• Proceedings of the KIEE Conference
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• 1988.11a
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• pp.246-248
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• 1988

The electrical insulation characteristics of the Epoxy resin is generally depended upon the cross-Link. Therefore, when the Epoxy is cured the full cross-Link must be gotten to obtain the best electrical insulation property. This paper alms at examining the cure condition to get the best cross-link. The Epoxy used in this experiment is DGEBA, the curing materiel is MNA, and the accellator is tertiary amine. In this study, the best curing condition of cross-link is suggested by analysing the each Epoxy resin which is differenty cured according Lo the variable temperatures and curing times.

• Journal of the Korean Applied Science and Technology
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• v.24 no.4
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• pp.393-398
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• 2007

We investigated heat stability of epoxy resin products and epoxy resin according to the influence hardener. The heat flow which shows the degree of thermal decomposition of the epoxy resin product and epoxy resin measured by using the differential scanning calorimeter (DSC). As a result, we found that in the case of heat stability for epoxy resin as hardener was added, the ratio of one to one (epoxy resin : hardener) was the most suitable in air condition and nitrogen atmosphere.

• Elastomers and Composites
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• v.33 no.1
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• pp.10-16
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• 1998

In DGEBA/DDM system, the curing specimen are many curing factors which can affect on thermal and mechanical properties. This study was performed to prove the effect on curing specimen prepared by changing of the curing factors which are curing time and temperature of DGEBA/DDM system. As a result on thermal and mechanical properties, flexural strength, modulus and glass transition temperature (Tg) were increased with curing time and temperature were increased. It was found that the optimum curing condition of DGEBA/DDM system cure at $150^{\circ}C$ for 3hrs at equivalent ratio of 1/1.

• Magazine of the Korean Society of Agricultural Engineers
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• v.42 no.2
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• pp.99-107
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• 2000

The objective of this study are to compare the development of compressive strength of epoxy mortars used as repairing materials with respect to maturity , and to propose a model predicting strength development of epoxy mortars. A series of tests are carried out for the hardener contents of 30, 40 and 50 percentage of epoxy resin and compressive strengths are measured at the age of 6, 12, 24, 72, 120 and 168 hours respectively under the cure temperature of 0, 10, 20 and 3$0^{\circ}C$. The datum temperature is estimated by measured strengths, and the maturity is calculated with the estimated datum temperature. The compressive strength of epoxy mortars can be predicted by regression analysis from the maturity-compressive strength relationship.

• Polymer(Korea)
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• v.27 no.3
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• pp.183-188
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• 2003

The dielectric constants of fluorine-containing epoxy resins, 2-diglycidylether of benzotrifluoride(FER)/4,4'-diamino-diphenyl methane (DDM) and diglycidylether of bisphenol-A (DGEBA)/DDM systems were evaluated by dielectric spectrometer. Glass transition temperature and thermal stability factors, including initial decomposed temperature, temperatures of maximum rate of degradation, and decomposition activation energy of the cured specimens were investigated by dynamic mechanical analysis and thermogravimetric analysis. For the mechanical properties of the casting specimens, the fracture toughness, flexural, and impact tests were performed, and their fractured surfaces were examined by scanning electron microscope. The dielectric constant of FER/DDM system was lower than that of commercial DGEBA/DDM system, and the mechanical properties of the cured specimens showed higher values than those of DGEBA/DDM system. This was probably due to the introduction of trifluoromethyl (CF$_3$) group into the side chain of the epoxy resins, resulting in improving the electric and mechanical properties of the epoxy cure system studied.

• Composites Research
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• v.15 no.6
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• pp.8-15
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• 2002

In this work, the effect of biodegradable poly(butylene succinate)(PBS) in difunctional epoxy(21:P) resin was investigated in terms of rheological properties, cure kinetics, thermal stabilities, and mechanical interfacial properties. Rheological properties of the blend system were measured under isothermal condition using a rheometer. Cross-linking activation energies($\textrm{E}_c$) were determined from the Arrhenius equation based on gel time and curing temperature. The $\textrm{E}_c$ was increased in the presence of 10 wt% PBS as compared with neat 2EP. From the DSC results of the blends, the cure activation energies($\textrm{E}_a$) showed a similar behavior with $\textrm{E}_c$ due to the increased intermolecular interaction between 2EP and PBS. The decomposed activation energies($\textrm{E}_t$) for the thermal stability derived from the integral method of Horowitz-Metzger equation, were also increased in 10 wt% PBS. In addition, 20 wt% PBS showed the highest critical stress intensity factor($\textrm{E}_{IC}$). which was explained by increasing the fracture toughness of the 2EP/PBS blend systems.

• Polymer(Korea)
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• v.26 no.1
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• pp.88-97
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• 2002

The effect of aminosiloxane modifier on the chemorheological properties of ortho-cresol novolac epoxy/phenol novelac/triphnylphosphine resin system was investigated aat different isothermal curing temperatures. By adding the aminosiloxane to the resin system, not only conversion rate and conversion were increased but also glass transition temperature was promoted. Critical conversion and gelation time obtained at the crossover point between storage and loss moduli were reduced and thus the viscosity was increased by the aminosiloxane. $C_1$ and $C_2$ in the WLF equation calculated from the glass transition temperature as a function of conversion and measured viscosity were found to vary with the curing temperature. By applying the change of glass transition temperature with conversion, $C_1$ and $C_2$ to WLF equation, it was possible to predict accurately the viscosity change with isothermal curing reaction.

• Polymer(Korea)
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• v.26 no.6
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• pp.767-777
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• 2002

In this work, biodegradable modified aliphatic polyester (MAP) in tetrafunctional epoxy (4EP) resin was investigated in terms of cure kinetics, thermal stabilities, rheological properties, and mechanical interfacial properties. DSC results of the blends show that the cure activation energies (E$\_$a/) were increased in 10 wt% of MAP compared with neat 4EP, due to the increasing intermolecular interaction between 4EP and MAP. The decomposed activation energies (E$\_$t/) derived from Coats-Redfern method, were increased within the 10∼30 wt% composition range of MAP contents, resulting from increasing the cross-linking density of the blend system. Rheological properties of the blend system were investigated under isothermal condition using a rheometer. Cross-linking activation energies (E$\_$c/) were determined from the Arrhenius equation based on gel time and curing temperature. As a result, the E$\_$c/ showed a similar behavior with E$\_$a/. The fracture toughness (K$\_$IC/) of the mechanical interfacial properties was discussed in semi-IPN behaviors of the casting specimen.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2005.04a
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• pp.37-41
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• 2005

The curing of thermoset resin is accompanied with the changes in chemical and physical properties. The cure monitoring techniques can be designed by tracing these property changes. This paper presents the cure monitoring technique with fiber optic sensors to detect the change of refractive index during the polymerization process of engineering epoxy resin. The fiber optic sensor system was developed to measure the reflection coefficient at the interface between the fiber optic and the resin. The correlation between the sensor output and the degree of cure was performed following Lorentz-Lorenz law. The isothermal data from the sensors are compared with the data from differential scanning calorimeter.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2004.10a
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• pp.508-511
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• 2004

This study focused on the effect of autonomic microcapsules on the mechanical properties of structural material. Several types of microcapsules with healing agents were manufactured by varying agitation speed of high speed stirrer. The size distribution of microcapsules was measured by a particle size analzer. The epoxy specimens embedded with microcapsules were manufactured and the degree of cure of such epoxy specimen was measured by a differential scanning calorimetry. The tensile modulus and tensile strength in epoxy specimens embedded with microcapsules were evaluated in order to investigate the effects of microcapsules on mechanical properties of structural materials. The configuration of microcapsules and morphology of fracture surfaces for the epoxy specimen were examined by an optical microcope and a scanning electron microscope. According to the results, tensile strength of the epoxy specimen embedded with microcapsules was indicated a little reduction, but tensile modulus was not much affected on microcapsules.