• Korean Journal of Materials Research
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• v.7 no.3
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• pp.244-250
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• 1997

본 연구에서는 에폭시/산무수물계에 경화촉진제를 첨가한 시료를 몰드(mold)내에서 등온 경화시킬 때 시료 내부의 온도변화를 측정하여 얻어진 온도-시간 곡선(temperature-time profile)을 조사하였다. 실험에 사용한 경화촉진제의 종류는 1-cyanoethy1-2-ethy1-4-methy1 imidazole(1E4MZ-CN), N,N-dimethy1 benzy1 amine(BDMA), 2,4,6-tris(dimethy1-aminomethy1)-phenol(DMP-30)이며 그들의 농도(c)는 1.0,1.5,2.0,2.5,phr그리고 경화온도(T$_{cure}$ )는 65,70,85,95$^{\circ}C$로 하였다. 경화가 진행되는 동안 시료내부의 온도는 초기에 경화온도로 상승한 후 본격적인 경화 반응이 일어나기 시작하여 온도가 급격히 상승하였다가 다시 감소하는 양상을 보였다. 온도-시간 곡선상에 나타나는 온도가 최고로 상승되는 시점(t$_{peak}$ )과 그 때의 온도(T$_{peak}$ )는 촉진제의 종류와 농도 그리고 경화온도에 의하여 영향을 받았다. 사용한 경화촉진제중에 DMP-30이 가장 짧은 t$^{peak}$ 값을 가져 가장 우수한 촉진 효과를 갖는 것으로 나타났으며, T$_{peak}$ 는 촉진제의 농도와 경화온도가 증가할수록 상승하였다. 그리고 경화촉진제의 농도와 경화온도의 변화에 따른 t$_{peak}$ 과 T$_{peak}$ 의 변화를 보면 촉진제 농도와 경화온도가 낮을 때 그 변화가 민감하여 2E4MZ-CN 이 가장 민감한 촉진제로 나타났으며 또한 T$_{peak}$ 에 영향을 주는 여러가지 요소들을 본 연구에서 얻어진 결과로부터 자세히 살펴보았다.

• Applied Chemistry for Engineering
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• v.8 no.6
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• pp.960-966
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• 1997

The effects of epoxy resins and content of catalyst on the cure characteristics were studied by FT-IR, DSC and dynamic viscometer for the thermal properties and rheological properties of the catalytic (N-Benzylpyrazinium hexafluoroantimonate, BPH) epoxy thermosetting system. Compared with DSC results of DEGBF containing 0.5wt% BPH, the DSC thermograms of DGEBA containing 0.5wt% BPH indicated that the reaction was faster than that of DGEBF/BPH and the conversion rate of DGEBA/BPH was high in the initial stage of the reaction. As the concentration of BPH increases, the reaction and conversion rates show similar value in both the cases. The influence of hydroxyl group of epoxy resin on gel point defined from the crossover point of storage modulus (G') and loss modulus (G") could be explained by the formation of 3-dimensional network in the initial stage owing to the curing reaction between epoxides and hydroxyl groups of epoxy resin. This was consistent with the gel point obtained from DSC, FT-IR and moduli crossover. The activation energy (Et) obtained from the crossover point (G'/G"=1) are $31-39kJ.mol^{-1}$ for various BPH compositions in case of two epoxy systems.

• Polymer(Korea)
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• v.29 no.3
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• pp.231-236
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• 2005

Amino terminated polyetherimide (AP-PEI) has been synthesized using 2,2'-bis [4-(3,4-dicarboxyphenoxy)-phenyl]propane dianhydride (BPADA) and m-phenylenediamine. Polyetherimide containing pendant carboxy group (CP-PEI) has also been synthesized by the reaction of BPADA, m-phenylenediamine and 3,5-diaminobenzoic acid. The modified PEIs were used as toughening agent for diglycidyl ether of bisphenol-A epoxy resin which was cured with nadic methyl anhydride (NMA). Thermal properties, fracture toughness ($K_{IC}$) and solvent resistance of toughened epoxy resin were measured. The $K_{IC}$ of epoxy resin containing 20 phr of AT-PEI was 2.88$MPa{\cdot}m^{0.5}$ without sacrificing thermal properties. The $K_{IC}$ of epoxy resin which contained 20 phr of CP-PEI was 2.82$MPa{\cdot}m^{0.5}$.

• Journal of Adhesion and Interface
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• v.10 no.4
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• pp.191-198
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• 2009

UV-curable aliphatic epoxy acrylates were prepared by the reaction of glycerol diglycidyl ether (GDE) with 2-carboxyethyl acrylate (2-CEA) or 2-hydroxyethyl acrylate (2-HEA). The structures of the epoxy acrylates were characterized by FT-IR, $^1H$-NMR, and $^{13}C$-NMR and the yield was obtained by prep-LC. The UV- and the thermal-curing behaviors of the product were investigated using photo-DSC and DSC, respectively. The reactivity of 2-CEA was higher than 2-HEA and the yield of the product (GEA-C) which was prepared using 2-CEA was about 83%. The maximum UV-curing time ($T_{max}$) of the GEA-C contained non-reactive components and by-product was about 10 seconds. The GEA-C showed low color difference (${\Delta}E^*$), low viscosity, and good thermal stability - its value was 2.51, 192 cps, and $299^{\circ}C$ (at 5% weight loss), respectively. The activation energies ($E_a$) of thermal-curing reaction calculated from Kissinger and Ozawa-Flynn-Wall method were 91~92 kJ/mol.

• Proceedings of the Korea Concrete Institute Conference
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• 2005.11a
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• pp.761-764
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• 2005

Epoxy resin, as no-hardening, applied for repair and finish materials is used to mix together with hardener. It is advantages that epoxy resin has reaction shrinkage less than other materials and has excellent in water proofing, thermal resistance. The other hands, because ratio of combination of epoxy resin and hardener is fixed, it is not possible to change according to field condition. This investigated suspended time by temperature and hardener ratio. As a results of study, it can select economical ratio of the epoxy resin and hardener according to site situation.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2002.10a
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• pp.273-275
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• 2002

In this studies, curing behavior and mechanical properties of tetrafunctional epoxy resin (4EP)/ fluorine-containing epoxy resin (FEP) blend systems was investigated with 4, 4'-diaminodiphenol methane (DDM) as a curing agent. The cure activation energies $(E_a)$) were studied by Flynn-Wall-Ozawa's equation with dynamic DSC method. For the fracture toughness of the casting specimens, the critical stress intensity factor ($K_{IC}$) and the specific fracture energy ($G_{IC}$) were determined by fracture toughness test.

• Composites Research
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• v.29 no.4
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• pp.125-131
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• 2016

In case of CNT mixing with epoxy, epoxy matrix needs to be diluted. This work studied the effect of the dilution condition of epoxy on CNT dispersion. The optimum solvent condition using acetone and DMF was found via mechanical and solubility methods which affects, the epoxy performance. The dispersion using acetone was better than the DMF and thus higher mechanical properties. Four mixing types of CNT particle were performed. To verify the effects of each step between dilution and dispersion, the dispersion between epoxy and CNT was evaluated via the electrical resistance and optical methods. The optimum dispersion was obtained via mechanical test and thermal analysis by DSC. Among four types, the best was to disperse CNT after epoxy and hardeners were diluted respectively.

• Journal of Adhesion and Interface
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• v.23 no.2
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• pp.44-52
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• 2022

Epoxy resin has the disadvantage of being easily destroyed by instantaneous impact due to its high crosslinking density despite its high glass transition temperature (T_g) and excellent properties. To compensate for this, in this study, polyol was synthesized by ring opening polymerization of propylene glycol (PPG) diamine, Jeffamine D 2000 and propylene carbonate, and urethane modified epoxy was synthesized using this. The properties of the synthesized urethane modified epoxy were confirmed by FT-IR, H-NMR. To confirm the degree of improvement in impact resistance as an adhesive, a urethane modified epoxy adhesive was prepared by mixing a digylcidyl ether bisphenol A (DGEBA) with curing agent and curing accelerator. Properties test of urethane modified epoxy were shear strength, tensile strength and impact strength. As a result, excellent results were obtained in all test when the ratio of DGEBA : urethane modified epoxy was 8:2.

• Composites Research
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• v.32 no.2
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• pp.96-101
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• 2019

Interfacial adhesion between fiber and resin are related to composites performance, so it is very important to evaluate them accurately. In this study, the interfacial properties of microdroplets under fatigue loading conditions were evaluated. The mechanical properties and interfacial adhesion of epoxy resin with dopamine were studied. Tensile specimens were prepared to evaluate mechanical properties and epoxy microdroplets specimens were used for the evaluation of interfacial adhesion. In addition, in the microdroplet fatigue test, the same diameter of the microdroplet was used and the experiment was performed under the same conditions. As a result, it was confirmed that mechanical and interfacial properties were improved when dopamine was applied to epoxy resin through tensile and microdroplet experiments. It is considered that dopamine improves the degree of curing of the epoxy resin and imparts hydroxyl groups to the epoxy resin to increase the mechanical properties and the interfacial adhesion between the glass fibers.

• The Proceedings of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.2 no.1
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• pp.75-82
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• 1988

Epoxy, noticed as a new insulation material tor electrical installation, may become an excellent cured material from the crosslink reaction with some curing agents. The characteristics of cured Epoxy is determined by the kind of the curing agents and the method of lattice formation. The purpose of this paper, varing the process of lattice formation by various surrounding temperatures during the curing process, is to obtain the optimum curing temperature for electrical insulation from the results of investigation on the properties of cured Epoxy. In the experiment, Epoxy was cured at various temperatures between $20[^{\circ}C] and 50^[{\circ}C]$ which differ by $5^[{\circ}C]$, and then examined on the electrical insulation haracteristics as well as the thermal and mechanical stability. As a result, it is concluded that the optimum electrical insulation characteristis and mechanical strength of cured Epoxy can be obtained when cured at a surrounding temperature at $30[^{\circ}C]$.