• Title/Summary/Keyword: 연삭 공정 모니터링

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Monitoring of Grinding Processes by Using On-the-machine Measurement of Surface Roughness (기상에서의 표면 거칠기 측정에 의한 연삭 공정 모니터링)

  • Kim, Hyun-Soo;Hong, Seong-Wook
    • Journal of the Korean Society for Precision Engineering
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    • v.16 no.1 s.94
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    • pp.167-173
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    • 1999
  • This paper presents results of monitoring grinding processes with on-the-machine measurement of surface roughness by using nux ratios of scattered lights. A compact, on-the-machine surface roughness sensor. which consists of a diodelaser and several optic units. is developed. The control unit is also developed. The developed sensor together with the controller is applied for monitoring grinding processes of two different grinding machines. Experimental results show that the nux ratios and their standard deviations measured by the developed sensor over the entire ground surface are useful for monitoring grinding conditions. In particular, the sensor and the control unit are proved to be useful for monitoring grinding processes in order to detect abnormal grinding conditions and dressing time.

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Monitering System of Silicon Wafer Grinding Process Using for the Change of Motor Current (모터 전류 변화를 이용한 실리콘 웨이퍼 연삭 공정 모니터링 시스템)

  • Park S.J.;Kim S.Y.;Lee S.J.;Park B.Y.;Jeong H.D.
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2005.06a
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    • pp.104-107
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    • 2005
  • Recently, according to the development of semiconductor industry, needed to high-integration and high-functionality. These changes are required for silicon wafer of large scale diameter and precision of TTV (Total Thickness variation). So, in this research, suggest that the method of monitoring system is using motor current. This method is needed for observation of silicon wafer grinding process. Motor current sensor is consisted of hall sensor. Hall sensor is known to catching of change of current. Received original signal is converted to the diginal, then, it is calculated RMS values, and then, it is analysed in computer. Generally, the change of force is relative to the change of current, So this reason, in this research tried to monitoring of motor current change, and then, it will be applied to analysis for silicon wafer grinding process. using motor current sensor.

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A Study on the Monitoring Technology for the Continuous Detection of Grinding Process (연삭 공정의 연속 진단을 위한 모니터링에 관한 연구)

  • 강재훈
    • Journal of the Korean Society of Manufacturing Technology Engineers
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    • v.8 no.1
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    • pp.74-80
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    • 1999
  • Recently, manufacturing work has been transformed to small scale production form with various types to act up to user's expectation from mass production with a little items required in the past. Then FMS using NC type machinaries has been applied actively also in domestic manufacturing line to meet thus tendency, but there are many machining troubles occured during work process not be settled yet. Nowdays high efficiently has been required no less than high precision in grinding work for the improvement of productivity. In this study, to represent more advance FMS can be adapted to thus situation In-process type monitoring method using AE and Current sensors is suggested to investigate the machining condition in grinding process. As results form this experimental study, it is recognized well that grinding conditions and dressing point of in time cab be estimated effectively using monitoring method suggested. Furthermore, surface shape of grinding wheel on voluntary point of in time can be predicted indirectly through the observation and comparison of AE signal waveform obtained as performance of continuous dressing work.

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