• Title/Summary/Keyword: 에너지밴드

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$TiO_2$ 채널 기반 산화물 트랜지스터

  • Choe, Gwang-Hyeok;Kim, Han-Gi
    • Proceedings of the Materials Research Society of Korea Conference
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    • 2011.05a
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    • pp.60.2-60.2
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    • 2011
  • 본 연구에서는 Indium-free 및 gallium-free 기반의 산화물 TFT를 제작하기 위해 n-type $TiO_2$ 반도체 기반의 thin film transistor ($Mo/TiO_{2-x}/SiO_2/p+\;+Si$)를 oxygen deficient black $TiO_{2-x}$ 타겟을 이용하여 DC magnetron sputtering 공법으로 제작하고 그 특성을 분석하였다. DC magnetron sputtering 공법으로 성막된 $TiO_{2-x}$ semiconductor의 전기적, 광학적, 화학적 결합 에너지 및 구조적 특성 분석을 위해 semiconductor parameter analyzer (Aglient 4156-C), UV/Vis spectrometer, X-ray Photoelectron Spectroscopy, Transmission Electron Microscopy를 각각 이용하여 분석하였으며 이를 RTA 전/후 특성 비교를 통하여 관찰하였다. $TiO_{2-x}$ TFT의 소자 특성은 RTA 열처리 전/후 전형적인 insulator 특성에서 semiconductor 특성으로 변화되는 것을 관찰할 수 있었으며, 최적화된 열처리 공정에서 filed effect mobility 0.69 $cm^2$/Vs, on to off current ratio $2.04{\times}10^7$, sub-threshold swing 2.45 V/decade와 Vth 10.45 V를 확보할 수 있었다. 또한 RTA 열처리 후 밴드갭이 3.25에서 3.41로 확장되는 특성을 나타내었다. 특히 RTA 열처리 후 stoichiometric $TiO_2$ 상태와는 다른 $Ti^{2+}$, $Ti^{3+}$, $Ti^{4+}$ 등의 다양한 oxidation states가 관찰되었으며 이러한 oxidation states를 $TiO_{2-x}$ 박막에서의 oxygen deficient 상태와 연관시킴으로써 oxygen vacancy의 n-type dopant로의 거동을 확인하였다. $TiO_2$ 채널 기반의 TFT 특성을 통하여서 indium free 또는 gallium free 산화물 채널로써의 가능성을 확인하였다.

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UV를 이용한 IGZO 표면 상태 변화 및 전기적 특성 변화

  • Jo, Yeong-Je;Choe, Deok-Gyun;Mun, Yeong-Ung
    • Proceedings of the Materials Research Society of Korea Conference
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    • 2011.05a
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    • pp.242.1-242.1
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    • 2011
  • 산화물 반도체는 높은 이동도와 낮은 공정 온도, 넓은 밴드갭으로 인한 투명성등 많은 장정을 가지고 있어 최근 많이 연구되고 있다. 그 중에서도 InGaZnO (IGZO)는 In, Ga 함유량으로 박막의 전기적 특성을 쉽게 조절할 수 있고 상온에서 비정질 상태로 증착되어 균일성에 장점이 있다. IGZO 박막을 TFT에 적용 시 MOSFET과는 다르게 축적 상태에서 채널이 형성되기 때문에 산화물 반도체 내에 캐리어 농도는 TFT 특성에 많은 영향을 미친다. 또한, 실리콘 기반의 트랜지스터는 이온 주입 및 확산 공정을 통해서 선택적으로 $10^{20}/cm^3$ 이상의 고농도 도핑을 실시하여 좋은 트랜지스터 특성을 확보할 수 있으나 IGZO 박막에는 이러한 접근이 불가능하다. 따라서 IGZO 박막의 캐리어 농도를 조절할 수 있으면 소스/드레인과 반도체의 접촉 저항 감소 및 전계 효과 이동도등 많은 특성을 개선할 수 있다. 본 연구에서는 UV light를 이용하여 IGZO 박막의 캐리어 농도를 조절하였다. IGZO 박막은 UV light 조사로 인해 Mo와 IGZO박막의 접촉저항이 $3{\times}10^3\;{\Omega}^*cm$에서 $1{\times}10^2\;{\Omega}^*cm$로 감소하였다. 이는 UV 조사로 표면에 금속-OH 결합이 생성되어 IGZO 박막의 캐리어 농도가 ${\sim}5{\times}10^{15}/cm^3$에서 ${\sim}3{\times}10^{17}/cm^3$까지 증가하기 때문이다. 또한 표면에 생성된 OH기는 강한 친수성 성질을 보여주고 표면의 높은 에너지 상태는 Self-Assembly Monolayer (SAM) 공정 적용이 가능 하다. 본 실험에서는 SAM 공정을 적용하여 IGZO-based TFT 제작에 성공하였고, 이 TFT는 UV 조사 시간에 따라 전계 효과 이동도가 0.03 $cm^2/Vs$에서 2.1 $cm^2/Vs$으로 100배 정도 증가하였다.

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Photocatalytic Efficiency and Bandgap Property of the CdS Deposited TiO2 Photocatalysts (TiO2/CdS 복합광촉매의 밴드갭 에너지 특성과 광촉매 효율)

  • Lee, Jong-Ho;Heo, Sujeong;Youn, Jeong-Il;Kim, Young-Jig;Suh, Su-Jeong;Oh, Han-Jun
    • Korean Journal of Materials Research
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    • v.29 no.12
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    • pp.790-797
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    • 2019
  • To improve photocatalytic performance, CdS nanoparticle deposited TiO2 nanotubular photocatalysts are synthesized. The TiO2 nanotube is fabricated by electrochemical anodization at a constant voltage of 60 V, and annealed at 500 for crystallization. The CdS nanoparticles on TiO2 nanotubes are synthesized by successive ionic layer adsorption and reaction method. The surface characteristics and photocurrent responses of TNT/CdS photocatalysts are investigated by scanning electron microscopy (SEM), X-ray diffraction (XRD), UV-Vis spectrometer and LED light source installed potentiostat. The bandgaps of the CdS deposited TiO2 photocatalysts are gradually narrowed with increasing of amounts of deposited CdS nanoparticles, which enhances visible light absorption ability of composite photocatalysts. Enhanced photoelectrochemical performance is observed in the nanocomposite TiO2 photocatalyst. However, the maximum photocurrent response and dye degradation efficiency are observed for TNT/CdS30 photocatalyst. The excellent photocatalytic performance of TNT/CdS30 catalyst can be ascribed to the synergistic effects of its better absorption ability of visible light region and efficient charge transport process.

Colossal Magnetoresistance in Chalcogenide Spinels $Ni_xFe_{1-x}Cr_2S_4(X = 0.05, 0.1, 0.2)$ (Spinel 유화물 $Ni_xFe_{1-x}Cr_2S_4(X = 0.05, 0.1, 0.2)$의 초거대자기저항(CMR)현상에 관한 연구)

  • 박재윤
    • Journal of the Korean Magnetics Society
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    • v.11 no.4
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    • pp.151-156
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    • 2001
  • Recently many studies on manganese oxides Ln$_{1-x}$A$_{x}$MnO$_3$(Ln=La, Pr, Nd lanthannide; A=Ca, Sr, Ba, Pb +2 ions) reported CMR properties. CMR have been also found in chalcogenide spinels. We have investigated that Ni ion substitutions for Fe ion have effects on CMR properties in chacogenide spinels Ni$_{x}$Fe$_{1-x}$Cr$_2$S$_4$. It was found that with increasing Ni concentration Jahn-Teller distortion was strengthened and Curie temperature T$_{c}$ was increased. CMR properties could be explained with Jahnl-Teller effect, half-metallic electronic structure, and the alignment of magnetic domain due to the strong magnetic field, which is different in that double exchange interactions dominate CMR properties in manganese oxides.

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A S/C/X-Band GaN Low Noise Amplifier MMIC (S/C/X-대역 GaN 저잡음 증폭기 MMIC)

  • Han, Jang-Hoon;Kim, Jeong-Geun
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.28 no.5
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    • pp.430-433
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    • 2017
  • This paper presents a S/C/X-band LNA MMIC with resistive feedback structure in 0.25 um GaN HEMT process. The GaN devices have advantages as a high output power device having high breakdown voltage, energy band gap and stability at high temperature. Since the receiver using the GaN device with high linearity can be implemented without a limiter, the noise figure of the receiver can be improved and the size of receiver module can be reduced. The proposed GaN LNA MMIC based on 0.25 um GaN HEMT device is achieved the gain of > 15 dB, the noise figure of < 3 dB, the input return loss of > 13 dB, and the output return loss of > 8 dB in the S/C/X-band. The current consumption of GaN LNA MMIC is 70 mA with the drain voltage 20 V and the gate voltage -3 V.

LED visible light communication and their application (LED 가시광 통신시스템과 그 응용)

  • Chung, Wan-Young;Seo, Yong-Su;Kim, Jong-Jin;Kwon, Tae-Ha
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.14 no.6
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    • pp.1375-1381
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    • 2010
  • LED(Light Emitting Diode) is an emitting device which energy is same to the bandgap energy of p-type and n-type semiconductor junction. Recently high brightness LED is used in fish-luring light and traffic signal light alternative of normal light bulb, and widely used in the area of display pannel. Moreover nowadays LED has been used as a back light of LCD display. Recently, visible light communication(VLC) using LED, that allow two-way serial data communication between LEDs over a distance of sveral centimeters or meters, has been widely studied in the area of digital information transmission along with illumination and display. In this paper, we present LED communication system and their applications.

Change in the Energy Band Gap and Transmittance IGZO, ZnO, AZO OMO Structure According to Ag Thickness (IGZO, ZnO, AZO OMO 구조의 Ag두께 변화에 따른 투과율과 에너지 밴드 갭의 변화)

  • Lee, Seung-Min;Kim, Hong-Bae;Lee, Sang-Yeol
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.28 no.3
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    • pp.185-190
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    • 2015
  • In this study, we fabricated the indium gallium zinc oxide (IGZO), zinc oxide (ZnO), aluminum zinc oxide (AZO). oxide and silver are deposited by magnetron sputtering and thermal evaporator, respectively transparency and energy bandgap were changed by the thickness of silver layer. To fabricate metal oxide metal (OMO) structure, IGZO sputtered on a corning 1,737 glass substrate was used as bottom oxide material and then silver was evaporated on the IGZO layer, finally IGZO was sputtered on the silver layer we get the final OMO structure. The radio-frequency power of the target was fixed at 30 W. The chamber pressure was set to $6.0{\times}10^{-3}$ Torr, and the gas ratio of Ar was fixed at 25 sccm. The silver thickness are varied from 3 to 15 nm. The OMO thin films was analyzed using XRD. XRD shows broad peak which clearly indicates amorphous phase. ZnO, AZO, OMO show the peak [002] direction at $34^{\circ}$. This indicate that ZnO, AZO OMO structure show the crystalline peak. Average transmittance of visible region was over 75%, while that of infrared region was under 20%. Energy band gap of OMO layer was increased with increasing thickness of Ag layer. As a result total transmittance was decreased.

The hysteresis characteristic of Feedback field-effect transistors with fluctuation of gate oxide and metal gate (게이트 절연막과 게이트 전극물질의 변화에 따른 피드백 전계효과 트랜지스터의 히스테리시스 특성 확인)

  • Lee, Kyungsoo;Woo, Sola;Cho, Jinsun;Kang, Hyungu;Kim, Sangsig
    • Journal of IKEEE
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    • v.22 no.2
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    • pp.488-490
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    • 2018
  • In this study, we propose newly designed feedback field-effect transistors that utilize the positive feedback of charge carriers in single-gated silicon channels to achieve steep switching behaviors. The band diagram, I-V characterisitcs, subthreshold swing, and on/off current ratio are analyzed using a commercial device simulator. To demonstrate the changing characteristics of hysteresis, one of the important features of the feedback field effect transistor, we simulated changing the gate insulating material and the gate metal electrode. The fluctuation in the characteristics changed the $V_{TH}$ of the hysteresis and showed a decrease in width of the hysteresis.

Excimer Laser Annealing Effects of Double Structured Poly-Si Active Layer (이중 활성층(a-Si/a-SiNx)의 XeCl 엑시머 레이저 어닐링 효과)

  • 최홍석;박철민;전재홍;유준석;한민구
    • Journal of the Korean Institute of Telematics and Electronics D
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    • v.35D no.6
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    • pp.46-53
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    • 1998
  • A new method to form the double structured active layers of a-Si/a-SiN$_{x}$ of polycrystalline thin film transistor is proposed and poly-Si TFTs employed double structure active film are fabricated. Nitrogen ions were added to bottom amorphous silicon active film(a-SiN$_{x}$ ) and pure a-Si film deposition on a-SiN$_{x}$ was followed. The XeCl excimer laser was irradiated to crystallize double structure active film. The grain growth of upper a-Si film was also promoted in the double structured active layers of a-Si/a-SiN$_{x}$ due to the mitigation of solidification process of lower a-SiN$_{x}$ layer. Our experimental results show that the ratio of NH$_3$/SiH$_4$ is required to maintain below 0.11 for the reduction of contact resistance of n$^{+}$ poly-SiN$_{x}$ layer.r.

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NDR Property and Energy Band Diagram of Nitro-Benzene Molecule Using STM (STM에 의한 니트로벤젠 분자의 NDR 특성과 에너지 밴드 구조)

  • Lee, Nam-Suk;Chang, Jeong-Soo;Kwon, Young-Soo
    • Proceedings of the KIEE Conference
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    • 2005.11a
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    • pp.139-141
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    • 2005
  • It is possble to study charge transfer property which is caused by height variation because we can see the organic materials barrier height and STM tip by organic materials energy band gap. Here, we investigated the negative differential resistance(NDR) and charge transfer property of self-assembled 4,4-Di(ethynylphenyl)-2'-nitro-1-(thioacetyl)benzene, which has been well known as a conducting molecule. Self-assembly monolayers(SAMs) were prepared on Au(111), which had been thermally deposited onto pre-treatment($H_{2}SO_{4}:H_{2}O_{2}$=3:1) Si. The Au substrate was exposed to a 1 mM/l solution of 1-dodecanethiol in ethanol for 24 hours to form a monolayer. After thorough rinsing the sample, it was exposed to a $0.1{\mu}M/1$ solution of 4,4-Di(ethynylphenyl)-2'-nitro-1-(thioacetyl)benzene in dimethylformamide(DMF) for 30 min and kept in the dark during immersion to avoid photo-oxidation. After the assembly, the samples were removed from the solutions, rinsed thoroughly with methanol, acetone, and $CH_{2}Cl_{2}$, and finally blown dry with $N_2$. Under these conditions, we measured electrical properties of self-assembly monolayers(SAMs) using ultra high vacuum scanning tunneling microscopy(UHV-STM). The applied voltages were from -1.50 V to -1.20 V with 298 K temperature. The vacuum condition is $6{\times}10^{-8}$ Torr. As a result, we found that NDR and charge transfer property by a little change of height when the voltage is applied between STM tip and electrode.

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