• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.07a
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• pp.647-648
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• 2005

The development of CMP slurry chemistry for Ni that provides good CMP performance is the key for nickel based MEMS device fabrication. In this study, CMP of nickel was performed using different slurry versus oxidizer ratios arid different oxidizers also alumina particles as an abrasive.

• Restorative Dentistry and Endodontics
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• v.35 no.3
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• pp.164-172
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• 2010

During a composite resin restoration, an anticipating contraction gap is usually tried to seal with low-viscosity resin after successive polishing, etching, rinsing and drying steps, which as a whole is called rebonding procedure. However, the gap might already have been filled with water or debris before applying the sealing resin. We hypothesized that microleakage would decrease if the rebonding agent was applied before the polishing step, i.e., immediately after curing composite resin. On the buccal and lingual surfaces of 35 extracted human molar teeth, class V cavities were prepared with the occlusal margin in enamel and the gingival margin in dentin. They were restored with a hybrid composite resin Z250 (3M ESPE, USA) using an adhesive AdperTM Single Bond 2 (3M ESPE). As rebonding agents, BisCover LV (Bisco, USA), ScotchBond Multi-Purpose adhesive (3M ESPE) and an experimental adhesive were applied on the restoration margins before polishing step or after successive polishing and etching steps. The infiltration depth of 2% methylene blue into the margin was measured using an optical stereomicroscope. The correlation between viscosity of rebonding agents and mciroleakage was also evaluated. There were no statistically significant differences in the microleakage within the rebonding procedures, within the rebonding agents, and within the margins. However, when the restorations were not rebonded, the microleakage at gingival margin was significantly higher than those groups rebonded with 3 agents (p < 0.05). The difference was not observed at the occlusal margin. No significant correlation was found between viscosity of rebonding agents and microleakage, except very weak correlation in case of rebonding after polishing and etching at gingival margin.

• The Journal of Korean Academy of Prosthodontics
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• v.54 no.4
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• pp.407-412
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• 2016

The neutral zone technique is an alternative approach for the construction of complete dentures on highly atrophic ridges with history of denture instability. This technique achieves two objectives. First, the teeth will not interfere with the normal muscle function, and second, the force exerted by the musculature against the denture is more favorable for stability and retention. In this case of a 78-years-old female patient with severely atrophic ridges who had been using unstable complete dentures, the neutral zone impression technique was used to increase the stability and the retention of dentures. The neutral zone for both arch was located with modeling compound. After the arrangement of artificial teeth within the neutral zone, the external impression was taken to determine the tissue surface. The final dentures showed enhanced stability and retention and the patient was satisfied with the new dentures with respect to functional and esthetic aspects.

• Journal of the Korean Society for Library and Information Science
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• v.36 no.3
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• pp.311-330
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• 2002

A public librarian is an occupation, which requires long-term. continuous training and difficult study to acquire and cultivate professional knowledge and skills. It is a necessity to achieve new knowledge, information and skills via appropriate retraining. A training system is the method which gives chances of retraining to public librarians. After examining some of the problems with the existing training system, it is apparent that the direction of training system needs to be decentralized. That is each local branch should be autonomous in terms of new training for librarians. For the method of training system, each autonomous unit would integrate the different theories to apply to the community-at-large and invite practical specialists from the local community to lecture. The training classes would be elective in that the each librarian could choose the classes he/she wants to take and give them credits for that, but the certificate for the class would also go towards completion for the required technical training. Finally, the utilization of cyber-education should be introduced, and the library association's role strengthened, to help public librarians cultivate their specialties.

• The Journal of Korean Academy of Prosthodontics
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• v.46 no.5
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• pp.511-519
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• 2008

Statement of problem: An incompatibility between the initiator systems of self-curing composite resins and light-curing adhesives was supposed recently. Purpose: The purpose of the study was to evaluate the influence of activators for self/dual bonding on dentin shear bonding strengths. Material and methods: Fifty human molars were divided into 5 groups. A flat dentin surface was created for each tooth. A self-curing composite resin (Luxacore) was bonded with the following adhesives (n = 10); One-Step, Prime&Bond NT, AdheSE, Prime&Bond NT and AdheSE were also used in combination with activators. Shear bond strengths were measured after 24 hours of water storage. The specimens were loaded in shear in the Instron until failure at a 1 mm/min crosshead speed. Data were compared using one-way ANOVA and Tukey HSD test (${\alpha}$= 0.05). Results: The dentin adhesive systems in order of decreasing median bond strength were One-Step > Prime&Bond NT with activator, AdheSE with activator > Prime&Bond NT, AdheSE. Among adhesives, One-Step had the highest bond strength. Prime&Bond NT with activator had higher bond strengths than Prime&Bond NT that was used alone, and so was AdheSE. Conclusion: Shear bond strengths were increased in Prime&Bond NT and AdheSE when these were used with activators comparing used without activators. But using activators was not effective clinically comparing One-Step.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.2 no.4
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• pp.17-24
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• 2003

Chemical mechanical polishing(CMP) has been applied for planarization of topography after patterning process in semiconductor fabrication process. Tungsten CMP is necessary to build up interconnects of semiconductor device. But the tungsten dishing and the oxide erosion defects appear at end-point during tungsten CMP. It has been known that the generation of dishing and erosion is based on the over-polishing time, which is determined by pattern selectivity. Fixed abrasive pad takes advantage of decreasing the defects resulting flam reducing pattern selectivity because of the lower abrasive concentration. The manufacturing technique of fixed abrasive pad using hydrophilic polymers is introduced in this paper. For application to tungsten CMP, chemicals composed of oxidizer, catalyst, and acid were developed. In comparison of the general pad and slurry for tungsten CMP, the fixed abrasive pad and the chemicals resulted in appropriate performance in point of removal rate, uniformity, material selectivity and roughness.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.14 no.6
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• pp.2612-2617
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• 2013

This study aims to develop hair cutter with zirconia($ZrO_2$) material whose machinability, corrosion resistance, wear resistance and bio-compatibility are excellent by comparing iron hair cutter. Ultra-thin zirconia cutter with the thickness of 0.253mm is manufactured through the optimization of design, molding, sintering, grinding and grinding process. With observation result of cutter specimen by use of scanning electron microscope(SEM), formability and process of cutting face are shown to be good. It is also evaluated with sufficient merchantability by cutting test results. The cutter process technology of thin zirconia can be utilized at the development of high value-added beauty appliances like razor, beauty-razor and eye brows-razor for woman by use of study result.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.05c
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• pp.158-161
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• 2003

The primary aim of this study is to investigate new semi-abrasive free slurry including acid colloidal silica and hydrogen peroxide for copper chemical-mechanical planarization (CMP). In general, slurry for copper CMP consists of colloidal silica as an abrasive, organic acid as a complex-forming agent, hydrogen peroxide as an oxidizing agent, a film forming agent, a pH control agent and several additives. We developed new semi-abrasive free slurry (SAFS) including below 0.5% acid colloidal silica. We evaluated additives as stabilizers for hydrogen peroxide as well as accelerators in tantalum nitride CMP process. We also estimated dispersion stability and Zeta potential of the acid colloidal silica with additives. The extent of enhancement in tantalum nitride CMP was verified through anelectrochemical test. This approach may be useful for the application of single and first step copper CMP slurry with one package system.

• Proceedings of the KIEE Conference
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• 2006.07c
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• pp.1384-1385
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• 2006

Platinum is a candidate of top and bottom electrode in ferroelectric random access memory and dynamic random access memory. High dielectric materials and ferroelectric materials were generally patterned by plasma etching, however, the low etch rate and low etching profile were repoted. We proposed the damascene process of high dielectric materials and ferroelectric materials for patterning process through the chemical mechanical polishing process. At this time, platinum as a top electrode was used for the stopper for the end-point detection as Igarashi model. Therefore, the control of removal rate in platinum chemical mechanical polishing process was required. In this study, an addition of $H_{2}O_{2}$ oxidizer to alumina slurry could control the removal rate of platinum. The removal rate of platinum rapidly increased with an addition of 10wt% $H_{2}O_{2}$ oxidizer from 24.81nm/min to 113.59nm/min. Within-wafer non-uniformity of platinum after chemical mechanical polishing process was 9.93% with an addition of 5wt% $H_{2}O_{2}$ oxidizer.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.11a
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• pp.529-529
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• 2007

Ruthenium (Ru) is a white metal and belongs to platinum group which is very stable chemically and has a high work function. It has been widely studied to apply Ru as an electrode material in memory devices and a Cu diffusion barrier metal for Cu interconnection due to good electrical conductivity and adhesion property to Cu layer. To planarize deposited Ru layer, chemical mechanical planarization(CMP) was suggested. However, abrasive particle can induce particle contamination on the Ru layer surface during CMP process. In this study, zeta potentials of Ru and interaction force of alumina particles with Ru substrate were measured as a function of pH. The etch rate and oxidation behavior were measured as a function of chemical concentration of several organic acids and other acidic and alkaline chemicals. PRE (particle removal efficiency) was also evaluated in cleaning chemical.