weak to the alkali and also brittle. The mechanical properties of UP resin can be improved by blending various materials. In this study, polyurethane(PU) was used as a modifier in order to enhance the toughness of the UP resin. The goal of the research is to study the effect of the polyol molecular weight as a PU soft segment and the PU contents on the toughness of PU-modified UP resins. UP/PU polymer network may occur through the reaction between isocyanate group in the methyldiisocyanate(MDI) and hydroxyl group in the UP molecules. The maximum toughness value was shown at 2 wt% of the PU content. This effect results from the incorporation of the PU segment into the UP resin.

• Polymer(Korea)
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• v.25 no.2
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• pp.199-207
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• 2001

In the present study the cure behavior of diglycidyl ether of bisphenol-A(DGEBA) using an anhydride-based hardener in the presence of N,N-dimethyl benzyl amine (BDMA) or 1-cyanoethyl-2-ethyl-4-methyl imidazole (2E4MZ-CN) as an accelerator has been monitored and interpreted from the viewpoint of photophysical properties by means of fluorescence spectroscopy. To do this, 1,3-bis-(1-pyrene)propane (BPP) was well incorporated in the epoxy resin system by mechanical blending. The BPP probe, which is very sensitive to conformational change of the molecule influenced by the surrounding medium, successfully formed intramolecular excimer fluorescence. It is susceptible to the micro-viscosity or local viscosity and molecular mobility according to the epoxy cure. The cure behavior was explained with monomer fluorescence intensity ($I_{M}$ ), excimer fluorescence intensity ($I_{E}$ ) and $I_{M}$ /$I_{E}$ ratio as a function of cure time, cure temperature and accelerator. The present work agreed with the previous report on the cure behavior of an epoxy-anhydride system studied using DSC or torsion pendulum method. This study also suggests that the use of fluorescence technique may provide information on cure behavior of a thermosetting resin in a low temperature region, which has not been well interpreted by other analytical methods.

• Journal of the Microelectronics and Packaging Society
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• v.12 no.4 s.37
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• pp.359-363
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• 2005

The organic insulation devices with MIM (metal-insulator-metal) structures as PVP gate insulation films were prepared for the application of organic thin film transistors (OTFT). The co-polymer organic insulation films were synthesized by using PVP(poly-4-vinylphenol) as solute and PGMEA (propylene glycol monomethyl ether acetate) as solvent. The cross-linked PVP insulation films were also prepared by addition of poly (melamine-co-formaldehyde) as thermal hardener. The leakage current of the cross-linked PVP films was found to be about 300 pA with low current noise. and showed better property in electrical properties as compared with the co-polymer PVP insulation films. In addition, cross-linked PVP insulation films showed better surface morphology (roughness), showing about 0.11${\~}$0.18 nF in capacitance for all PVP film samples.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.1
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• pp.27-31
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• 2007

The cpapcitors with MIM(metal-insulator-metal) structures using PVP gate insulation films were prepared for the application of flexible organic thin film transistors (OTFT). The co-polymer organic insulation films were synthesized by using PVP(poly-4-vinylphenol) as a solute and PGMEA(propylene glycol monomethyl ether acetate) as a solvent. The cross-linked PVP insulation films were also prepared by addition of poly(melamine-co-formaldehyde) as thermal hardener. The leakage current of the cross- linked PVP films was found to be about 1.3 nA on Al/PES(polyethersulfone) substrate, whereas, on ITO/ glass substrate was about 27.5 nA indicating improvement of the leakage current at Al/PES substrates. Also, the capacitances of all prepared samples on ITO/glass and Al/PES substrates w ere ranged from 1.0 to $1.2nF/cm^2$, showing very similar result with the calculated capacitance values.

• Journal of the Korean Institute of Gas
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• v.2 no.2
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• pp.55-60
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• 1998

In this study, we investigated the dust explosion characteristics by determining minimum ignition energy and explosion limit for this experiment, we used pine-tree dust which was used widely for the filler of thermosetting resin. The experiment was accomplished according to the variation of discharge gap, dust concentration, particle size and humidity. The result of this experiment are as follows; (1) The relation between the discharge gap and ignition energy was that ignition energy decreased according as the discharge gap became small, but increased when the discharge gap was below 4mm and suddenly became infinite when the discharge gap was below. So, we knew that this infinite value was limit discharge gap. (2) When the dust concentration increase and the particle size became microscopic it was easy to explore and in the same particle size, if the humidity increase the minimum ingnition energy decreased.

• Design & Manufacturing
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• v.16 no.3
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• pp.9-15
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• 2022

In order to reduce the manufacturing costs of the glass lens, it is necessary to manufacture a lens using a UV curable resin or a thermosetting resin, which is a curable material, in order to replace a glass lens. In the case of forming a lens using a thermosetting material, it is necessary to form several lenses at once using the wafer-level lens manufacturing technologies due to the long curing time of the material. When a lens is manufactured using a curable material, an error in the shape of the lens due to the shrinkage of the material during the curing process is an important cause of defects. The major factors for these shape errors and deformations are the shrinkage and the change of mechanical properties in the process of changing from a liquid material during curing to a solid state after complete curing. Therefore, it is necessary to understand the curing process of the material and to examine the shrinkage rate and change of physical properties according to the degree cure. In addition, it is necessary to proceed with CAE for lens molding using these and to review problems in lens manufacturing in advance. In this study, the viscoelastic properties of the material were measured during the curing process using a rheometer. Using the results, Rheological investigation of cure kinetics was performed. At the same time, The shrinkage of the material was measured and simple mathematical models were created. And using the results, the molding process of a single lens was analyzed using Comsol, a commercial S/W. In addition, the experiment was conducted to compare and verify the CAE results. As a result, it was confirmed that the shrinkage rate of the material had a great influence on the shape precision of the final product.

• Composites Research
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• v.20 no.5
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• pp.49-55
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• 2007

Nanocomposite blade for dicing semiconductor wafer is investigated for micro/nano-device and micro/nano-fabrication. While metal blade has been used for dicing of silicon wafer, polymer composite blades are used for machining of quartz wafer in semiconductor and cellular phone industry in these days. Organic-inorganic material selection is important to provide the blade with machinability, electrical conductivity, strength, ductility and wear resistance. Maintaining constant thickness with micro-dimension during shaping is one of the important technologies fer machining micro/nano fabrication. In this study the fabrication of blade by wet processing of mixing conducting nano ceramic powder, abrasive powder phenol resin and polyimide has been investigated using an experimental approach in which the thickness differential as the primary design criterion. The effect of drying conduction and post pressure are investigated. As a result wet processing techniques reveal that reliable results are achievable with improved dimension tolerance.

• Journal of Aerospace System Engineering
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• v.16 no.1
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• pp.12-16
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• 2022

Currently, Induction welding is attracting attention as a non-contact, clean and fast welding process. However, since thermoplastic resins are not affected by electromagnetic fields, induction welding requires a heating element called a susceptor. Researches are being conducted with the aim of achieving high-quality bonding, however, the factor of a heating element is an issue, hence the need to set a standard. Specimen fabrication and testing are conducted according to ASTM D5868. In this study, we propose that the evaluation criteria be judged on the basis of three factors; the condition of the welded joint surface, void content, and lap shear strength. Since the adhesive surface to be welded melts and solidifies as it cools, rapid temperature changes can generate pores. In addition, if the heating is not uniform, it is difficult to expect the desire performance. Using PA6 (CF 30%) thermoplastic, susceptor fabrication, induction welding and performance verification were conducted.