• Proceedings of the Korean Society of Precision Engineering Conference
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• 2007.06a
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• pp.121-122
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• 2007

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2013.05a
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• pp.107-108
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• 2013

플라스틱 기판 표면을 플라즈마 처리시 형성되는 수산화기에 실란화합물을 반응시키면 상온에서도 플라스틱 표면에 다양한 유기기를 도입할 수 있다. 아민기와 에폭시기가 상온에서도 강력한 화학결합을 이루는 원리를 이용하여, 유기기로써 아미노기와 에폭시기를 갖는 두 실란화합물을 선정, 두 고분자 기판에 각각 도입 후 접합시킨 결과, 저온 및 대기압 조건에서도 강력한 본딩을 이루는 것을 확인할 수 있었다.

• Journal of the Microelectronics and Packaging Society
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• v.13 no.3 s.40
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• pp.39-45
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• 2006

This study was investigated the thermal properties of underfill with various epoxy resins using thermal analysis methods such as differential scanning calorimetry (DSC), thermo gravimetry analysis (TGA), dynamic mechanical analysis (DMA) and thermo-mechanical analysis (TMA). And, the adhesion strength of the underfills/FR-4 substrate was evaluated. The glass transition temperature (Tg) of underfill which was composed the cycolaliphatic epoxy resin was lower than that of underfill which was not composed the cycolaliphatic epoxy resin. The thermal degradation of underfill was composed of two processes, which involved chemical reactions between the degrading polymer and oxygen from the air atmosphere. The coefficient of thermal expansion (CTE) of underfill which was composed the cycolaliphatic epoxy resin was higher than that of underfill which was not composed the cycolaliphatic epoxy resin. The excessive curing temperatures caused a weak boundary layer of epoxy resin, which resulted in a deterioration of mechanical properties in the epoxy resin and thus led to poor adhesion property between the underfill/FR-4 substrate.

• Composites Research
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• v.21 no.4
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• pp.15-21
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• 2008

Interfacial shear strength between epoxy and carbon fiber was analyzed utilizing a hemi-spherical microbond specimens adhered onto single carbon fiber. The hemi-spherical microbond specimen showed high regression coefficient and small standard deviation in the measurement of interfacial strength as compared with a droplet and an inverse hemi-spherical one. This seemed to be caused by the reduced meniscus effects and the reduced stress concentration In the region contacting with a pin-hole loading device. Finite element analysis showed that the stress distributions along the fiber/matrix interface in the hemi-spherical specimen had a stable shear stress distribution along the interface without any stress mode change. The experimental data was also different according to the kinds of loading device such as the microvise-tip and the pin-holed plate.

• KSCE Journal of Civil and Environmental Engineering Research
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• v.31 no.5A
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• pp.379-387
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• 2011

According to the development of ultra-high performance concrete (UHPC), its mechanical performance have been known as superior than normal and/or high performance concrete. However, its construction and structural safety must have studied with revisions and supplements. In this study, tests have been performed on UHPC precast segment joint with different levels of joint types and lateral forces under direct shear. From the results of the experimental tests, it can be concluded that the properties of the referred joints are significant for the resistance of shear behavior, and the increase of lateral force in these joints may suggest as critical lateral stress on that behavior.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.12 no.3
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• pp.1479-1487
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• 2011

In the field of the entire electronic component industry including mobile IT products, the importance of a versatile package with the multifunctional or high capacity memories is gradually increased. Multi Chip Package which has several chips in a single package is frequently used for that purpose. In MCP, epoxy adhesive films play a major role in adhesion between the chips or between chip and substrate. A series of silane coupling agents with a functional group such as epoxy, amine, mercaptan, and isocyanate were applied to the epoxy adhesives and material properties such as wettability and reliability of the adhesives were investigated. From the results, the silane coupling agent with an epoxy functional group showed highest wettability and peel strength in epoxy adhesive. For those reasons, it lead to a superior reliability in the epoxy adhesive against interfacial fracture behaviors through moisture resistance test.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.2
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• pp.89-94
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• 2021

The mechanical reliability of flexible devices has become a major concern on their commercialization, where the importance of reliable bonding is highlighted. In terms of component materials' properties, it is important to consider thermal damage of polymer substrates that occupy large area of the flexible device. Therefore, room temperature bonding process is highly advantageous for implementing flexible device assemblies with mechanical reliability. Conventional epoxy resins for the bonding still require curing at high temperatures. Even after the curing procedure, the bonding joint loses flexibility and exhibits poor fatigue durability. To solve this problems, low-temperature and adhesive-free bonding are required. In this work, we develop a room temperature bonding process for polymer substrates using carbon nanotube heated by microwave irradiations. After depositing multiple-wall carbon nanotubes (MWNTs) on PET polymer substrates, they are heated locally with by microwave while the entire bonding specimen maintains room temperature and the heating induces mechanical entanglement of CNT-PET. The room temperature bonding was conducted for a PET/CNT/PET specimen at 600 watt of microwave power for 10 seconds. Thickness of the CNT bonding joint was very thin that it obtains flexibility as well. In order to evaluate the mechanical reliability of the joint specimen, we performed lap shear test, three-point bending test, and dynamic bending test, and confirmed excellent joint strength, flexibility, and bending durability from each test.

• Journal of the Korean Society of Propulsion Engineers
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• v.8 no.2
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• pp.46-53
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• 2004

Ultrasonic testing method has been developed to evaluate flaw of adhesive layers in blast tube for the reliability of the rocket nozzle. The ultrasonic reflection from the interface between the steel sheet and the epoxy adhesive is measured with a high-frequency Pulse-echo setup in order to identify contact debonding and missing adhesive in epoxy layer between steel and FRP layers. The steel sheet is resonated by low-frequency ultrasound, and the gap size underneath the measuring location is estimated from the resonance responses. For practical application in industry an automated testing system has been developed where the proposed approach is implemented. The performance of the proposed approach has been verified by actual measurement of gap sizes from the cross-sections of cut specimens using an optical microscope.

• Proceedings of the Korean Society of Propulsion Engineers Conference
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• 2003.10a
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• pp.230-237
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• 2003

Ultrasonic testing method has been developed to evaluate adhesive layers in blast tube for the reliability of the rocket. The main objective of the present work was to find debonding and missing adhesive in epoxy layer between steel and FRP layers. In this approach, the ultrasonic reflection from the interface between the steel sheet and the epoxy adhesive is measured with a high-frequency pulse-echo setup in order to identify contact debonding and missing adhesive. Then, the steel sheet is excited to resonance by low-frequency ultrasound, and the gap size underneath the measuring location is estimated from the resonance responses. For practical application in industry an automated testing system has been developed where the proposed approach is implemented. The performance of the proposed approach has been verified by actual measurement of gap sizes from the cross-sections of cut specimens using an optical microscope.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2012.10a
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• pp.471-472
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• 2012