• Journal of the Microelectronics and Packaging Society
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• v.18 no.3
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• pp.33-37
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• 2011

In this study, the degradation mechanism of mounted chip resistors with Ag-epoxy isotropic conductive adhesives (ICAs) under the humidity exposure ($85^{\circ}C$/85%RH) was examined by electrical resistance change and microstructural study. The effect of the chloride content in Ag-epoxy ICA on joint stability was also examined. The increasing range of the electrical resistance in the typical ICA joint was greater than that in the low Cl content ICA joint. In the case of the typical ICA joint, Sn oxides such as SnO, $SnO_2$, and Sn-Cl-O were formed inhomogeneously on the surface of the Sn plating during the $85^{\circ}C$/85%RH test. In contrast, no Sn-Cl-O was found in the low Cl content ICA joint during the $85^{\circ}C$/85%RH. It is suggested that Cl in Ag-epoxy ICA accelerate the electrical degradation of Sn plated chip components joined with Ag-epoxy ICA.

• Journal of Conservation Science
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• v.35 no.6
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• pp.681-688
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• 2019

In this study, the characteristics of natural and synthetic adhesives used in woodcraft were evaluated. The pattern of deterioration of wood and adhesives according to changes in temperature and humidity were compared. For materials, one type of anlmal glue, three kinds of polyvinyl acetate adhesives, one type of epoxy adhesive and one type of zelkova wood were selected. Characteristics of physical and chemical characteristics, weather resistance and drying speed assessment were carried out. The adhesion characteristic evaluation showed that the adhesion strength of anlmal glue and one type of polyvinyl acetate adhesive were 6.54 N/㎟ and 7.01 N/㎟, pH meter of anlmal glue and polyvinyl acetate adhesives was pH 7.03 and pH 3.32-3.59 which were range of available as an adhesive. According to the test results of weather resistance, epoxy adhesives had the highest decreasing value in adhesion strength after deterioration. In the reversible test of the adhesive, it was found to be highly reversible in NaOH, a soluble solvent excluding epoxy, but attention is required when using the wood since it may show discoloration during processing.

• Journal of Conservation Science
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• v.26 no.1
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• pp.85-94
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• 2010

Color stable hydrogenated bisphenol-A (HBA) epoxy adhesives containing organic-inorganic hybrid nanocomposites were prepared and investigated the properties. Isophorone-diamine (IPDA) was used as a hardener and polyhedral organomeric silsesquioxanes (POSS; EP0408 and EP0409) having epoxy function groups were used to tailor adhesives in the nanoscale range. The dependence of the concentration of different nano materials were studied since the large surface area of the nanosized particles can cause significant changes in properties of adhesives. HBA-IPDA adhesives containing different amount of nanomaterials have been applied to the fresh Namsan granite and compared with those of commercial adhesives, which have problems of color change as well as a high viscosity. The mechanical properties of HBA-IPDA containing POSSs are consistent with those of commercial adhesives in addition to the low viscosity.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.12 no.3
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• pp.1479-1487
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• 2011

In the field of the entire electronic component industry including mobile IT products, the importance of a versatile package with the multifunctional or high capacity memories is gradually increased. Multi Chip Package which has several chips in a single package is frequently used for that purpose. In MCP, epoxy adhesive films play a major role in adhesion between the chips or between chip and substrate. A series of silane coupling agents with a functional group such as epoxy, amine, mercaptan, and isocyanate were applied to the epoxy adhesives and material properties such as wettability and reliability of the adhesives were investigated. From the results, the silane coupling agent with an epoxy functional group showed highest wettability and peel strength in epoxy adhesive. For those reasons, it lead to a superior reliability in the epoxy adhesive against interfacial fracture behaviors through moisture resistance test.

• Journal of Adhesion and Interface
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• v.16 no.2
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• pp.69-75
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• 2015

Stone board for the rock bed was needed to reduce weight using thin thickness and reinforced materials. In this work, stone/wood board for rock bed was studied. Stone and wood were attached to reduce total weight of stone for rock bed. For reinforcing wood heat treatment method was used to change surface and mechanical properties. Mechanical strength of heat treated wood increased more than neat condition. The optimum heat treatment condition was set on $100^{\circ}C$ under tensile, flexural loads whereas surface energy was also obtained by contact angle measurement. Optimum adhesive condition was to get the maximum adhesion between stone and wood. Lap shear test was performed for stone/wood board with different adhesives such as amine type epoxy, polyurethane, chloro-rubber and vinyl chloride acetate type. Fracture surface of lap shear test was shown at wood fracture part on stone using amine type epoxy adhesive. It was found that for high adhesion between stone and wood the optimum adhesive was epoxy type for the rock bed.

• Composites Research
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• v.29 no.2
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• pp.79-84
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• 2016

An adhesive can be used to connect two different materials in structures. In comparing with other connecting methods, such as bolt, rivet, and hot melting, the adhesive does not need to use them. It leads to reduce the weight and decrease the stress concentration along the connecting line. This work studied the comparison of mechanical and interfacial properties of commonly-used two adhesives, acrylic type and bisphenol-A epoxy type. Tensile and flexural strength of neat adhesives were also compared. Lap shear test of two adhesives was deduced from the measurement of tensile and fatigue tests. After testing, the failure patterns of adhesive surfaces were observed by a microscope. Tensile strength and mechanical fatigue resistance at using bisphenol-A epoxy adhesive were better than acrylic adhesive. Also adding CNT reinforcement in epoxy adhesive can anticipate mechanical improvement.

• The Korean Journal of Rheology
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• v.8 no.2
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• pp.129-138
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• 1996

접착강도는 접착제의 점탄성을 반영한 온도·속도 의존성을 나타낸다는 것이 잘 알 려져있다. 특히 유리전이온도(Tg)에서의 역학적 완화기구가 접착층의 변형을 수반하는 접착 층의 변형을 수반하는 접착강도에 크게 영향을 미치고 있다. 또한 접착계의 모드I의 변형에 너지 해방율(GIC)를 측정할때에도 접착제의 변형과 파괴가 발생하기 접착제의 점탄성이 그 값에 어떠한 영향을 미치는 지에 흥미가 깊다. 본 연구에서는 2종류의 에폭시 수지를 블랜 드한 접착제를 이용하여 일정한 측정조건에서 인장 접착강도와 GIC의 상관관계에 대하여서 도 토론하였다.

• Composites Research
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• v.26 no.2
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• pp.129-134
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• 2013

The strength of adhesive joints employed in composite structures under cryogenic environments, such as LNG tanks, is affected by thermal residual stress generated from the large temperature difference between the bonding process and the operating temperature. Aramid fibers are noted for their low coefficient of thermal expansion (CTE) and have been used to control the CTE of thermosetting resins. However, aramid composites exhibit poor adhesion between the fibers and the resin because the aramid fibers are chemically inert and contain insufficient functional groups. In this work, electrospun meta-aramid nanofiber-reinforced epoxy adhesive was fabricated to improve the interfacial bonding between the adhesive and the fibers under cryogenic temperatures. The CTE of the nanofiber-reinforced adhesives were measured, and the effect on the adhesion strength was investigated at single-lap joints under cryogenic temperatures. The fracture toughness of the adhesive joints was measured using a Double Cantilever Beam (DCB) test.

• Proceedings of the Korean Society of Fisheries Technology Conference
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• 2003.05a
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• pp.27-29
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• 2003

해양생명체인 홍합(mussel)은 접착단백질(adhesive protein)을 생산, 분비함으로써 홍합 자신을 바다 속의 바위와 같은 젖은 고체표면에 단단히 부착할 수 있도록 하여 강한 파도의 충격이나 바닷속의 부력 효과에 대하여도 저항할 수 있다. 홍합접착단백질은 현재 알려진 어떠한 화학합성 접착제보다도 강력한 자연적인 접착제로 알려져 있으며 대부분의 에폭시 수지보다 두 배 정도의 커다란 인장강도를 지니고 있으면서도 휘어질 수 있는 유연성을 가지고 있는 혁신적인 물질이므로 접착제 산업계에서 매우 커다란 관심을 끌고 있다. (중략)

• Journal of Conservation Science
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• v.27 no.1
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• pp.115-121
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• 2011

A Urethane resin restoration material was made to be used in the restoration of stone cultural assets. The Urethane resin restoration material showed strong adhesive strength and tensile strength similar to epoxy recovery material, which had been mainly used for the recovery of stone cultural assets. The sealing property, anti-shrinking property and paint-ability of Urethane resin restoration material are also similar to existing epoxy system restoration materials. Especially, this Urethane resin restration material is expected to give permanence and continuous stability in the restoration of cultural assets made in stone by resolving the two big issues of existing epoxy recovery material, which are 'yellowing' and 'ir-reversibility'. This Urethane resin restration material had been directly applied as a filling material and adhesive and it was dissolved again. The Urethane resin, which had been used for the recovery, was able to be perfectly removed, which means that this Urethane resin recovery material has perfect reversibility. This Urethane resin restoration material also has enhanced convenience since user can adjust the working-life dependent on work environment. It is believed that this Urethane resin restoration material can also be used as a filling material or adhesive for other cultural assets made of ceramic or metal heritage, in addition to stone, since it has strong adhesive strength and tensile strength.