• Proceedings of the Korean Society of Precision Engineering Conference
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• 1992.10a
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• pp.145-150
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• 1992

화인세라믹의 우수한 공학적 특성으로 인한 최근의 이용가치 증대와 더불어 세라믹의 고정도 가공에 대한 관심이 높아지고 있다. 다이아몬드휠을 이용한 연삭이나 다이아몬드 공구를 이용한 선삭에 의해 세라믹의 고정도 표면생성을 실현시키고자 하는 연구가 활발히 진행되고는 있으나 아직 미흡한 상태에 있다. 따라서 전통적으로 고정도 표면생성에 널리 용되어 온 래핑에 의한 표면다듬질이 현재 행하여지고 있는 일반적인 방법이다. 본 연구에서는 화인세라믹의 고정도 표면생성을 위한 원통래핑 공정의 최적화 방법으로 실험계획법의 한 응용분야인 반응표면분석법을 이용하였으며 그 결과, 적은 재료와 시간으로 능률적이고 체계적인 실험 및 통계적인 분석을 통해서 원통세라믹의 고정도 표면생성을 위한 최적래핑조건을 찾아내었다.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1992.04a
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• pp.349-353
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• 1992

로봇 경로프로그래밍 작업의 단순화는 산업용 로봇응용분야중 경로가 복잡할 경우, 예를 들어 연삭, 디버링, 폴리싱등 의 가공분야 그리고 아크용접같은 작업에서, 더욱 절실한 문제가 되고있다. 기존 로봇 프로그래밍 방식은 죠이스틱 또는 티칭 유니트, 오프라인 그리고 메스터-슬레이브 방식으로 구분될 수 있는데 각각 많은 프로그래밍 시간소요, 현장성부족 그리고 적용 로봇에의 한계를 문제점으로 들 수 있다. 여기서는 6축 수직 다관절 로봇의 손목부위에 6자 유도의 F/T 센서를 부착하여 작업자가 직접 로봇의 엔드 이펙트를 잡고 원하는 경로를 따라가는 동안 경로가 자동 프로 그래밍되는 알고리즘을 실험 결과와 함께 제시하고 있다.

• Journal of the Korean Society for Precision Engineering
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• v.6 no.4
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• pp.11-20
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• 1989

마이크로 일렉트로닉스(Microelectronics)를 중심으로 하는 산업혁명이 진행되고 있는 시점에서 전자, 광학 또는 신소재 부품에 대한 형상과 치수 또는 표면거칠기에 대한 정확도와 정밀도가 엄격하게 요구되고 있다. 예를 들어 경취 재료인 반도체의 웨이화( w-afer), 수정진동자 자기헷트, 비구면렌즈 또는 연질 금속의 레이저빔(Laser Beam) 프린터 용 포리곤 밀러(Polygon Mirror), 자기디스크, 복사기용 드럼(drum), 레저기기용 반사밀러 등 가공정밀도를 향상시키기 위해서는 과거의 가공기술을 대치할 수 있는 새로운 초정밀가공 기술의 도입이 활발하게 진행되고 있다. 경취성 재료의 초정밀가공은 지금까지는 랩핑(lappi- ng), 폴리싱(polishing)의 가공기술이 주체였으나, 최근의 엄격한 부품정밀도에 대응하기 위하여 전가공을 초정밀 연삭가공으로 평면도,표면거칠기, 가공변질층을 향상시키고 다듬질 가공은 폴리싱으로 하여 표면거칠기를 향상시켜야 하는 가공기술이 보급되고 있다. 일반연질 금속의 다듬질가공은 유리지립을 이용하는 랩핑이나 폴리싱으로 다듬질 가공을 진행하고 있었 으나 형상정도와 표면정밀도를 동시에 얻는다는 것이 어렵고 또 가공시간이 너무 길어서 매우 고가인 것이 되고 말았다. 그러나 유리에서 연질금속으로 재료를 전환시키고 저가격화, 양산 화의 요구, 정밀도 향상과 부품의 안정화 등등 여러 이유로서 다아아몬드(Diamond) 공구로 mirror surface 를 만드는 초정밀 경면연삭 가공기술(precision turning with diamond)의 발달 로 이제는 완전히 새로운 가공기술로 대치되고 말았다. 다이아몬드에 의한 초정밀절삭은 공구 끝이 매우 예리하고 마모가 매우 적은 단결정 다이아몬드를 이용하고 절삭가공 기계는 운동정도 를 피가공물에 정확히 전사 시키는 방법이며 따라서 가공기계는 고도의 운동정밀도가 요구되며 그외에 강성, 진동, 열변이, 제어면에서 엄격한 검도가 있어야 한다.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1997.10a
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• pp.1022-1027
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• 1997

The grinding operation is an important machining process for machining of final surface. However. grinding process has inevitable troubles such as loading and glazing for grinding wheel. It is, therefore, an essential research theme to determine the wheel life and the dressing timefor efficient grinding. In this study, AE signals (AEavg) generated in thc grinding operation were measured and the dressing time was determined from the analysis of the AEavg value. To verify the propriety of the obtained result. the AE signals measured on the grinding and the dressing operation were compared with the grinding force signals and the dressing force which were measured at same time. From the obtained result, it was confirmed that the determination of the wheel life and the dressing time by the AE measurement technique proposed in this study can be practically used.

• Journal of the Korean Society for Precision Engineering
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• v.14 no.5
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• pp.85-91
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• 1997

Air grinding time in grinding process has a great effect on its efficiency due to low feedrate. This paper presents a reduction methos of air grinding time in cylindrical plunge grinding operation. Tje reduction of air grinding time is accomplished by finding the distance between contact point and rising point of ultra- sonic signal of the grinding wheel to workpiece. It uses a variation of sound signal generated by the flow of coolant when the grinding wheel approaches to workpiece. The ultrasonic sensor with 23 kHz center fre- quency and 8 kHz bandwidth is used to find the nearest approaching point(NAP). Monitoring and control system of the grinding conditions is implemented with CNC controller to control feedrate override and ultrasonic sensor to find NAP. The experimental result shows that the ultrasonic signal is a good measure- ment to find NAP. But it needs the considerations for the effect of the relationship between flowrate of coolant and diameter of workpiece.

• Journal of the Korean Society of Safety
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• v.16 no.1
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• pp.79-83
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• 2001

Posture of the upper limbs in field works is known to be an important risk factor associated with CTD(Cumulative Trauma Disorders). In particular, uncomfortable posture and highly repetitive works in shipbuilding industry(for instance, sand blasting, grinding and blast painting, etc) made workers exposed to a great risk of injuries. The purpose of this paper is to analyze recruitment pattern of the muscles according to posture(joint angle displacement) during grinding. In this study, EMG signals of pectoralis major, latissimus dorsi, and posterior deltoid muscle were measured and analyzed from FlexComp EMG solution. And subjective ratings of perceived exertion were made using Borg's CR-10 rating scale.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.11 no.5
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• pp.218-223
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• 2001

The chemical-mechanical polishing process was carried out for 2"-dia. sapphire wafer grown by horizontalBridgman method on the urethane lapping pad with the silica sol. The polished wafer shows the full-width at halfmaximum of 200~400 arcsec in double-crystal X-ray diffraction, indicating that the slicing, grinding and lapping processes before the polishing process affected the crystalline structural property of the wafer surface by the mechanical residual stress. For the inclusion of surface treatments after chemical-mechanical polishing such as the thermal annealing at the temperature of $1,200^{\circ}C$for 4 hrs. and chemical etching, the crystalline quality was sigdicantly enhanced with the reduced full-width at half maximum up to 8.3 arcsec.arcsec.

• Journal of the Korean Society for Precision Engineering
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• v.14 no.8
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• pp.101-107
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• 1997

In general, grinding is one of the final machining processes which determines the surface quality of machined products. Since the ground surface is affected by the states of grains and voids on the grinding wheel surface, the wheel should be dressed before the machined surface deteriorates over a quality limit This paper describes a systematic approach to decide a proper dressing chance and an optimal dressing depth for the working grinding wheel. An eddy current sensor and a laser displacement sensor are used to measure the loading on the working wheel surface and the topography of the dressed wheel surface respec- tively. The dressing chance can be properly decided through the relational locus between the amount of handing and the machined surface roughness. An optimal dressing depth to guarantee the less wheel loss and the higher wheel surface quality is decided through the analysis of the variance of topography for the dressed wheel surface, which decreases at three different rates according to the accumulated dressing depth.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.3
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• pp.9-15
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• 2021

Miniaturization of semiconductor devices has recently faced a physical limitation. To overcome this, 3D packaging in which semiconductor devices are vertically stacked has been actively developed. 3D packaging requires three unit processes of TSV, wafer grinding, and bonding, and among these, copper bonding is becoming very important for high performance and fine-pitch in 3D packaging. In this study, the effects of Ti nanolayer on the antioxidation of copper surface and low-temperature Cu bonding was investigated. The diffusion rate of Ti into Cu is faster than Cu into Ti in the temperature ranging from room temperature to 200℃, which shows that the titanium nanolayer can be effective for low-temperature copper bonding. The 12nm-thick titanium layer was uniformly deposited on the copper surface, and the surface roughness (R_q) was lowered from 4.1 nm to 3.2 nm. Cu bonding using Ti nanolayer was carried out at 200℃ for 1 hour, and then annealing at the same temperature and time. The average shear strength measured after bonding was 13.2 MPa.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.38 no.10
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• pp.1117-1123
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• 2014

This study sintered $Si_3N_4$ with different amounts of $SiO_2$ nano-colloid. The surface of a mirror-polished specimen was coated with $SiO_2$ nano-colloid, and cracks were healed when the specimen was treated at a temperature of 1273 K for 1 h in air. Wear specimen experiments were conducted after heat treatments for 10 min at 1073, 1273, and 1573 K. The heat-treated surface that was coated with the $SiO_2$ nano-colloid was slightly rougher than the noncoated surface. The oxidation state of the surface according to the heat treatment temperature showed no correlation with the surface roughness. Moreover, the friction coefficient, wear loss, and bending strength were not related to the surface roughness. $Si_3N_4$ exhibited an abrasive wear behavior when SKD11 was used as an opponent material. The friction coefficient was proportional to the wear loss, and the bending strength was inversely proportional to the friction coefficient and wear loss. The friction coefficient and wear loss increased with increasing amounts of the $SiO_2$ nanocolloid. In addition, the friction coefficient was slightly increased by increasing the heat treatment temperature.