Decomposing the Electro-Mechanical Signatures of Collocated Piezoelectric Wafers for the Baseline-Free Damage Diagnosis of a Plate (판의 무기저 손상 진단을 위한 병치형 압전웨이퍼의 전기역학적 신호 분해)
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- Proceedings of the Computational Structural Engineering Institute Conference
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- 2010.04a
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- pp.347-351
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- 2010