• Journal of the Korean Applied Science and Technology
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• v.35 no.3
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• pp.676-682
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• 2018

In order to study electrical properties of epoxy composites with various frequency. To measure of dielectric characteristics have been performed over a frequency range from 30[Hz] to 3[MHz] and a temperature range of $20[^{\circ}C]$, $100[^{\circ}C]$, $140[^{\circ}C]$. We observed values of dielectric constant and dissipation of the epoxy composites with various frequency. We were observed dielectric loss and dispersion in low frequency region. Also, we observed to decrease of the dielectric constant due to the effects of filler in high temperature region.

• Korean Chemical Engineering Research
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• v.55 no.3
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• pp.426-429
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• 2017

In this study, we investigated the effect of BN (boron nitride) on the thermal and the electrical conductivity of composites. In case of epoxy/BN composites, the thermal conductivity was increased as the BN contents were increased. Epoxy/AgNP (Ag nanoparticle) nanocomposites exhibited a slight change of thermal conductivity and showed a electrical percolation threshold at 20 vol% of Ag nanoparticles. At the fixed Ag nanoparticle content below the electrical percolation threshold, increasing the amount of BN enhanced the electrical conductivity as well as thermal conductivity for the epoxy/AgNP/BN composites.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.11 no.3
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• pp.167-173
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• 1998

In order to estimate the life time of epoxy composites used for modeling material of transformer, the AC breakdown experiments of it were experimented and then the AC breakdown data were also simulated by Weibull distribution equation in this study. The life time of H100F65 specimen was the shortest and it of SH100F65 specimen was the longest, and as the AC voltage was applied to specimen for 50[min], the breakdown probability of each specimen was 31.2[%], 17.00[%], 84.36[%] and 12.35[%], respectively.

• Polymer(Korea)
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• v.25 no.5
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• pp.691-698
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• 2001

Nanocomposites based on epoxy acid nanoclay were prepared employing organically modified mica type silicate (OMTS), diglycidyl ether of bisphenol A (DGEBA) type epoxy. curing agent (dicyandiamide; DICY), and catalyst (benzyl dimethyl amine; BDMA). Both melt mixing and solution mixing were und for the sample preparation and structural developments with curing reaction were analyzed using X-ray diffractometer (XRD) and small angle X-ray scattering (SAXS). Because of the different curing rate between extra-gallery and intra-gallery reactions of epoxy mixtures, only intercalated structure was observed for the sample prepared by melt mixing while fully exfoliated structure was observed for the sample prepared by solution mixing. Mechanical properties of exfoliated epoxy nanocomposite were investigated using a dynamic mechanical analyzer (DMA). The dynamic storage modulus of the nanocomposite in both glass and rubbery plateau regions were increased with increasing OMTS contents, but glass transition temperatures ($T_g$) remained unchanged. Thermal properties of epoxy nanocomposite were investigated using thermogravimetric (TGA) and limit oxygen index (LOI) methods. Thermal decomposition onset points and LOI values were increased with increasing OMTS contents due to barrier effects of OMTS sheets.

• Journal of the Microelectronics and Packaging Society
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• v.11 no.1
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• pp.87-96
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• 2004

Polymer/ceramic composites are the most promising embedded capacitor material for organic substrates application. Predicting the effective dielectric constant of polymer/ceramic composites is very important for design of composite materials. In this paper, we measured the dielectric constant of epoxy/$BaTiO_3$ composite embedded capacitor films with various $BaTiO_3$ particles loading for 5 different sizes $BaTiO_3$ powders. Experimental data were fitted to several theoretical equations to find the equation useful for the prediction of the effective dielectric constant of polymer/ceramic composites and also to estimate the dielectric constant of $BaTiO_3$ powders. The Lichtenecker equation and the Jayasundere-Smith equation were useful for the prediction of the effective dielectric constant of epoxy/$BaTiO_3$ composites. And calculated dielectric constants of the $BaTiO_3$ powders were in the range of 100 to 600, which were lower than those of $BaTiO_3$ bulk ceramics.

• Journal of the Korea institute for structural maintenance and inspection
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• v.12 no.3
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• pp.191-198
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• 2008

Pot life of two-component adhesives such as epoxy resin used in saturating FRP composite is defined as a certain time periods which can guarantee the bond performance and workability of epoxy resin. Therefore, adhesion procedure in strengthening RC members should be completed before chemical hardening is going on at job site. It has been known that there are two types of test method to evaluate the pot life of structural adhesive based on apparent viscosity or temperature change. This study is to verify the test methods how to assess pot life of structural adhesive for FRP composites by means of changing in apparent viscosity and means of exothermic reaction temperature proposed in existing test standards. Results of each test method were compared and analyzed, and reasonable test and evaluation method were suggested.

• Journal of the Korean Applied Science and Technology
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• v.34 no.1
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• pp.25-32
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• 2017

Such electrical properties (dielectric permittivity and dielectric loss of epoxy resin with the variations of frequency (30 ~ 300k Hz) and temperature ($20{\sim}160^{\circ}C$) have been measured. Dielectric dissipation of three specimen did not occurred below the glass transition temperature (Tg) regardless of frequency, but occurred above its temperature.

• Elastomers and Composites
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• v.45 no.1
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• pp.12-16
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• 2010

In this work, the effect of hydrophobic treated silica on the water absorption, thermal stabilities, and mechanical properties of the epoxy nanocomposites were investigated as a function of the silica content. As filler, fumed silica treated by dimethyldichlorosilane was used. It was found that the silica was well dispersed in the epoxy resins by the melt-mixing method with the addition of a silane coupling agent. The water absorption of the nanocomposites decreased with an increase of the silica content due to the effect of hydrophobic treated silica. The thermal properties, such as thermal degradation temperature, glass transition temperature ($T_g$), and coefficient of thermal expansion (CTE), of the nanocomposites were improved by the addition of silica. Furthermore, the mechanical properties of the nanocomposites, that is, the tensile strength and modulus, were enhanced with increasing silica content. This was attributed to the physically strong interaction between silica and epoxy resins.

• Polymer(Korea)
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• v.38 no.6
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• pp.782-786
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• 2014

Various kinds of thermal conductive ceramic/polymer composites (aluminum nitride, aluminum oxide, boron nitride, and silicon carbide/epoxy) were prepared by a casting method and their optical images were observed by FE-SEM. Among these, SiC/epoxy composite shows inhomogeneous dispersion features of SiC and air voids in the epoxy matrix layer, resulting in undesirable thermal conductive properties. To enhance the thermal conductivities of SiC/epoxy composites, the epoxy wetting method which can directly infiltrate the epoxy droplet onto filtrated SiC cake was employed to fabricate the homogeneously dispersed SiC/epoxy composite for ideal thermal conductive behavior, with maximum thermal conductivity of 3.85W/mK at 70 wt% of SiC filler contents.

• Applied Chemistry for Engineering
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• v.18 no.1
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• pp.48-53
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• 2007

Pulverization characteristics of H-kenyaite in vibration mill and exfoliation property in epoxy of pulverized H-kenyaite was investigated by using XRD, SEM, TEM. and particle size analyzer. Pulverization was conducted for 0.5~5 h. The particle morphology of sample pulverized for 1 h preserved plate-shape. However, this plate-shape disappeared in the sample pulverized for 3 h. The XRD pattern of sample pulverized for 1 h showed the characteristic peak of H-kenyaite. However, the peak disappeared in samples pulverized above 3 h, indicating severe destruction of H-kenyaite structure. TEM analysis for the kenyaite/epoxy nanocomposites exhibited only gallery expansion of 3~5 nm in non-pulverized sample, but dramatical large expansion of 5~10 nm in the samples pulverized during 1 h. This results confirm that the pulverization of wide plates composed of H-kenyaite particle have largely affect on the formation of an exfoliated kenyaite-polymer nanocomposite.