• Title/Summary/Keyword: 연삭 숫돌

Search Result 152, Processing Time 0.015 seconds

Evaluation of Grade of WA-Vitrified and Resinoid Bond Grinding Wheels by Acoustic Emission (AE에 의한 WA계 비트리파이드 및 레지노이드 결합제 연삭숫돌의 결합도 평가)

  • Joung, In-Kuen;Lim, Young-Ho;Kwon, Dong-Ho
    • Journal of the Korean Society for Precision Engineering
    • /
    • v.12 no.9
    • /
    • pp.74-85
    • /
    • 1995
  • The purpose of this paper is to evaluate the grade of WA vitrified and resinoid bond grinding wheels by the sue of AE measuring system. When the manufactured 48 kinds of specimens were scratched by the method of OKOSHI'S grade test, the relationship between the amount of bit scratch depth of grinding wheel specimens and the character- istics of AE signals, and the relationship of AE counts and grade were considered as fololws; (1) The higher the grades are AE cumlulative event counts N and AE event count rate n, the smaller the values tend to be. But A $E_{rms}$is in reverse. (2) In the case of same grade, the smaller the grain size is, the higher the value of AE cumulative event counts N and A $E_{rms}$is results of comparison and observation. The grinding wheel with lower elasticity and with higher percentage of pore detected higher value of AE cumula- tive event counts N than with higher elasticity and lower percentage of pore. But A $E_{rms}$ is in reverse. (3) AE cumulative event counts N and bit scratch depth h have normally one to one correspondence. (4) It can be expected that quantitative evaluations of grade by using AE have been carried out by the wave observation of AE signal in line with the relationship between load speed of bit and AE cumulative event counts N & AE event count rate n.' AE event count rate n.ate n.

  • PDF

Development of Abrasive Film Polishing System for Cover-Glass Edge using Multi-Body Dynamics Analysis (다물체 동역학 해석을 이용한 커버글라스 Edge 연마용 Abrasive Film Polishing 시스템 개발)

  • Ha, Seok-Jae;Cho, Yong-Gyu;Kim, Byung-Chan;Kang, Dong-Seong;Cho, Myeong-Woo;Lee, Woo-Jung
    • Journal of the Korea Academia-Industrial cooperation Society
    • /
    • v.16 no.10
    • /
    • pp.7071-7077
    • /
    • 2015
  • In recently, the demand of cover-glass is increased because smart phone, tablet pc, and electrical device has become widely used. The display of mobile device is enlarged, so it is necessary to have a high strength against the external force such as contact or falling. In fabrication process of cover-glass, a grinding process is very important process to obtain high strength of glass. Conventional grinding process using a grinding wheel is caused such as a scratch, chipping, notch, and micro-crack on a surface. In this paper, polishing system using a abrasive film was developed for a grinding of mobile cover-glass. To evaluate structural stability of the designed system, finite element model of the polishing system is generated, and multi-body dynamic analysis of abrasive film polishing machine is proposed. As a result of the analysis, stress and displacement analysis of abrasive film polishing system are performed, and using laser displacement sensor, structural stability of abrasive film polishing system is confirmed by measuring displacement.