• Journal of the Korean Society for Heat Treatment
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• v.20 no.2
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• pp.72-77
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• 2007

Abrasive wear between piston ring face and cylinder liner is an extremely unpredictable and hard-to-reproduce phenomenon that significantly decreases engine performance. Wear by abrasion are forms of wear caused by contact between a particle and solid material. Abrasive wear is the loss of material by the passage of hard particles over a surface. From the pin-on-disk test, particle dent test and scuffing test, abrasive wear characteristics of diesel engine cylinder liner-piston ring have been investigated. Pin-on-disk test results indicate that abrasive wear resistance is not simply related to the hardness of materials, but is influenced also by the microstructure, temperature, lubricity and micro- fracture properties. In particle dent test, dent resistance stress decreases with increasing temperature. From the scuffing test by using pin-on-disk tester, scuffing mechanisms for the soft coating and hard coating were proposed and experimentally confirmed.

• Tribology and Lubricants
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• v.35 no.5
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• pp.274-285
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• 2019

Chemical mechanical polishing (CMP), which is a material removal process involving chemical surface reactions and mechanical abrasive action, is an essential manufacturing process for obtaining high-quality semiconductor surfaces with ultrahigh precision features. Recent rapid growth in the industries of digital devices and semiconductors has accelerated the demands for processing of various substrate and film materials. In addition, to solve many issues and challenges related to high integration such as micro-defects, non-uniformity, and post-process cleaning, it has become increasingly necessary to approach and understand the processing mechanisms for various substrate materials and abrasive particle behaviors from a tribological point of view. Based on these backgrounds, we review recent CMP R&D trends in this study. We examine experimental and analytical studies with a focus on substrate materials and abrasive particles. For the reduction of micro-scratch generation, understanding the correlation between friction and the generation mechanism by abrasive particle behaviors is critical. Furthermore, the contact stiffness at the wafer-particle (slurry)-pad interface should be carefully considered. Regarding substrate materials, recent research trends and technologies have been introduced that focus on sapphire (${\alpha}$-alumina, $Al_2O_3$), silicon carbide (SiC), and gallium nitride (GaN), which are used for organic light emitting devices. High-speed processing technology that does not generate surface defects should be developed for low-cost production of various substrates. For this purpose, effective methods for reducing and removing surface residues and deformed layers should be explored through tribological approaches. Finally, we present future challenges and issues related to the CMP process from a tribological perspective.