• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2007.10a
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• pp.108-111
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• 2007

It's important to measure quantitative properties about thermal-nano variation conduct of polymer for producing high quality components using NIL process. NanoScale indents can be used ad cells for molecular electronics and drug deliver, slots for integration into nanodevices, and defects for tailoring the structure and properties. In this study, it's to evaluate mechanical characteristic of polymer such as PMMA and PC at high temperature for manufacture of nano/micro size of polymer using indenter at high temperature. At high temperature mechanical properties of polymer have extreme variation. Because heating the polymer, it becomes softer than room temperature. In this case it is especially important to study for mechanical properties of polymer at high temperature.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2008.11a
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• pp.605-606
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• 2008

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2009.06a
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• pp.925-926
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• 2009

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2008.05a
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• pp.273-276
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• 2008

Thermoplastic resin takes place stress relaxation and creep according to temperature and time. In room temperature, time dependent deformation (TDD) of polymer was carried out at previous study. In this study, it evaluates time dependent deformation to relate temperature. Nanoscale indents can be used as cells for molecular electronics and drug delivery, slots for integration into nanodevices, and defects for tailoring the structure and properties. Therefore, it is important to control pattern depth for change of indent depth by creep when using Nanoindenter. For evaluating TDD at high temperature, it is occurred thermal-nanoindentation test by changing hold time at maximum load. Temperature is putted at $90^{\circ}C$, hold time at maximum loads are putted at 1, 10, 50, 100, 200, 300 and 500s.

• Journal of the Korean Society for Precision Engineering
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• v.28 no.4
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• pp.463-473
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• 2011

The warm shrink fitting process is generally used to assemble automobile transmission parts (shaft/gear). But the fitting process can cause the dimensions of addendum and dedendum of the gear to change with respect to the fitting interference and the profile of the gear. As a result, there may be additional noise and vibration between gears. To address these problems, we analyzed the warm shrink fitting process according to process parameters; the fitting interference between the outer diameter of the shaft and the inner diameter of the gear, the inner diameter of the gear, addendum and dedendum of the gear, the heating temperature. In this study, a closed form equation for predicting the amount of deformation of addendum and dedendum in the R-direction was proposed. And the FEA method to analyze the cooling process was proposed for thermal-structural-thermal coupled field analysis of the warm shrink fitting process (heating-fitting-cooling process).

• Transactions of Materials Processing
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• v.17 no.8
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• pp.633-642
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• 2008

It's important to measure quantitative properties about thermal-nano behavior of polymer for producing high quality components using Nanoimprint lithography process. Nanoscale indents can be used to make the cells for molecular electronics and drug delivery, slots for integration into nanodevices, and defects for tailoring the structure and properties. In this study, formability of polymethylmetacrylate(PMMA) and polycarbonate(PC) were characterized Polymer has extreme variation in thermo mechanical variation during forming high temperature. Because of heating the polymer, it becomes softer than at room temperature. In this case it is particularly important to study high temperature-induced mechanical properties of polymer. Nanoindenter XP(MTS) was used to measure thermo mechanical properties of PMMA and PC. Polymer was heated by using the heating stage on NanoXP. At CSM(Continuous Stiffness Method) mode test, heating temperature was $110^{\circ}C,120^{\circ}C,130^{\circ}C,140^{\circ}C$ and $150^{\circ}C$ for PMMA, $140^{\circ}C,150^{\circ}C,160^{\circ}C,170^{\circ}C$ and $180^{\circ}C$ for PC, respectively. Maximum indentation depth was 2000nm. At basic mode test, heating temperature was $90^{\circ}C$ and $110^{\circ}C$ for PMMA, $140^{\circ}C,160^{\circ}C$ for PC. Maximum load was 10mN, 20mN and 40mN. Also indented pattern was observed by using SEM and AFM. Mechanical properties of PMMA and PC decreased when temperature increased. Decrease of mechanical properties from PMMA went down rapidly than that of PC.