• Korean Journal of Optics and Photonics
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• v.23 no.1
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• pp.12-16
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• 2012

In the paper, we fabricated a Ni master with $45^{\circ}$-mirror structures for flexible waveguide fabrication. The flexible waveguide films with embedded $45^{\circ}$-angled mirrors at the waveguide ends were successfully fabricated using a UV-imprint process. Next, in order to enhance the reflectivity of the mirrors, Ni(3 nm)-Au(200 nm) bilayers were evaporated on the $45^{\circ}$-angled facets through a locally opened thin mask using an electron beam evaporator. We measured propagation loss, bending loss, mirror loss and bending reliability of the fabricated waveguide.

• Journal of the Korean Institute of Gas
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• v.16 no.6
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• pp.102-106
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• 2012

The purpose of this paper is to study the failure cases in relation to system of Air Bag in vehicle happened in the field. In the first example, it was separated the soldering parts connected the wire pin between air bag module and clock spring of air bag. Whenever the pin shake by the car's vibration, the driver verified the malfunction phenomenon appeared air bag warning lamp on instrument panel in front of driver's seat. in car inside room. The second example, it verified the warning lamp lighting phenomenon of air bag by produced the circuit plate non-contacting of single an element in air bag electronic control unit. The third example, it verified the light of air bag warning indicator lamp by separated with soldering parts connecting inner pin and resistance terminal of seat belt pretensioner using passenger seat. The fourth example, when the passenger car crash a back of truck, the former bumper get jammed under the latter as the roof height of car low less than that. Therefore, the impact of Car's collision verified that don't transfer with body frame of vehicle because of no attachment impact sensor in it.

• Journal of the Korean Institute of Gas
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• v.20 no.5
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• pp.57-63
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• 2016

Though a valve is a very important part in a system to control properly, it has potential failure caused by gap from valve stem to ball connection, and abrasion, crack, fixation causing operational trouble and accidents. 64% of the valve failure in the real case was the failure of airtightness and most accidents of leakage and explosion were occurred while fixing the failure. While there are no proper safety manual, maintenance procedure and regulation for industrial valves excluding safety valve, safety management for the valves is left to the discretion of the maintenance company. Strict maintenance that removes hazards and emergency response procedure are required to prevent and reduce the loss of accident. This study suggests safety enhancement measures through valve monitoring by investigating the status of use of valve and current maintenance. Enhancement of gas safety management can be acquired by a monitoring system that provides diagnosis for valve status, monitoring real-time gas leakage, management of entire cycle lifetime that can reduce maintenance cost.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.15 no.4
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• pp.833-838
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• 2011

RFID system in manufacturing industry is used to collect, categorize, and process the data of products. To install RFID system for a large factory, a large amount of wired data communication network is necessary for RS232 communication. If the installed location of RFID system in the factory is changed or extended, a reinstallment is required for the already installed wired data network. A large amount of time/financial reinvestment is necessary for such reinstallation. By using wireless data communication network, however, the initial installation and reinstallation are very simple. In this paper, we implemented a wireless communication system and RFID system. We used the CC1020 chip for wireless communication system and EM4095 chip for RFID system. CC1020 chip enables highly-reliable data communication, and by setting a simple status register, it can switch between transmitting/receiving status and it can choose the desired frequency of either 400 MHz or 900 MHz. Also, Communication range is 50 m, if external antenna is used. EM4095 is a chip for RFID reader system with the carrier frequency of 125 KHz. This chip can implement the reader system by connecting a small number of components. And EM4100 was used for RFID system. EM4100 is read-only type. Atmega128 is used to control a wireless communication system and RFID system. We confirm that the system can communicate without error up to 50 m from sender. In the paper, the circuit diagram and operation program for CC1020 and RFID system are presented. The system used in the experiment is shown in pictures, and the data movement pattern of CC1020 is shown in the diagram, and the performance of each transmission method is presented.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.40 no.2
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• pp.221-227
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• 2016

The main shaft is one of the key components connecting the rotor hub and gear box of a wind power generator. Typically, main shafts are manufactured by open die forging method. However, the main shaft for large MW class wind generators is designed to be hollow in order to reduce the weight. Additionally, the main shafts are manufactured by a casting process. This study aims to develop a manufacturing process for hollow main shafts by the open die forging method. The design of a forging process for a solid main shaft and hollow shaft was prepared by an open die forging process design scheme. Finite element analyses were performed to obtain the flow stress by a hot compression test at different temperature and strain rates. The control parameters of each forging process, such as temperature and effective strain, were obtained and compared to predict the suitability of the hollow main shaft forging process. Finally, high productivity reflecting material utilization ratio, internal quality, shape, and dimension was verified by the prototypes manufactured by the proposed forging process for hollow main shafts.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.38 no.10
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• pp.1185-1191
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• 2014

Gas turbine blades that have complex geometry of the cooling holes and cooling passages are usually subjected to cyclic and sustained thermal loads due to changes in the operating characteristic in combined power plants; these results in non-uniform temperature and stress distributions according to time to gas turbine blades. Those operation conditions cause creep or thermo-mechanical fatigue damage and reduce the lifetime of gas turbine blades. Thus, an accurate analysis of the stresses caused by various loading conditions is required to ensure the integrity and to ensure an accurate life assessment of the components of a gas turbine. It is well known that computational analysis such as cross-linking process including CFD, heat transfer and stress analysis is used as an alternative to demonstration test. In this paper, temperatures and stresses of gas turbine blade were calculated with fluid-structural analysis integrating fluid-thermal-solid analysis methodologies by considering actual operation conditions. Based on analysis results, additionally, the total lifetime was obtained using creep and thermo-mechanical damage model.

• Journal of Technology Innovation
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• v.23 no.3
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• pp.287-316
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• 2015

The trend of R&D in automotive electronics industry is shifting towards ECU(Electronic Control Units) based on softwares which requires technology convergence to accommodate customers' requests on safety and convenience. The trend requires systemized R&D paradigm which reflects increased role of softwares. As the softwares became the core components in automotive innovation, there has been wide range of efforts to introduce software R&D processes and methodologies such as CMMI, A-SPICE and ISO-26262 etc. However, R&D departments in the industry fields are confronted with conflicts which arise from discrepancies among the individual process. In this study, we focus on suggesting our integrated and systematic R&D process with the aim of alleviating the conflicts and confusions. For this purpose, we analyze the cases of Korean automotive electronics companies to compare various R&D processes in the field and their relationships. Based on the analysis, we derive and suggest our model of R&D process which effectively integrate ISO/TS-16949 for manufacturing quality and CMMI, A-SPICE, ISO-26262 for system with softwares.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.19 no.4
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• pp.578-585
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• 2018

This paper proposes a design method for a 3-phase interior permanent magnet synchronous motor (IPMSM) and clamping force control method for an electro-mechanical brake (EMB) using co-simulation for a high-speed train (HST). A traditional pneumatic brake system needs much space for the compressor, brake reservoir, and air pipe. However, an EMB system uses up to 50% less space due to the use of a motor and electric wires for controlling the brake caliper. In addition, it can reduce the latency time for brake control because of the fast response and precise control. A train that has many brakes is advantageous for safety because of the control by sharing the braking force. In this paper, a driving method for a cam-shaft-type EMB is modeled. It is different from the ball-screw-type brakes that are widely used in automobiles. In addition, a co-simulation method is proposed using JMAG and Matlab/Simulink. The IPMSM was designed and analyzed with the JMAG tool, and the control system was simulated using Matlab/Simulink. The effectiveness of the co-simulation results of the mechanical clamping force and braking force was verified by comparison with the clamping force specifications of a HEMU-430X HST.

• Korean Journal of Optics and Photonics
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• v.5 no.3
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• pp.423-430
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• 1994

We designed and fabricated the single mode fiber pigtailed DFB-LD module for 2.5 Gbps optical communication system. In the design of the DFB-LD module, we made the module divided into two parts of inner sub-module and outer 14-pin butterfly package and cylindrical shaped sub-module contain quasi confocal 2 lens system including optical isolator and electrical connection between these parts via hybrid substrate of bias T circuit. Laser welding was used to assemble the sub-module which requires accurate fixing between optical elements. The fabricated DFB-LD module showed optical coupling efficiency of 20% and - 3 dB small signal response of more than 2.6 GHz. We confirmed mechanical reliability of the module by temperature cycle test where the tested module exhibit optical power fluctuation of less than 10%. Finally we evaluated the performance of the fabricated DFB-LD module as light source of 2.5 Gbps optical communication system, sensitivity of - 30.2 dBm was obtained through 47 km optical fiber transmission under the criterion of $1\times10^{-10}$ BER and transmission penalties were 1.5 dB caused by extinction ratio and 1.0 dB caused by chromatic dispersion of normal single mode fiber. fiber.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.38 no.10
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• pp.687-698
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• 2001

This paper presents a three dimensional stacked pad area away (PAA) package configuration as an implementation method of radio frequency (RF) circuits. 224MHz RF circuits of intelligence traffic system(ITS) were constructed with the stacked PAA RF pakage configuration. In the process of manufacturing the stacked PAA RF pakage, RF circuits were partitioned to subareas following their function and operating frequency. Each area of circuits separated to each subunits. The operating characteristics of RF PAA package module and the electrical properties of each subunits were examined. The measurement of electrical parameters for solder balls which were interconnects for stacked PAA RF packages showed that the parasitic capacitance and inductance were 30fF and 120pH, respectively, which might be negligible in PAA RF packaging system. HP 4396B network/spectrum analyzer revealed that the amplification gain of a receiver and transmitter at 224 MHz was 22dB and 27dB, respectively. The gain was 3dB lower than designed values. The difference was probably generated from fabrication process of the circuits by employing commercial standard