• Proceedings of the Korean Society of Precision Engineering Conference
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• 1995.10a
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• pp.14-18
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• 1995

Although structural ceramics have excellent mectanical properties, it is very difficult to grind with high efficiency and high quality because of their high strength, hardness, and brittleness. Unfortunately machined ceramics often contain surface damages such as micro fracture and crack on account of brittle fracture. Therefore, is is important to minimize the brittle fracture. The present paper examines grinding characteristics of representative structural ceramics,such as Al /sab 2/O /sab 3/, SiC, Si /sab 3/ N /sab 4/. Effects of grinding variables including table speed and depth of cut on the grinding performance were investigated. Experimental results show that the surface quality is related to the specific grindings energy. The higher specific energy results in the better surface quality.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1995.10a
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• pp.53-56
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• 1995

Electrolytic In-Process Dressing grinding technique which enables application of metal bond wheels with fine superabrasives in mirror surface grinding operations has developed. This paper provides charateristic evaluation of power supply supply that we developed and general charateristics of ELID grinding. The electric behaviors are compared each about two different electrode which has 1/4, 1/6 the area of entire wheel surface, and two different fluids which has 1:50, 1:30 the quantity of water was used to dillute grinding fluids. The results show that ELID grinding method is useful for mirror surface machining.

• Journal of the Korean Society for Precision Engineering
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• v.20 no.7
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• pp.7-12
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• 2003

각광을 받고 있는 광통신 분야의 핵심부품인 페룰은 일본이 전 세계의 95%를 장악하고 있다. 국내에서도 일부 업체에서 양산을 하고 있으나, 핵심 연삭공정에 사용되는 연삭 가공장비는 전량 수입되고 있는 실정이다. 페룰은 0.1∼0.3$\mu\textrm{m}$의 동심도, ${\pm}$ 0.2$\mu\textrm{m}$의 외경치수, 0.1$\mu\textrm{m}$대의 진원도와 원통도, 10nm의 표면 거칠기를 구현해야 세계적 경쟁력을 갖출 수 있는 초미세, 초정밀 기계가공 부품이다.(중략)

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2001.04a
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• pp.1101-1104
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• 2001

The special purposed materials, such as ceramics and stainless steel, are widely used in the various industrial area. They have properties of the higher strength of material, the wear-resistance, and the corrosion proof. But ceramics is a difficult-to-grind material which possesses the higher level of a strength and a brittleness. In this study, the theoretical investigation of a grinding force and of a surface roughness was conducted. The evaluations of grinding characteristics on the hardened-brittle and difficult-to-grind materials were experimentally carried out.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.29 no.4 s.235
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• pp.614-623
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• 2005

This study aims to perform the characteristic evaluation of surface grinding for the STD11 material with experimental and analytic techniques based on the response surface model. The grinding force acting on the workpiece and the ground surface roughness were measured according to the change of grain size, table speed and depth of cut. The effect of spark-out on the grinding force and the surface roughness was also characterized. The frictional coefficient between workpiece and grinding wheel could be determined by the analysis of spark-out effect. From the experimental data, the second-order response surface models were developed to predict the grinding force and the surface roughness. Validation of the developed model was examined.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.11 no.5
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• pp.58-64
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• 2002

Mirror surface finish of Si-wafers has been achieved by rotary in-feed machining with cup-type wheels in ELID grinding. But the diameter of the workpiece is limited with the diameter of the grinding wheel in the in-feed machining method. In this study, some finding experiments by the rotary surface grinding machine with straight type wheels were conducted, by which the possible grinding area of the workpiece is independent of the diameter of the wheels. For the purpose of investigating the grinding characteristics of large scale diametrical silicon wafer, grinding conditions such as rotation speed of grinding wheels and revolution of workpieces are varied, and grinding machine used in this experiment is rotary type surface grinding m/c equipment with an ELID unit. The surface ground using the SD8000 wheels showed that mirror like surface roughness can be attained near 2~6 nm in Ra.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 1998.03a
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• pp.19-24
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• 1998

This paper aims to clarify the effects of grinding conditions on the ground surface and bending strength in surface grinding of various ferrites with diamond wheel. The main conclusions obtained were as follows. The surface roughness becomes better at lower wheel speed in the case of v/V=1$\times$10-3, and the condition of v/V=1$\times$10-4shows the best performance for the finish grinding. When the relative contact temperature becomes lower at a constant value of v/V, the ground surface exhibits lower roughness. The ground surface shows that the fracture process during grinding becomes more brittle at the higher value of v/V. The damage depth which affect the bending strength is below 10$\mu$m in the grinding condition of S=10㎣/mm.s with the diamond tool after dressing & truing, however, the depth increases with increasing removal rate(S). When the strength degradation due to grinding is larger, the removal depth for the recovery of strength requires a larger size.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2004.10a
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• pp.16-21
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• 2004

As a new approach to analyze grinding energy, this paper introduces a specific grinding energy model based on the average grain. Using this model, grinding characteristics such as radial and tangential forces, specific grinding energy of SM45C were investigated altering grinding variables such as workpiece velocity(v) and apparent depth of cut(Z) in down-surface grinding. From the experimental results, there is no significant difference between the radial, tangential forces and vertical. horizontal forces because of small contact angle between wheel and workpiece. The specific grinding energy decreases as the maximum undeformed chip thickness increases. But, there is much difference between the specific grinding energies of the existing and the proposed model.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 1999.10a
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• pp.507-512
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• 1999

In modern engineering practice, the grinding process is one of the most important and widely used operations for the precision finishing of components. In this paper, machining characteristics of external plunge grinding were investigated by using spindle motor current signal through hall sensor. Grinding experiments were performed in terms of various grinding conditions such as wheel speed, workpiece speed, infeed rate and spark-out time with conventional vitrified bonded WA wheel. The relationship between spindle motor current signal and metal removal rate in terms of infeed rate was induced the by analyzing spindle motor current signal.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.19 no.3
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• pp.105-110
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• 2020

Alumina, a typical ceramic material used for semiconductors and display parts, is the subject of research and development efforts for mineral material processing. Alumina is extremely difficult to process since it is brittleness to either fine ceramics material. We have studied the shape of diamond particles and their use in machinability for alumina processing. Our study was carried out under various processing conditions, including cutting speed, table speed, and the surface roughness of the work piece. We also analyzed the wear characteristics of the tool by total cutting.