• Proceedings of the Korean Society of Propulsion Engineers Conference
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• 1997.04a
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• pp.147-159
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• 1997

본 연구에서는 상변화 영역에서 열평형 방정식을 별도로 수식화하지 않고도 잠열의 영향을 고려할 수 있으며, 고상과 액상 그리고 2상 영역에서 동일한 형태의 방정식을 사용할 수 있는 엔탈피법을 이용하였다. 상변화 문제의 엔탈피법을 이용한 유한요소해석을 위하여 8개의 절점을 가지며, 각 절점에서 1개의 자유도를 가지는 3차원 육면체 요소가 개발되었다. 해법의 타당성과 해의 정확도를 검증하기 위하여 엄밀해가 존재하는 상변화 문제를 유한요소법으로 해석하고 그 결과를 비교 검토하였다. 연구 결과, 엔탈피법에 의한 유한요소해는 상변화 영역이 하나의 특정 온도인 경우는 물론 온도 구간으로 나타나는 경우에도 시간 증분과 요소수에 크게 영향을 받지 않고 안정된 해가 됨을 알 수 있었다. 검증된 요소를 이용하여 3차원 상변화 문제에 적용하여 해를 나타내었다.

• Korean Journal of Food Science and Technology
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• v.25 no.4
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• pp.400-403
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• 1993

Gelatinization degrees of torn and waxy corn starches in the low-moisture environment were determined by DSC thermogram and enzymatic analysis, the results were compared each other As the moisture content increased from 20% to 70%, the enthalpy of endothermic peak of starch increased linearly in DSC thermograms. When the moisture content exceeded above 70%, the DSC enthalpy of starch remained constant in DSC thermogram. The enthalpies for gelatinization of corn and waxy corn starches were 3.23 cal/g and 4.2 cal/g, respectively. When gelatinization degrees of starches were measured by enzymatic analysis, the gelatinization degree increased linearly as the moisture content increased from 20% to 80%. A linear correlation between DSC and enzymatic analysis was obtained only when the moisture content was under 70%.

• Electrical & Electronic Materials
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• v.8 no.6
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• pp.715-720
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• 1995

기계적 합금화법에 의한 비정질화 과정을 Ni-Ta계 및 Cu-Ta계에 대하여 조사하였다. Ni-Ta합금계는 혼합엔탈피가 음이나, Cu-Ta계는 혼합엔탈피가 양인 열역학적으로 대조적인 합금계이다. 볼밀 중 발생하는 원자구조 변화를 중성자회절법을 이용하여 관찰하였다. 두 합금게에 있어서 기계적 합금화에 의한 비정질상이 생성되었다. 비정질 Cu-Ta합금의 local원자구조를 혼합엔탈피가 크게 음인 Ni-Ta계의 결과와 비교하였다. 그 결과, 대조적 특성을 가진 두 합금계임에도 불구하고 원자크기가 작은 Ni 및 Cu가 bcc Ta의 결정격자 속으로 우선적으로 침입함으로써 비정질화가 진행됨을 알 수 있었다.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.23 no.10
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• pp.1213-1222
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• 1999

A finite element method is developed for calculating the temperature and enthalpy distribution and accordingly the solid, liquid and mushy zone in a three-dimensional body subjected to any heat boundary conditions. The method concurrently consider both temperature and enthalpy for consideration of the latent heat effect, differently from other methods of using a special energy balance equation for solving a mushy zone. The developed brick element has eight nodes with one degree of freedom at each node. The numerical method and procedure are verified using the results of one and two dimensional analytic solutions and by other researchers. It is shown that the present method presents a consistent and stable results in either abrupt or ranged phase change problems. Moreover, the numerical results by the present method are hardly effected by the calculation time steps which otherwise are difficult to determine in most phase change problems. Finally, as a three-dimensional application, a T-shaped body of a phase change is presented and the temperature and enthalpy variation along the time are solved.

• Journal of the Korean Chemical Society
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• v.48 no.2
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• pp.123-128
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• 2004

Quantum chemical quantities, enthalpy of formation(${\Delta}H_f$), HOMO and LUMO energy, and dipole moment(${\mu}_D$) were acquired by AM1, PM3, and ZINDO/1 methods for polyamines and imidazole derivatives. The investigation of the inhibitory activity on some Ni(II) complexes with polyamines and imidazole derivatives is performed by ZINDO/1 calculations. It was found that experimental inhibitory activity(IA) appeared when the value of net charge and enthalpy of formation were over 0.03 and -300 eV, respectively for Ni(II) complexes. These results showed that the Ni(II) complexes have exception on the following very unstable compounds: square pyramidal [Ni(dpt)(tn)])]$^{2+}$(dpt=3,3'-diaminodipropylamine)(tn=1,3-diaminopropane) and distorted tetrahedral [Ni(N-PropIm))$_2$(NCS))$_2$](N-PropIm=N-Propylimidazole).

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1997.04a
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• pp.597-601
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• 1997

The technology of Semi-Solid Forging(SSF) has been actively developed to fabricate near-net shape products using light and hardly formable materials. Generally, the SSF process is composed of slug heating,forming,compression holding and ejecting step. After forming step in SSF, the slug is comperssed during a certain holding time in order to be completely filled in the die cavity and be accelerated in solidification rate. This paper presents the analysis of temperature,solid fraction and shrinkage at compression holding step for a cylindrical slug,then predicts the solidification time to obtain the final shaped part. Enthalpy-based finite element analysis is performed to solve the heat transfer problem considering phase change in solidification.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.29 no.11 s.242
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• pp.1173-1181
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• 2005

The cooling effect of a mobile phone using PCM(Phase Change Material) module has been numerically investigated. A transient three-dimensional numerical analysis of heat and fluid flow with natural convection is performed in this study. Governing conservation equations for mass, momentum and energy are solved by an implicit finite volume method. An enthalpy-porosity technique has been used for modeling of the melting process. Two different ways of placing the PCM module are considered. One is to place a PCM module between the substrate and battery pack, and the other is to place a PCM module between MCM(multichip module) and battery pack. Three different types of PCMs are used to predict the performance of PCM. The results show that passive cooling with PCM can reduce the temperature rise and the effect of natural convection in PCM module considered in this study is negligible.

• Journal of the Korean Society for Precision Engineering
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• v.14 no.10
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• pp.102-108
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• 1997

The technology of Semi-Solid Forging (SSF) has been actively developed to fabricate near-net- shape products using light and hardly formable materials. Generally, the SSF process is composed of slug heating, forming, compression holding and ejecting step. After forming step in SSF, the slug is compressed during a certain holding time in order to be completely filled in the die cavity and be accelerated in solidification rate. This paper presents the analysis of temperature, solid fraction and shrinkage at compression holding step for a cylindrical slug, then predicts the solidification time to obtain the final shaped part. Enthalpy-based finite element analysis is performed to solve the heat transfer problem considering phase change in solidification.

• Journal of the Korean Chemical Society
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• v.43 no.3
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• pp.251-256
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• 1999

Viscosities of toluene were experimentally determined by the falling-ball method at several temperatures and pressures to investigate the pressure and temperature dependence of the viscosity of toluene. With the shear stress of the viscous flow of toluene, the shear free energy, the shear entropy, and the shear enthalpy were defined to discuss the variations of the shear thermodynamic properties with pressure. The effect of temperature and pressure on the shear thermodynamic properties obtained experimentally can be explained by means of the molecular thermal agitation due to temperature incleasing and the steric effect of the closed molecules of to Iuene due to pressure elevation.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.11 no.6
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• pp.891-897
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• 1999

The heat transfer characteristics at the interface between the mold and the casting is one of the major factors for the solidification speed which determines the casting structures. The thermal resistance exists due to air gap formation at the mold/casting interface during the freezing process. In this study one dimensional Stefan problem with the air-gap resistance in the cylindrical mold is considered and the heat transfer characteristics is numerically examined by using the enthalpy method which is convenient in solving the Stefan problem with mushy zone. The present results agreed very well with those of previous papers. The effects of major parameters such as thermal conductivity, heat transfer coefficient of mold, on the thermal characteristics are investigated.