• Transactions of the Korean Society of Mechanical Engineers A
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• v.35 no.4
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• pp.401-407
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• 2011

The conventional method of magnetic abrasive polishing is not suitable for non-magnetic materials because such polishing is basically possible when magnetic force exists and the magnetic force in non-magnetic materials is very low. The installation of an electromagnet under the working area of a non-magnetic material, which is called second-generation magnetic abrasive polishing in this study, can enhance the magnetic force. Experimental evaluation and optimization of process parameters for polishing magnesium alloy steel was performed by adopting the design of experiments and the response surface method. The results indicated that the intensity of the magnetic force and spindle speed are significant parameters that affect the improvement of surface roughness. A prediction model for the surface roughness of the magnesium alloy steel is developed using the second-order response surface method.

• Proceedings of the KAIS Fall Conference
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• 2002.11a
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• pp.258-259
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• 2002

본 연구는 304 STS을 전해연마하여 표면의 조도를 나노 단위까지 제어하기 위한 leveller의 개발이 목적이다. 이를 위해서 AFM을 이용하여 조도를 측정하였고 분극실험을 통해 표면특성을 연구하였다. 전해연마는 인산:황산:증류수를 8:1:1 비율로 전해액을 만들었고 부가적으로 첨가제를 넣어 전해연마를 실행했다. 분극실험은 일정한 전극간격을 유지하여 정전압 조건에서 1mV/s의 속도로 주사하여 실험하였다. 전해연마 시간이 증가함에 따라, 첨가제의 양이 적게 들어갈수록 평활도가 향상됨을 볼 수 있었다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.07a
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• pp.42-43
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• 2005

본 연구에서는 Cu 슬러리에 부식방지제인 BTA를 첨가하여 슬러리내의 과수의 농도, pH 의 변화, 연마입자의 종류에 따라 연마거동에 미치는 영향과 각 chemical 변화에 따른 Cu surface의 변화를 살펴보았다. BTA (Benzotriazole, $C_6H_4C_3H$)를 첨가함으로써 본 연구에서 시행된 pH 와 과수의 변화에 상관없이 Cu-BTA film을 형성하여 Cu의 dissolution을 최대한 억제하는 것을 확인할 수 있었다. 또 그로인해 BTA를 첨가하지 않았을 때보다 얇은 passivation layer를 형성함을 알 수 있었고 contact angle도 더 높았다. 연마율의 경우에도 BTA가 첨가됨으로써 감소됨을 확인할 수 있었고 연마입자로 alumina particle을 사용한 경우에는 pH6, 과수 10vol%이상에서는 오히려 연마율이 증가하였다. fumed silica의 경우에는 hardness가 작아 mechanical적인 제거력이 낮아 BTA가 첨가되어도 연마율에는 큰 영향이 없었다.

• Proceedings of the Materials Research Society of Korea Conference
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• 2011.05a
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• pp.32.2-32.2
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• 2011

반도체 생산공정에서 CMP (Chemical-mechanical planarization) 공정은 우수한 전기전도성 재료인 Cu의 사용과 다층구조의 소자를 형성하기 위해서 도입되었으며, 최근 소자의 집적도가 증가함에 따라 CMP 공정 비중은 점점 높아지고 있다. Cu CMP 공정에서 연마제인 슬러리는 금속 표면과의 물리적 화학적 반응을 동시에 사용하여 표면을 연마하게 되며, 연마특성을 향상시키기 위해 산화제, 부식방지제, 분산제 및 다양한 계면활성제가 첨가된다. 하지만 슬러리는 Cu 표면을 평탄화하는 동시에 오염입자, 유기오염물, 스크레치, 표면부식 등을 발생시키며 결과적으로 소자의 결함을 야기시킨다. 특히 부식방지제로 사용되는 BTA (Benzotriazole)은 Cu CMP 공정 중 Cu-BTA 형태로 표면에 흡착되어 오염원으로 작용하며 입자오염을 증가시시고 건조공정에서 물반점 등의 표면 결함을 발생시킨다. 이러한 문제점을 해결하기 위해 Cu 표면에서 식각과 부식반응을 최소화하며, 오염입자 제거 및 유기오염물을 효과적으로 제거하기 위한 Post-CMP 세정 공정과 세정액 개발이 요구된다. 본 연구에서는 오염입자 및 유기물 제거와 동시에 표면 거칠기와 부식현상을 제어할 수 있는 post Cu CMP 세정액을 개발 평가하였다. 오염입자 및 유기오염물을 제거하기 위해서 염기성 용액인 TMAH 사용하였으며, Cu 이온을 용해할 수 있는 Chelating agent와 표면 부식을 억제하는 부식 방지제를 사용하여 세정액을 합성하였다. 접촉각 측정과 FESEM(field Emission Scanning Electron Microscope) 분석을 통하여 CMP 공정에서 발생하는 유기오염물과 오염입자의 흡착과 제거를 확인하였으며 Cu 웨이퍼 세정 전후의 표면 거칠기의 변화와 식각량을 AFM(Atomic Force Microscope)과 4-point probe를 사용하여 각각 평가하였다. 또한 세정액 내에서의 연마입자의 zeta-potential을 측정 및 조절하여 세정력을 향상시켰다. 개발된 세정액과 Cu 표면에서의 화학반응 및 부식방지력은 potentiostat를 이용한 전기화학 분석법을 통해서 chelating agent와 부식방지제의 농도를 최적화 시켰다. 개발된 세정액을 적용함으로써 Cu-BTA 형태의 유기오염물과 오염입자들이 효과적으로 제거됨을 확인하였다.

• Proceedings of the KSME Conference
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• 2004.11a
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• pp.922-927
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• 2004

Abrasive waterjet (AWJ) cutting is an emerging technology for precision cutting of difficult-to-machining materials with the distinct advantages of no thermal effect, high machinability, high flexibility and small cutting forces. This paper investigated theoretical and experimental cutting characteristics associated with abrasive waterjet cutting of quartz GE214. It is shown that the proper variations of several cutting parameters such as waterjet pressure, cutting speed and cutting depth improve the roughness on workpiece surfaces produced by AWJ cutting. From the experimental results by AWJ cutting of quartz GE214, the optimal cutting conditions to improve the surface roughness were proposed and discussed.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.16 no.5
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• pp.183-190
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• 2007

It is well known that abrasive waterjet(AWJ) was developed as a kind of high-density energy processing technologies. AWJ is used to obtain the better cutting quality of various materials such as metals, ceramics, glass and composite materials within a short manufacturing time because of the characteristics of heatless and noncontact processing. However, AWJ device still has some problems to obtain the high quality of thin workpiece. In this paper, we investigated the optimal microcutting conditions of AWJ, such as maximum pressure, cutting speed and standoff distance of thin multi-layered materials. The experimental results show that AWJ has possibilities and potential to apply to the microcutting of thin multi-layered materials for IT industrial applications.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.16 no.6
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• pp.465-470
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• 2003

The chemical mechanical polishing (CMP) process has been widely used for the global planarization of multi-layer structures in semiconductor manufacturing. The CMP process can be optimized by several parameters such as equipment, consumables (pad, backing film and slurry), process variables and post-CMP cleaning. However, the COO(cost of ownership) is very high, because of high consumable cost. Especially, among the consumables, the slurry dominates more than 40 %. In this paper, we have studied the CMP characteristics of diluted silica slurry by adding of raw alumina abrasives and annealed alumina abrasives. As an experimental result, we obtained the comparable slurry characteristics compared with original silica slurry in the view-point of high removal rate and low non-uniformity. Therefore, we can reduce the cost of consumables(COC) of CMP process for ULSI applications.

• Transactions of the Korean Society of Automotive Engineers
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• v.13 no.2
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• pp.118-126
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• 2005

Abrasive waterjet (AWJ) cutting is an emerging technology for precision cutting of difficult-to-machining materials with the distinct advantages of no thermal effect, high machinability, high flexibility and small cutting forces. This paper investigated theoretical and experimental cutting characteristics associated with abrasive waterjet cutting of quartz GE214. It is shown that the proper variations of several cutting parameters such as waterjet cutting pressure, cutting speed and cutting depth improve the roughness on workpiece surfaces produced by AWJ cutting. From the experimental results by AWJ cutting of quartz GE214, the optimal cutting conditions to improve the surface roughness and precision were proposed and discussed.

• Journal of Periodontal and Implant Science
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• v.13 no.1
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• pp.61.1-61.1
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• 1983

• Journal of the Korea institute for structural maintenance and inspection
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• v.24 no.6
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• pp.42-49
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• 2020

This paper is a basic study to improve durability by imparting hydrophobicity to the surface and sphere of cement-based materials. A cement mortar to which a silane/siloxane-based mixed water repellent was added was prepared, and its initial hydration performance, flow performance, and compressive strength were measured. In addition, after the surface was abraded, the water contact angle and water absorption were measured. The flow of cement mortar to which the water repellent was added was found to decrease up to 1.5% in the addition amount of the water repellent agent, and increased at 3.0% in the addition amount. It was found that the setting time of the cement paste was delayed in both the initial setting and the termination when the water repellent was added. It was found that the compressive strength decreased from 3.0% of the maximum added amount of the water repellent to a maximum of 30%. The contact angle was found to increase when the water repellent was added to the cement mortar, and the contact angle after surface polishing was found to be larger than before surface polishing. The addition of the water repellent showed hydrophobicity not only on the surface but also on the surface and cross section damaged by polishing. The water absorption rate was found to decrease when the water repellent was added to the cement mortar, and the water absorption rate after surface polishing was found to be greater than before surface polishing.