• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
• /
• 2013.05a
• /
• pp.509-512
• /
• 2013

In this paper, force feedback control for industrial robots has been proposed as a system which is suitable to work utilizing pressure sensitive alternative to human. Conventionally, polished surface of the workpiece are recognized, chamfer ridge, machining processes such as deburring, and it is most difficult to automate because of its complexity, has been largely dependent on the human.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2008.11a
• /
• pp.295-296
• /
• 2008

• Proceedings of the Materials Research Society of Korea Conference
• /
• 2002.05a
• /
• pp.134-134
• /
• 2002

• Proceedings of the Materials Research Society of Korea Conference
• /
• 2002.11a
• /
• pp.67-67
• /
• 2002

• Proceedings of the KSME Conference
• /
• 2008.11a
• /
• pp.1880-1884
• /
• 2008

Cleaning is required following CMP (chemical mechanical planarization) to remove particles. The minimization of particle residue is required with each successive technology generation, and the cleaning of wafers becomes more complicated. In copper damascene process for interconnection structure, it utilizes 2-steop CMP consists of Cu CMP and barrier CMP. Such a 2-steps CMP process leaves a lot of abrasive particles on the wafer surface, cleaning is required to remove abrasive particles. In this study, the buffing is performed various conditions as a cleaning process. The buffing process combined mechanical cleaning by friction between a wafer and a buffing pad and chemical cleaning by buffing solution consists of tetramethyl ammonium hydroxide (TMAH)/benzotriazole(BTA).

• Transactions of the Korean Society of Mechanical Engineers A
• /
• v.28 no.11
• /
• pp.1807-1812
• /
• 2004

The application of chemical mechanical polishing(CMP) has a long history. Recently, CMP has been used in the planarization of the interlayer dielectric(ILD) and metal used to form the multilevel interconnections between each layers. Therefore, much research has been conducted to understand the basic mechanism of the CMP process. CMP performed by the down force and the relative speed between pad and wafer with slurry is typical tribo-system. In general, studies have indicated that removal rate is relative to energy. Accordingly, in this study, CMP results will be analyzed by a viewpoint of the friction energy using friction force measurement. The results show that energy would not constant in the same removal rate conditions

• Transactions of the Korean Society of Mechanical Engineers A
• /
• v.39 no.9
• /
• pp.923-928
• /
• 2015

In this paper, we propose an ultrasonic magnetic abrasive polishing (US-MAP) technique to effectively machine a high-strength material, and we prove the efficiency of hybrid finishing. We use Taguchi's experimental method to determine the influence of each parameter. Based on the results, US-MAP exhibited a higher polishing efficiency than traditional MAP, and a suitable frequency for hybrid finishing was 28 kHz. When investigating the effect of the parameters on the surface roughness, the ultrasonic amplitude had the greatest effect. However, when machining with $55-{\mu}m$ amplitude, the machining efficiency decreased as the magnetic flux density varied.

• Transactions of the Korean Society of Mechanical Engineers A
• /
• v.36 no.3
• /
• pp.259-264
• /
• 2012

Automatic magnetic abrasive polishing (MAP), which can be applied after machining of a mold on a machine tool without unloading, is very effective for finishing a free-form surface such as a complicated injection mold. This study aimed to improve the efficiency of MAP of a non-ferrous mold surface. The magnetic array table and control of the electromagnet polarity were applied in the MAP of a free-form surface. In this study, first, the magnetic flux density on the mold surface was simulated to determine the optimal conditions for the polarity array. Then, the MAP efficiency for polishing a non-ferrous mold surface was estimated in terms of the change in the radius of curvature and the magnetic flux density. The most improved surface roughness was observed not only in the upward tool path but also in the working area of larger magnetic flux density.

• Transactions of the Korean Society of Mechanical Engineers A
• /
• v.35 no.4
• /
• pp.401-407
• /
• 2011

The conventional method of magnetic abrasive polishing is not suitable for non-magnetic materials because such polishing is basically possible when magnetic force exists and the magnetic force in non-magnetic materials is very low. The installation of an electromagnet under the working area of a non-magnetic material, which is called second-generation magnetic abrasive polishing in this study, can enhance the magnetic force. Experimental evaluation and optimization of process parameters for polishing magnesium alloy steel was performed by adopting the design of experiments and the response surface method. The results indicated that the intensity of the magnetic force and spindle speed are significant parameters that affect the improvement of surface roughness. A prediction model for the surface roughness of the magnesium alloy steel is developed using the second-order response surface method.

• Journal of the Korean Society of Manufacturing Process Engineers
• /
• v.15 no.2
• /
• pp.72-77
• /
• 2016

Airplane reservoirs made of Al7075 are coated with an anodizing layer to maintain precision, air tightness and corrosion resistance. It is commonly required that the inner surface roughness of the reservoir be less than an average $0.2{\mu}m$ to maintain stable oil pressure. Even though precision polishing is necessary to achieve this quality it is not easy. Inner surface roughness is not uniform and the quality of the product is irregular because most of the work is done by hand. The purpose of this study is to design an exclusive polishing machine and to determine the standard cutting condition and polishing condition necessary for good inner surface roughness and to improve workefficiency.