• 한국정밀공학회지
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• 제20권6호
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• pp.11-14
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• 2003

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2004년도 춘계학술대회 논문요약집
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• pp.246-246
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• 2004

현재 비구면렌즈를 만들기 위해서는 다양한 방법이 있다. Glass종류의 가공시 초정밀 절삭가공기(DTM)에서 가공하거나 정밀 연삭기를 가지고 가공하게 된다. 이 과정에서 렌즈 표면에 공구 흔적이나 표면거칠기 개선을 위해 연마작업을 하게 되는데, 사용하는 장비가 폴리싱 머신이다. 축대칭인 폴리싱머신의 경우 X, Z, $\theta$로 동시 3축제어가 가능하다. 하지만 이 장비의 경우 연마에서 원하는 형상정밀도와 표면거칠기를 얻기 위해 각축들의 위치정밀도와 분해능이 높은 부품을 사용하여 기계자체가 고가라는 점이 단점으로 작용한다.(중략)

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 춘계학술대회 논문집
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• pp.90-95
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• 2005

To perform the finish outside-diameter grinding process of ferrules which are widely used as fiber optic connectors, a high-precision centerless grinding machine is necessary. In this study, the thermal characteristics of the high-precision centerless grinding machine such as the temperature distribution, temperature rise and thermal deformation, are estimated based on the virtual prototype of the grinding machine and the heat generation rates of heat sources related to the machine operation conditions. The reliability of the predicted results is demonstrated by the temperature characteristics measured from the physical prototype. Especially, the predicted and measured results show the fact that the high-precision centerless grinding machine consisted of the hydrostatic GW and RW spindle systems, hydrostatic RW feeding mechanism, RW swivel mechanism, on-machine GW and RW dressers, and concrete-filled steel bed, has very stable thermal characteristics.

• 대한기계학회논문집
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• 제14권6호
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• pp.1533-1541
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• 1990

본 연구에서는 초입자인 CBN단입자와 기존의 연삭입자인 SiC단입자를 연삭입 자로 하고, 경강과 연강의 공작물재료를 단입자로 연삭했을 때의 표면거칠기 특성을 단입자의 절삭현상으로부터 비교 구명하고 CBN입자에 의한 연삭의 경우가 표면거칠기 가 악화하는 원인을 구명함으로써 이것을 토대로 하여 CBN입자의 실용 보편화의 자료 로 삼고자 하였다.

• 대한기계학회논문집A
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• 제30권12호
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• pp.1634-1641
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• 2006

High-precision centerless grinding machines are emerging as a means of finishing the outer diameter grinding process required for ferrules, which are widely used as fiber optic connectors. In this study, a sensitivity analysis for structural and thermal characteristics was carried out using a virtual prototype of a centerless grinding machine to realize systematic design technology and performance improvements required to manufacture ferrules. The prototype consisted of a concrete-filled bed, hydrostatic grinding wheel (GW) and regulating wheel (RW) spindle systems, a hydrostatic RW table feed mechanism, a RW swivel mechanism, and on-machine GW and RW dressers. The results of the structural sensitivity analysis illustrated that the vertical stiffness of hydrostatic guideway for the RW table feed system greatly influenced the horizontal loop stiffness, and the results of the thermal sensitivity analysis illustrated that the heat generation rates at hydrostatic bearings and belt pulley greatly influenced the temperature rise of hydrostatic bearings and the deviation of thermal displacement between GW and RW.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2006년도 춘계학술대회 논문집
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• pp.555-556
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• 2006

In recent years, the higher flatness level in wafer shape has been strictly demanded with a high integration of the semiconductor devices. It has become difficult for a conventional wafer preparing process to satisfy those demands. In order to meet those demands, surface grinding with in-feed grinder is adopted. In an in-feed grinding method, a chuck table fur fixing a semiconductor wafrr rotates on its rotation axis with a slight tilt angle to the rotation axis of a cup shaped grinding wheel and the grinding wheel in rotation moves down to grind the wafer. So, stability of the grinder structure is very important to aquire a wafer of good quality. This paper describes the features of the in-feed grinder and some FEM analysis results of the grinder structure.

• 대한기계학회논문집A
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• 제23권6호
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• pp.881-894
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• 1999

Cylindrical plunge grinding is widely used for final machining process of precision parts such as automobile, aircraft, measurement units. But in order to make parts which have high precision accuracy and high surface integrity, it is necessary to consider grinding characteristics due to accumulation phenomena of grinding wheel in plunge grinding process. In this study, in order to examine closely plunge grinding process, grinding power, grinding force, real depth of cut are monitored in transient state, steady state and spark out state. As the result, it is shown that grinding power and force are affected by dressing condition, depth of cut and speed ratio and that there exist threshold grinding force and it also affected by dressing condition. Also considered effects of grinding conditions on surface roughness and roundness of workpiece

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2002년도 춘계학술대회 논문집
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• pp.1047-1050
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• 2002

In this paper, grinding characteristics of cylindrical plunge grinding in 200m/sec of grinding velocity was investigated by use of vitrified CBN wheel. From the experimental result, it was convinced that grinding power is decreased 2.5times and grinding efficiency is heightened 3times more according to increasing wheel velocity 80m/sec to 200m/sec And also, be expected to improvement of surface roughness and roundness by increasing the wheel velocity.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 춘계학술대회 논문집
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• pp.1-5
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• 2005

The grinding process is replacing lapping and etching process because significant cost savings and performance improvemnets is possible. This paper presents the experimental results of wafer grinding. A three-variable two-level full factorial design was employed to reveal the main effects as well as the interaction effects of three process parameters such as wheel rotational speed, chuck table rotational speed and feed rate on TTV and STIR of wafers. The chuck table rotaional speed was a significant factor and the interaction effects was significant. The ground wafer shape was affected by surface shape of chuck table.

• 한국정밀공학회지
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• 제17권9호
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• pp.45-52
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• 2000

To reduce two preprocess operations to one in the surface grinding operation the laminated grinding wheel was introduced and its availability has already been investigated in the cylindrical grinding process. Thus in this study the experiment was carried out to attempt to prove that the laminated grinding wheel can be used in the surface grinding process with respect to the roughness and grinding force.