• Transactions of the Korean Society of Mechanical Engineers A
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• v.34 no.7
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• pp.929-933
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• 2010

Four-point bending tests were performed to investigate the interfacial adhesion of Cu-Cu bonding fabricated by thermo-compression process for three dimensional packaging. A pair of Cu-coated Si wafers was bonded under a pressure of 15 kN at $350^{\circ}C$ for 1 h, followed by post annealing at $350^{\circ}C$ for 1 h. The bonded wafers were diced into $30\;mm\;{\times}\;3\;mm$ pieces for the test. Each specimen had a $400-{\mu}m$-deep notch along the center. An optical inspection module was installed in the testing apparatus to observe crack initiation at the notch and crack propagation over the weak interface. The tests were performed under a fixed loading speed, and the corresponding load was measured. The measured interfacial adhesion energy of the Cu-to-Cu bonding was $9.75\;J/m^2$, and the delaminated interfaces were analyzed after the test. The surface analysis shows that the delamination occurred in the interface between $SiO_2$ and Ti.

• Journal of the Microelectronics and Packaging Society
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• v.30 no.4
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• pp.98-104
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• 2023

The feasibility of an efficient process proposed for Cu-Cu flip-chip bonding was evaluated by forming a porous Cu layer on Cu pillar and conducting thermo-compression sinter-bonding after the infiltration of a reducing agent. The porous Cu layers on Cu pillars were manufactured through a three-step process of Zn plating-heat treatment-Zn selective etching. The average thickness of the formed porous Cu layer was approximately 2.3 ㎛. The flip-chip bonding was accomplished after infiltrating reducing solvent into porous Cu layer and pre-heating, and the layers were finally conducted into sintered joints through thermo-compression. With reduction behavior of Cu oxides and suppression of additional oxidation by the solvent, the porous Cu layer densified to thickness of approximately 1.1 ㎛ during the thermo-compression, and the Cu-Cu flip-chip bonding was eventually completed. As a result, a shear strength of approximately 11.2 MPa could be achieved after the bonding for 5 min under a pressure of 10 MPa at 300 ℃ in air. Because that was a result of partial bonding by only about 50% of the pillars, it was anticipated that a shear strength of 20 MPa or more could easily be obtained if all the pillars were induced to bond through process optimization.

• Proceedings of the KWS Conference
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• 2010.05a
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• pp.84-92
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• 2010

현재 가동 중인 몇몇 가압 경수로 원전 안전 1등급 설비의 이종금속 용접부는 일차수응력부식균열(PWSCC : Primary Stress Corrosion Cracking) 발생의 세가지 조건(민감 재질, 부식 환경, 인장응력)을 동시에 충족하고 있다. 즉, 이종금속 용접부는 PWSCC에 민감한 재질인 Alloy 600 계열 합금으로 제작 또는 용접되어 있으며 고온 수화학 부식 환경 하에 놓여있다. 아울러 오스테나이트 스테인리스 강의 예민화 예방을 위한 용접 후열처리 미실시로 높은 인장 용접 잔류응력이 작용하고 있다. 이러한 이종금속 용접부의 특성상 PWSCC가 발생할 잠재성이 있을 뿐만 아니라 국내외적으로 Alloy 600 계열 합금으로 제작 및 용접된 가압 경수로 원전 안전 1등급 설비의 이종금속 용접부에 실제 PWSCC가 발생된 사례들이 다수 보고되고 있다. 운전 환경 및 재질 변화 없이 PWSCC 발생을 예방하기 위해서는 인장 잔류응력을 이완시켜 낮은 인장 또는 압축 응력화하여야 한다. 이러한 인장 잔류응력 이완방법들로는 PWOL(Pre-emptive Weld Overlay), 레이저 피닝(Laser Peening), MSIP(Mechanical Stress Improvement Process), 워터 제트 피닝(Water Jet Peening), IHSI(Induction Heating Stress Improvement) 방법들이 있는데 공정 시간이 짧고 열 에너지 원이 필요 없으며 전체적인 소성 변형을 야기시키지 않는 레이저 피닝을 본 연구의 대상 방법으로 한다. 본 연구에서는 동적 유한요소 해석을 통해 용접 잔류응력을 이완시키는 레이저 피닝의 효과를 검증하고 용접 잔류응력에 미치는 레이저 피닝 변수의 영향을 고찰하고자 한다. 내부 보수용접이 수행된 경수로 원전 가압기 노즐 이종금속 용접부에 레이저 피닝을 적용한 경우에 대해 상용 유한요소 해석 프로그램인 ABAQUS를 이용하여 동적 유한요소해석을 수행한 결과, 고온 수화학 일차수와 접하는 Alloy 600 계열 합금 내면에서의 인장 잔류응력이 상당히 이완됨을 확인하였다. 또한, 최대충격 압력이 증가할수록, 충격압력 지속시간이 증가할수록, 레이저 스팟 직경이 증가할수록 내표면 인장 잔류응력 이완 정도는 감소하나 이완되는 영역의 깊이는 증가함을 알 수 있다. 또한, 레이저 피닝 방향이 잔류응력 이완에 미치는 영향은 미미함을 알 수 있다.

• Journal of Welding and Joining
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• v.9 no.3
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• pp.41-51
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• 1991

The thermomechanical coupling phenomena in the resistance welding process is complicated due to interactions of mechanical, thermal and electrical factors. Although experimental investigations of resistance spot welding have been carried out, but there are a few by computer simulation. so the purpose of this research is to decrease the time and cost much required in experimental investigation by carrying out the analysis of the resistance spot welding process through computer simulation based on the finite element method. The tool used in the computer simulation is the commercial ANSYS program package. A two dimensional axisymetric model is used to simulate the resistance spot welding for two stainless steel sheets of equal thickness and parametric study is carried out for variable welding current, workpieces of unequal thickness and dissimilar materials. The results from the computer simulation are in good agreement with the experimental one. Through these results, such items as stress distribution, temperature profiles, thermal expansion and weld nugget formation are predicted. Reliability and applicability of finite element models have been demonstrated to simulate and to analyze the resistance spot welding process.

• Composites Research
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• v.33 no.5
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• pp.235-240
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• 2020

In this study, in order to improve the impact resistance of the B₄C tile-inserted B₄C_p/Al7075 hybrid composite, a control method of the B₄C/Al7075 interface was developed and the characteristics of the controlled interface were analyzed. B₂O₃, Ni, and Si were coated on the B₄C tile surface using additional thermal oxidation, electroless plating, and plasma spraying. The coated B₄C tile is inserted into the B₄C_p/Al7075 composite material using the liquid pressurization method. Interfacial energy, bonding strength, and impact resistance were measured to analyze the effect of the coating. All coatings enhanced interfacial energy, bonding strength, and impact resistance, and in particular, it was confirmed that the impact resistance increased by 86.8% when B₂O₃ coating was used. This study is significant in developing and analyzing a core surface treatment method that improves the performance of B₄C/Al series composites, which are attracting attention as next-generation lightweight amour and bulletproof materials.