• Proceedings of the Materials Research Society of Korea Conference
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• 2011.05a
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• pp.56.2-56.2
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• 2011

최근 철강, 알루미늄, 이종재료의 접합 등 용접이 어려운 부분에 구조용 접착제의 적용이 증가하고 있는 추세이다. 이를 위해 변성 에폭시레진을 활용한 고접합 강도, 고인성의 구조용 접착제가 연구되어 지고 있다. 피착제의 표면처리는 접합부의 접합강도를 향상시키는 방법으로 알려져 있으나 최근의 구조용 접착제는 표면 전처리 없이도 우수한 접착 특성을 보이는 것으로 기대되고 있다. 본 연구에서는 변성레진에 대해서 각종 표면처리가 접합부 특성에 미치는 영향을 조사하였다. 피착제로는 자동차용 냉연강판인 SPRC440을 사용하였고, 전처리로는 무처리 상태, SiC연마지를 이용한 연마, 아르곤 및 산소가스를 이용한 마이크로웨이브 플라즈마 표면처리, 산세 등의 표면처리를 실시하였다. 에폭시 접착제는 변성 에폭시 레진과 경화제 및 촉매제를 이용하여 직접 포뮬레이션하였다. 단일 겹치기 전단강도 시험과 T-Peel 시험은 각각 ASTM D 1002 규격에 따라 준비하였으며 인장 시험 후 파면은 SEM으로 관찰하였다.

• Journal of the Korea Concrete Institute
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• v.27 no.1
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• pp.29-35
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• 2015

Recent studies to develop Very Large Floating Structure(VLFS) has shown that the construction procedure of the structure needs to acquire precast concrete module connection system using prestressing. However, the loads occurring on water are complex combinations of various condition, so the safe and stable performance of the module joints and bonding materials are key to the success of the construction. Therefore, micro-silica mixed aqua-epoxy development was introduced in Part 1 using a bonding material developed in this study. The performance of the micro-silica mixed aqua-epoxy(MSAE) applied joint of concrete module specimens connected by prestressing tendon was evaluated to verify the usability and safety of the material. RC beam, spliced beam connected by prestressing tendon and MSAE, and continuous prestressed concrete beam were tested for their initial cracking and maximum loads as well as cracking procedure and pattern. The results showed that the MSAE can control the stress concentration effect of the shear key and the crack propagation, and the maximum load capacity of MSAE joint specimens are only 5% less than that of continuous RC specimen. The details of the study are discussed in detail in the paper.

• Journal of the Korea Concrete Institute
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• v.27 no.1
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• pp.21-28
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• 2015

Recent studies on concrete floating structure development focused on connection system of concrete modules. Precast concrete modules are designed to be attached by prestressing in the water, exposing the structure to the loads from water and making the construction difficult. Therefore, a development of bond material became a key issue in successful connection of floating concrete modules. In this study, micro-silica mixed aqua epoxy (MSAE) is developed for the task. Existing primer aqua epoxy, originally used as a bond material for the retrofit of concrete structures using fiber reinforced polymers, is evaluated to find the optimum micro-silica added mix proportion. Micro-silica of 0~4 volume % was mixed in standard mixture of aqua epoxy. Then, the material property tests were performed to study the effect of micro-silica in aqua epoxy by controlling the epoxy silane proportion by 0, ${\pm}5$, ${\pm}10%$. The optimum mix design of MSAE was derived based on the test results. The MSAE was used to connect concrete module specimens with the epoxy thickness variation of 5, 10, and 20mm. Then, 3-point loading test was performed to verify the bond capacity of MSAE. The results show that MSAE improves the bond capacity of concrete module.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.3
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• pp.33-37
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• 2011

In this study, the degradation mechanism of mounted chip resistors with Ag-epoxy isotropic conductive adhesives (ICAs) under the humidity exposure ($85^{\circ}C$/85%RH) was examined by electrical resistance change and microstructural study. The effect of the chloride content in Ag-epoxy ICA on joint stability was also examined. The increasing range of the electrical resistance in the typical ICA joint was greater than that in the low Cl content ICA joint. In the case of the typical ICA joint, Sn oxides such as SnO, $SnO_2$, and Sn-Cl-O were formed inhomogeneously on the surface of the Sn plating during the $85^{\circ}C$/85%RH test. In contrast, no Sn-Cl-O was found in the low Cl content ICA joint during the $85^{\circ}C$/85%RH. It is suggested that Cl in Ag-epoxy ICA accelerate the electrical degradation of Sn plated chip components joined with Ag-epoxy ICA.

• Composites Research
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• v.24 no.3
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• pp.39-45
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• 2011

Adhesive joints are widely used for structural joining applications in various fields and environmental conditions. Polyurethane (PU) and Epoxy adhesives are now being used for liquefied natural gas (LNG) carriers at cryogenic temperatures. This paper presents a comprehensive evaluation of epoxy and PU adhesive bonds between Triplex sheets at normal and cryogenic temperatures. The most significant result of this study is that for all adhesives tested, there is a significant decrease in peel strength at cryogenic temperatures. However, the reasons for the decrease in peel strength for epoxy and PU adhesives differ. Consequently, PU adhesives can be considered better suited for use in applications requiring high bonding performance at cryogenic conditions, such as in LNG carriers.

• Proceedings of the KAIS Fall Conference
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• 2000.10a
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• pp.237-240
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• 2000

본 연구에서는 비스페놀 A, 에피크로로히트린을 반응시킨 에폭시 기본주제를 중심으로 경화제, 희석제, 충진제, 촉매 등을 배합하여 토목, 건축용 반고체형 에폭시 접착제를 개발하였다. 여기서 특히 에폭시 주제와 희석제의 종류 및 배합비율에 따른 기본 물성, 접착성능 등을 측정하였다. 상온 경화 특성을 측정하기 위하여 경화시 간을 측정한 결과 희석제의 종류와 관계없이 희석제의 양이 증가할수록 경화시간이 증가하고 경화온도도 증가하는 경향을 알 수 있었으며 촉매의 양이 적을 경우가 경화시간이 빠른 것을 알 수 있었다. 또한 경화 시간은 30분 내지 40분 정도로 상온에서 사용할 수 있을 것으로 기대한다. 접착력 시험 결과는 촉매의 양이 적당한 때 가장 좋은 접착력을 나타내고 희석제 중에서 HDGE의 경우가 가장 좋은 접착력을 나타내었고 희식제의 양이 증가할수록 접착력은 증가하였다. 실리카와 철분을 섞어 반고체형 에폭시 접착제를 제조한 경우 기존의 제품보다 우수한 접착력을 나타내었다. 따라서 본 연구에서 개발한 반고체형 접착제는 제조공정 코스트 등에 대한 검토와 함께 제품화하여 토목, 건축 분야의 콘크리트 균열 접착, 볼트와 콘크리트의 접합, 목재의 접합 등에 간편하게 사용될 수 있으며, 배합물질과 비율에 따라 전기전자. 토목건축, 자동차산업 등의 산업용 접착제로서 응용될 수 있을 것으로 기대된다.

• Analytical Science and Technology
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• v.24 no.5
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• pp.336-344
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• 2011

The study attempted to find out any effect to prevent photo aging of epoxy resin used for conservation by way of adding UV stabilizer, one of plastic additives. Specimens were made by adding HALS and UVA UV stabilizer as each concentration to 3 kinds of epoxy resin, which are most frequently used for artifacts joining and restoration process, and aging effects were investigated through Color change, SEM, contact angle, FTIR analysis during UV aging experiments. Last, usage suitability was checked when UV stabilizer was added through Universal Tensile strength tester. In result, it is impossible to prevent decomposition of chemical structure in spite of adding UV stabilizer but in the case of epoxy A and R, it is believed that photo aging such as yellowing or crack can be minimized without giving a big influence to adhesive strength of epoxy resin through adding less than 0.1% of UVA. It is expected that above will solve photo aging problem of epoxy resin used for joining and restoration of artifacts and will extend its life as joining and restoration materials.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.1
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• pp.69-74
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• 2015

With difficulties during the cleaning of reflow flux residues due to the decrease of the part size and interconnection pitch in the advanced electronic devices, the need for the no-clean solder paste is increasing. In this study, an epoxy curable solder paste was made with SAC305 solder powder and the curable flux of which the main ingredient is epoxy resin and its reflow solderability, flux residue corrosivity and solder joint mechanical properties was investigated with comparison to the commercial rosin type solder paste. The fillet shape of the cured product around the reflowed solder joint revealed that the curing reaction occurred following the fluxing reaction and solder joint formation. The copper plate solderability test result also revealed that the wettability of the epoxy curable solder paste was comparable to those of the commercial rosin type solder pastes. In the highly accelerated temperature and humidity test, the cured product residue of the curable solder paste showed no corrosion of copper plate. From FT-IR analysis, it was considered to be resulted from the formation of tight bond through epoxy curing reaction. Ball shear, ball pull and die shear tests revealed that the adhesive bonding was formed with the solder surface and the increase of die shear strength of about 15~40% was achieved. It was considered that the epoxy curable solder paste could contribute to the improvement of the package reliability as well as the removal of the flux residue cleaning process.

• Journal of the Korean Society for Nondestructive Testing
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• v.36 no.3
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• pp.211-216
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• 2016

In several industrial fields, epoxy resin is widely used as an adhesive for co-curing and manufacturing various structures. Controlling the manufacturing process is required for ensuring robust bonding performance and the stability of the structures. A fiber optic sensor is suitable for the cure monitoring of epoxy resin owing to the thready shape of the sensor. In this paper, a fiber Bragg grating (FBG) sensor was applied for the cure monitoring of epoxy resin. Based on the experimental results, it was demonstrated that the FBG sensor can monitor the status of epoxy resin curing by measuring the strain caused by volume shrinkage and considering the compensation of temperature. In addition, two types of epoxy resin were used for the cure-monitoring; moreover, when compared to each other, it was found that the two types of epoxy had different cure-processes in terms of the change of strain during the curing. Therefore, the study proved that the FBG sensor is very profitable for the cure-monitoring of epoxy resin.

• Composites Research
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• v.30 no.3
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• pp.215-222
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• 2017

The effect of a multi walled carbon nanotubes (MWNCT) on the adhesive properties and thermal properties of epoxy were studied by double lap-shear tests. Epoxy/MWCNT resins were prepared from a different amount of the MWCNT incorporated into the epoxy resins (araldite 2011). Steel plates and carbon fiber reinforced plastics (CFRP) were chosen as materials. Mechanical tests were performed by a universal testing machine (UTM). The analysis of thermal properties were conducted by a thermogravimetric analyzer (TGA) and a differential scanning calorimetry (DSC). The fracture surface morphology was examined using a scanning electron microscopy (SEM) and optical microscope. Compared to neat epoxy, it was found that the mechanical properties of epoxy/MWCNT resins are increased.