• Journal of the Korean Society of Food Science and Nutrition
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• v.32 no.3
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• pp.370-374
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• 2003

Cell cracking method using a non-collision was evaluated for the possibility of new red ginseng grinding technique. Based on particle size distribution analysis by 1size shaker, the ratios of 100 mesh penetrated particles were 94.9% for hammer mill (group A) and 95.6% for cell crack (group B). The ratio of 120 mesh penetrated particle of group A was higher than that in group B. The particle size distributions for 100 mesh non-penetrated Powder between 2 groups were not significantly different, and particle size distribution analysis by laser scattering analyzer showed that the particle size ranges were 0.77~128.07 ${\mu}{\textrm}{m}$ for group A and 4.24~180.07 ${\mu}{\textrm}{m}$ for group B. The Particle size distribution in group A was more broad than that in group B. The mean particle size in group B was larger than that in group A, while the standard deviation of particle size distribution in group B was less than that in group A. Structural surface characteristics, in group A, particle size distribution was broad and the distribution curve was amorphous. The structure of individual particles was similar to unequal stone which was roughly grinded and had soft cotton-like surface. In the contrary, in group B, particle size distribution was relatively narrow and also individual size particles were ubiquitously distributed. The structure of individual particles was unequal cut stone shape.

• Proceedings of the Korea Water Resources Association Conference
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• 2021.06a
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• pp.388-388
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• 2021

하천에서 호안이나 교량의 교각 등은 홍수 시 주변 하상의 세굴에 의한 피해가 많이 발생한다. 하상보호를 위해서 하천 수공구조물 주변 하상에 자갈, 호박돌, 전석 등을 깔기도 한다. 이 재료들은 다공성 집단을 이루며 유수에 의한 소류력과 항력이 작용한다. 다공성 집단체 공극의 흐름에 의한 항력은 외부 흐름이 가하는 소류력에 비해 작으나 집단의 안정성에 큰 영향을 미칠 수 있다. 집단체에 작용하는 항력은 공극 내의 흐름의 유속과 항력계수를 이용하여 구할 수 있다. 본 연구에서는 다공성 매질 내 흐름에 대한 항력계수를 조사하기 위하여 수리실험을 이용하여 자갈 매질의 공극을 흐르는 물이 일으킨 항력과 동수경사를 측정하였다. 수리실험을 위한 대공극 매질은 상업용 연마 자갈을 사용하여 크기에 따라 작은 자갈(5~10mm), 중간자갈(15~25mm), 큰 자갈(25~50mm)로 구분하였다. 대표입경 D₅₀은 작은 자갈 8.0 mm, 중간 자갈 17.6 mm, 큰 자갈 32.2 mm이고, 형상계수는 각각 0.28~0.74, 0.29~0.58, 0.38~0.68의 범위였다. 자갈 매질의 공극율은 각각 0.405~0.422이었다. 매질 내의 흐름 길이는 24.2cm로 하였다. 실험결과 자갈 매질 내 흐름의 입자 레이놀즈수 Re_p에 따른 내부항력 F_D와 항력계수 C_D는 Fig. 1 및 Fig. 2와 같다. 실험에서 Re_p는 31.5~3,175.4였다. 자갈 매질의 내부항력은 Re_p가 증가하면 비선형적으로 증가하였으며 입자가 클수록 작았다. 항력계수는 작은 자갈과 중간 자갈 매질에 차이가 거의 없었으나 큰 자갈의 경우 작은 것으로 나타났다.

• Journal of the Korean Society for Precision Engineering
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• v.25 no.9
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• pp.32-37
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• 2008

Freestanding hydride vapor phase epitaxy grown GaN(Gallium Nitride) substrates subjected to various polishing methods were characterized for their surface and subsurface conditions, Although CMP(Chemical Mechanical Polishing) is one of the best approaches for reducing scratches and subsurface damages, the removal rate of Ga-polar surface in CMP is insignificant($0.1{\sim}0.3{\mu}m$/hr) as compared with that of N-polar surface, Therefore, conventional MP(Mechanical Polishing) is commonly used in the GaN substrate fabrication process, MP of (0001) surface of GaN has been demonstrated using diamond slurries with different abrasive sizes, Diamond abrasives of size ranging from 30nm to 100nm were dispersed in ethylene glycol solutions and mineral oil solutions, respectively. Significant change in the surface roughness ($R_a$ 0.15nm) and scratch-free surface were obtained by diamond slurry of 30nm in mean abrasive size dispersed in mineral oil solutions. However, MP process introduced subsurface damages confirmed by TEM (Transmission Electronic Microscope) and PL(Photo-Luminescence) analysis.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.07a
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• pp.20-23
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• 2004

As the integrated circuit device shrinks to the smaller dimension, the chemical mechanical polishing(CMP) process was required for the global planarization of inter-metal dielectric(IMD) layer with free-defect. However, as the IMD layer gets thinner, micro-scratches are becoming as major defects. Chemical-Mechanical polishing(CMP) of conductors is a key process in Damascene patterning of advanced interconnect structure. The effect of alternative commercial slurries pads, and post-CMP cleaning alternatives are discuss, with removal rate, scratch dentisty, surface roughness, dishing, erosion and particulate density used as performance metrics. Electroplated copper deposition is a mature process from a historical point of view, but a very young process from a CMP perspective. While copper electro deposition has been used and studied for decades, its application to Cu damascene wafer processing is only now gaining complete acceptance in the semiconductor industry. The polishing mechanism of Cu-CMP process has been reported as the repeated process of passive layer formation by oxidizer and abrasion action by slurry abrasives. however it is important to understand the effect of oxidizer on copper passivation layer in order to obtain higher removal rate and non-uniformity during Cu-CMP process. In this paper, we investigated the effects of oxidizer on Cu-CMP process regarding the additional volume of oxidizer.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.17 no.6
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• pp.91-97
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• 2018

Chemical mechanical polishing(CMP) realizes a surface planarity through combined mechanical and chemical means. In CMP process, Preston equation is known as one of the most general approximation of the removal rate. Effects of pressure and relative speed on the mechanical property of Cu CMP has been investigated. On the other hand, The amount of abrasion also increased with changes in pressure and speed, resulting in a proportional increase of temperature during CMP. Especially this temperature is an important factor to change chemical reaction in a Cu CMP. However, when the slurry temperature became higher than $70^{\circ}C$, the removal rate went lower due to abrasives aggregation and scratching occurred on the Cu film. Therefore, it was found that the slurry temperature should not exceed $70^{\circ}C$ during Cu CMP. Finally, authors could increase the pressure, speed and slurry temperature up to a ceratin level to improve the removal rate without surface defects.

• Korean Journal of Materials Research
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• v.2 no.6
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• pp.428-435
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• 1992

AISI 4600 Iron powder was mixed with 0~1.0% phosphor as F$e_2$P powder and/or 0~0.8% carbon as graphite powder in rotating mixer. Mixed powder was pressed 800MPa in double-punch mould. Compacts were sintered at 115$0^{\circ}C$for 30 min. in vacuum or mixed hydrogen and nitrogen gas. Sintered compacts were ground and polished, and etched by 2% nital etchant. The microstructure was observed by image analyzer and optical microscope. Density and microhardness were tested by ASTM B3l2 and Microvickers hardness tester. The results obtained were as follows : (1) As the amount of F$e_2$P powder increased, sintered microstructure showed more densified effect and the grain size was larger. (2) The shape of pore was rounded and the number of pore was decreased by F$e_2$P addition. But mean pore size was larger with F$e_2$P content. (3) Simultaneous alloying addition of F$e_2$P and graphite brought about larger grain growth than respective addition. (4) Sintering atmosphere did not affect the microstructure. (5) Hardness of sintered compact increased with phosphrous and carbon content.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.16 no.5
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• pp.227-234
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• 2006

Microstructures of free surface and interior of glass-ceramics obtained by heat treating silicate glass specimen containing electric arc furnace dust(EAF dust) were observed. The crystallization temperature, $T_c$ of glassy specimen was measured around $850^{\circ}C$ from the result of different thermal analysis so heat treatment temperature to obtain glass-ceramic specimen was selected as $950^{\circ}C$ for 1 hr. Glass specimens containing 50 wt% dust were amorphous, while glass specimens containing 70 wt% dust showed spinel crystal peaks in XRD results. In case of glass-ceramic specimens, spinel crystalline phase was appeared with willemite, and willemite crystal peak intensity increased with increasing dust contents. The fractured surface of glass specimens containing 50 wt% dust was smooth like mirror surface, but that containing 70 wt% dust showed spinel crystals of 10 ${\mu}m$ size in glass matrix. In case of glass-ceramic specimens, ZnO crystal particles of $2{\sim}5{\mu}m$ size were produced in free surface and glassy phase, spinel and willemite crystal phases existed in interior. There were no crystals in glasses containing 50 wt% dust, while glass containing 70 wt% dust had 14 vol% crystals. Crystallinity of glass-ceramic specimens containing 50 and 70 wt% dust were 19 and 43%, respectively. When microstructures of glass and glass-ceramic specimens were observed through SEM after TCLP experiment, glass specimens showed flaking phenomenon while glass-ceramic specimens showed a slight corrosion evidence without any cracks.

• Restorative Dentistry and Endodontics
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• v.32 no.4
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• pp.327-334
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• 2007

The purpose of this study was to evaluate the effect of burs on microleakage of Class V resin restorations when a self-etching primer adhesive was used. Forty Class V cavities were prepared with four different cutting burs on extracted third molars, and divided into one of four equal groups (n = 10); Group 1-plain cut carbide bur (no. 245), Group 2-cross cut carbide bur (no. 557), Group 3-fine diamond bur (TF-21F), Group 4-standard diamond bur (EX-41). The occlusal and gingival margin of cavities was located in enamel and dentin, respectively. Cavities were treated with Clearfil SE Bond and restored with Clearfil AP-X. Specimens were thermocycled, immersed in a 2% methylene blue solution for 24 hours, and bisected longitudinally. They were observed leakages at enamel and dentinal margins. Data were analyzed using Mann-Whitney and Wilcoxon signed ranked test. The results of this study were as follows; 1. At enamel margin, microleakage of group 4 was statistically higher than those of group 1, 2 and 3 (p < 0.01). 2. At dentinal margin, microleakage of group 4 was statistically higher than group 3 (p < 0.01), but group 1 and 2 were not statistically different with group 3 and 4. 3. Enamel microleakage was statistically higher than dentinal microleakage in group 1, 2 and 3 (p < 0.05), but statistical difference between the microleakage of enamel and dentinal margin was not in Group 4. In conclusion, the use of coarse diamond bur showed high microleakage at both enamel and dentinal margin when Clearfil SE Bond was used in class V cavity.

• Journal of the Korean earth science society
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• v.21 no.2
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• pp.174-187
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• 2000

The Quaternary coarse-grained sandy sediments are distributed along the channels of Seomjin River. The fluvial sediments were sedimentologically studied in horizontal and vertical distributions. To analyze depositional environments and facies changes in the sediments, sediment sampling from river mouth to upper stream and desctriptive approaches to the sediment profiles outcropped near Kurye were carried out. The sediments along the stream lines of the river are assigned to very coarse to coarse sand in grain size. The sediment grains are widely scattered in sorting and moderately sorted in average. For skewness and kurtosis, the sediments ranges from very fine to very coarse skewed and from very lepto-kurtic to extremelyl epto-kurtic states, respectively. The sediments are divided into slightly gravelly sand, gravelly sand and sandy gravel in sediment type. The pain shape in the sandy sediments are dominant in equant and tabular forms showing wide varieties. The sandy sediments are mostly poorly sorted and are highly variable in surface texture with SEM. Some smaller grains in the sediments ordinarily show polished surfaces. Of those grains, quartz ones are commonly angular to surounded. On the basis of facies changes and sedimentary structures, outcropped fluvial sediment profiles in Kurye are classified into xGyS, mGyS, gGyS, xSM, xS, mS, mGyM, IgM in facies. These eight facies are reformed as facies assemblage I and ll. The facies assemblage I and II are interpreted as the products of the channel deposits in braided stream and flood plain ones besides channels, respectively. The change facies assemblage I with facies assemblage ll imply that depositional environments hadbeen migrated from braied sream to flood plain ones.

• Journal of the Korea Organic Resources Recycling Association
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• v.30 no.3
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• pp.5-12
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• 2022

This study suggests the effective recycling method of sludge waste from various industrial fields to synthesize uniform colloidal silica nanoparticles. In detail, polymers are removed from the sludge waste to attain sludge-extracted silica (s-SiO₂) micron-sized particles, and ammonia assisted sonication is applied to s-SiO₂, which has effectively extracted the silanol precursor. The nano-sized silica (n-SiO₂) particles are successfully synthesized by a typical sol-gel method using silanol precursor. Also, the yield amounts of n-SiO₂ are determined by the function of s-SiO₂ etching time. Finally, n-SiO₂-based slurry is synthesized for the practical CMP application. As a result, rough-surfaced semiconductor chip is successfully polished by the n-SiO₂-based slurry to exhibit the mirror-like clean surface. In this regard, sludge wastes are successfully prepared as valuable semicondutor grade materials.