• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.11a
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• pp.120-124
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• 2004

본 연구는 Diluted Ceria 입자를 사용한 $SiO_2$(Oxide) CMP 현상에 대한 내용이다. Ceria Slurry의 경우 Silica Slurry와 비교하였을 때 Oxide Wafer 표면과 축합 화학반응을 일으키며 Chemistry Dominant한 CMP Mechanism을 따르고, Wafer Center Removal Rate(RR) Fast 의 특성을 가진다. Ceria Slurry의 문제점인 연마 불균일도를 해결하기 위해 Tribological System을 이용하였다. CMP Tribology는 Pad-Slurry 유막-Wafer의 System을 가지며 윤활막에 작용하는 마찰계수(COF)가 주요 인자이다. Tribology에 적용되는 Stribeck Curve를 통해 Slurry 윤활막의 두께(h) 정도를 예상할 수 있으며, 이 윤활막의 두께를 조절함으로써 Uniformity 향상이 가능하다. 이 Ceria Slurry CMP의 연마 불균일도를 향상시킬 수 있는 방법으로 pH 조절 및 점도 증가가 있다. Ceria 입자 CMP는 분산액의 pH 변화에 강한 작용을 받게 되며 PH5 근방에서 최적화된 Uniformity가 가능하다. 점도를 증가시키는 경우 유막 h가 증가하게 되어 Ceria Slurry의 유동이 균일 분포 상태에 가까워지며 Wafer Uniformity 향상이 가능하다.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2000.05a
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• pp.792-795
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• 2000

The magnetic assisted finishing thought to be one of the potential methods for the automatic polishing process. In this study, magnetic assisted finishing process was experimentally attempted to polish the intrnal surface of the cylindrical tube. The newly developed magnetic tool was used, and its polishing performance exmined. From the experimental results, it is found that i ) the newly developed tool is suitable for intrnal surface finishing of the tube. ii ) the surface roughness of 0.9~1${\mu}{\textrm}{m}$Rmax before polishing is improved to the value of 0.2 ${\mu}{\textrm}{m}$Rmax in the finishing experiment of stainless steel STS3602L tube in 6 minutes finishing time.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2004.05a
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• pp.215-215
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• 2004

본 연구는 차세대 FPD의 소재로서 각광받고 있는 유기EL 의 제조공정을 위한 연구이다. 유기 EL 의 모재로서 이용되고 있는 ITO 코팅 유리는 그 표면의 정밀도에 따라서 제품의 불량률이 변화되게 됨으로 제조공정에 있어서는 매우 중요한 역할을 한다. 하지만, ITO 코팅유리의 표면 정밀도를 얻기 위하여 필수적인 연마공정 내에서 연마입자와 ITO 코팅유리의 상호작용에 의하여 연마가 이루어질 뿐 아니라, 불순물의 유입이나 기타 공정조건에 의하여 유리 표면 결함이 발생 및 불균일 연마가 수행되는 것은 피할수 없는 상황이다.(중략)

• Restorative Dentistry and Endodontics
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• v.32 no.6
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• pp.542-549
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• 2007

The purpose of this study was to evaluate the difference in the surface roughness after polishing and to evaluate the difference in color stability after immersion in a dye solution among four types of composite resin materials. Four light-polymerized composite resins(Shade A2) with different sized filler content(a nanofilled, a hybrid, a microfilled, a flowble) were used. Average surface roughness (Ra) was measured with a surface roughness tester (Surftest Formtracer) before and after polishing with aluminum oxide abrasive discs(Super-Snap). Color of specimens before and after staining with 2% methylene blue solution were measured using spectrophotometer(CM-3700d) with SCI geometries. The results of Ra and ${\Delta}E$ were analyzed by one-way analysis of variance(ANOVA), a Scheffe multiple comparison test and Student t-test(p=0.05). After polishing, Ra values were decreased regardless of type of composite resins. In surface roughness after polishing and color stability after staining, nanofilled composite resin was not different with other composite resins except flowable resins.

• Journal of the Korean Society for Precision Engineering
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• v.15 no.2
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• pp.14-20
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• 1998

Automatic finishing process requires the development of high efficient and precision abrasive machining method for dies and molds. This study describes the evaluation of the finishing characteristics, such as surfrace roughness, topography and material removal depth of the electrolytic mixed abrasive machining methods. Experimental setup is composed of 3 axis machining center, a newly developed finishing attachment with constant pressure, electrode and electrolytic bath. Finally, we achieved a successful result that surface roughness is $0.01\mu$m Ra and material removal depth is $120\mu$m using electrolytic(0.8A. 30V) mixed abrasive (#400 CBN, #320 SiC) machining method.

• Journal of the Korean Society for Precision Engineering
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• v.15 no.2
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• pp.53-60
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• 1998

In this study, it is experimented to find factors effecting surface roughness using the system of experiments. in the mirror surface finishing system. (1) The film feed and oscillation frequency in $40{\mu}m$ abrasive film, grinding speed in $30{\mu}m$, and machining time in $15{\mu}m$15 are the main factors effecting the surface roughness. (2) Applying the optimal finishing condition to $40{\mu}m$, $30{\mu}m$, $15{\mu}m$ abrasive finishing film in sequence, it is possible to obtian about Ra 10 nm surface roughness on SM45C workpiece. (3) Application of the system of experments to the micro abrasive grain film finishing was very effective method in the extraction of main factor and optimal condition.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.1832-1835
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• 2003

This paper suggests the selective ultra precision polishing techniques for micro die and mold parts using magnetic-assisted machining. Fabrication of magnetic abrasive particle and their polishing performance are key technology at ultra precision polishing process of micro parts. Conventional magnetic abrasives have disadvantages. which are missing of abrasive particle and inequality between magnetic particle and abrasive particle. So, bonded magnetic abrasive particles are fabricated by several method. For example, plasma melting and direct bonding. Ferrite and carbonyl iron powder are used as magnetic particle where silicon carbide and Al$_2$O$_3$ are abrasive particle. Developed particles are analyzed using measurement device such as SEM. Possibility of magnetic abrasive and polishing performance of this magnetic abrasive particles also have been investigated. After polishing, surface roughness of workpiece is reduced from 2.927 $\mu\textrm{m}$ Rmax to 0.453 $\mu\textrm{m}$ Rmax.

• Transactions of the Korean Society of Automotive Engineers
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• v.12 no.6
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• pp.151-157
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• 2004

In this paper deals with behavior of the magnetic abrasive using sludge on polishing characteristics in a new internal finishing of seamless stainless steel tube applying magnetic abrasive polishing. The magnetic abrasive using sludge-abrasive grain WA and GC used to resin bond fabricated low temperature. And sludge of magnetic abrasive powder fabricated that sludge was crused into 200 mesh. The previous research have made an experiment in the static state the movement of magnetic abrasive grain is nevertheless in the dynamic state. In this paper, We could have investigated into the changes of the movement of magnetic abrasive grain. In reference to this result, we could have made the experiment which is set under the condition of the magnetic flux density, polishing velocity according to the form of magnetic brush.

• Proceedings of the Materials Research Society of Korea Conference
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• 2003.03a
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• pp.61-61
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• 2003

CMP(Chemical Mechanical Polishing)는 VLSI의 제조공정에서 실리콘웨이퍼의 절연막내에 있는 토포그래피를 제어할 수 있는 광역 평탄화 기술이다. 또한 최근에는 실리콘웨이퍼의 나노토포그래피(Nanotopography)가 STI의 CMP 공정에서 연마 후 필름의 막 두께 변화에 많은 영향을 미치게 됨으로 중요한 요인으로 대두되고 있다. STI CMP에 사용되는 CeO$_2$ 슬러리에서 첨가되는 계면활성제의 농도에 따라서 나노토포그래피에 미치는 영향을 제어하는 것이 필수적 과제로 등장하고 있다. 본 연구에서는 STI CMP 공정에서 사용되는 CeO$_2$ 슬러리에서 계면활성제의 농도에 따른 나노토포그래피의 의존성에 대해서 연구하였다. 실험은 8 "단면연마 실리콘웨이퍼로 PETEOS 7000$\AA$이 증착 된 것을 사용하였으며, 연마 시간에 따른 나노토포그래피 의존성을 알아보기 위해 연마 깊이는 3000$\AA$으로 일정하게 맞췄다. 그리고 CMP 공정은 Strasbaugh 6EC를 사용하였으며, 패드는 IC1000/SUBA4(Rodel)이다. 그리고 연마시 적용된 압력은 4psi(Pounds per Square Inch), 헤드와 정반(table)의 회전속도는 각각 70rpm이다 슬러리는 A, B 모두 CeO$_2$ 슬러리로 입자크기가 다른 것을 사용하였고, 농도를 달리한 계면활성제가 첨가되었다. CMP 전 후 웨이퍼의 막 두께 측정은 Nanospec 180(Nanometrics)과 spectroscopic ellipsometer (MOSS-ES4G, SOPRA)가 사용되었다.

• Analytical Science and Technology
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• v.19 no.5
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• pp.394-399
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• 2006

The polishing performance and the relationships of electrochemistry depending upon oxidizers and additives in the tungsten CMP slurry used in semiconductor industry were investigated. Hydrogen peroxide, ferric nitrate and potassium iodate were used as oxidizers and they showed different oxidation reactions on tungsten film depending on the kind of oxidizers and pH of slurry. The differences influenced the polishing performance. Etching reaction was predominated in the hydrogen peroxide. However, passivation reaction was prevailed in ferric nitrate and potassium iodate. TMAH and KOH raised the potential energy and removal rate of tungsten, and improved a dispersion characteristic of slurry by increasing absolute value of zeta potential. Addition of 100 ppm of poly(acrylic acid) of M.W. 250,000 improved dispersion ability.