• Journal of the Korean Society for Precision Engineering
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• v.27 no.6
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• pp.32-38
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• 2010

Laser material processing technology is adopted in several industry as alternative process which could overcome weakness and problems of present adopted process, especially semiconductor and display industry. In semiconductor industry, laser photo lithography is doing at front-end level, and cutting, drilling, and marking technology for both wafer and EMC mold package is adopted. Laser cleaning and de-flashing are new rising technology. There are 3 kinds of main display industry which use laser technology - TFT LCD, AMOLED, Touch screen. Laser glass cutting, laser marking, laser direct patterning, laser annealing, laser repairing, laser frit sealing are major application in display industry.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2009.10a
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• pp.174-174
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• 2009

다양한 ITO타겟(doped Yb: 0, 0.57, 3.2 and 7.75at%)을 사용하여, DC 마그네트론 스퍼터링에 의해 폴리이미드 기판위에 증착한 ITO:Yb박막의 구조적, 전기적, 기계적 특성을 연구하였다. 증착된 박막내의 Yb 함량이 증가됨에 따라, 박막의 결정성이 감소되고, 표면조도와 기계적 성질이 향상됨을 확인 할 수 있었다. 비정질구조를 가지는 박막 중, Yb-doped 3.2at% ITO타겟으로 증착하고, $170^{\circ}C$에서 어닐링처리 하였을 때, 가장 낮은 비저항 $4.672{\times}10^{-4}{\Omega}cm$을 나타내었다. ITO:Yb 박막의 전기적 특성은 Hall 효과 측정장비, 박막의 결정구조는 X-선 회절 (XRD), 표면조도는 AFM 장비를 사용하여 측정하였다.

• Korean Journal of Metals and Materials
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• v.49 no.10
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• pp.790-796
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• 2011

To reduce the heat released during intermetallic reaction, Ni-50at%Al powder compact has been previously annealed at several conditions before the reaction. The effects of the pre-annealing conditions on the reaction synthesis process have been investigated. Experimental results show that the heat released during the reaction synthesis decreased proportionally with increase of the pre-annealing temperature and duration time. The reaction duration period was significantly increased when the intermetallics were formed in the powder compact during the pre-annealing. This was attributed to the fact that the reaction occurred by solid-state diffusion between the un-reacted elemental atoms and that the $NiAl_3$ phase formed predominantly during pre-annealing.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.35 no.1
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• pp.50-57
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• 2022

Reliability of CMOS has been severed under aggressive device scaling. Conventional technologies such as lightly doped drain (LDD) and forming gas annealing (FGA) have been applied for better device reliability, but further advances are modest. Alternatively, electro-thermal annealing (ETA) which utilizes Joule heat produced by electrodes in a MOSFET, has been newly introduced for gate dielectric curing. However, concerns about mechanical stability during the electro-thermal annealing, have not been discussed, yet. In this context, this paper demonstrates the mechanical stability of nanosheet FET during the electro-thermal annealing. The effect of mechanical stresses during the electro-thermal annealing was investigated with respect to device design parameters.

• New & Renewable Energy
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• v.17 no.4
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• pp.36-45
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• 2021

To remove the Cu secondary phase remaining on the surface of a CIGSSe absorber layer manufactured by the two-step process, KCN etching was applied before depositing the CdS buffer layer. In addition, it was possible to increase the conversion efficiency by air annealing after forming the CdS buffer layer. In this study, various pre-treatment/post-treatment conditions wereapplied to the S-containing CIGSSe absorber layerbefore and after formation of the CdS buffer layer to experimentally confirm whether similareffects as those of Se-terminated CIGSe were exhibited. Contrary to expectations, it was noted that CdS air annealing had negative effects.

• Korean Journal of Materials Research
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• v.3 no.1
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• pp.43-49
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• 1993

Excellent deep drawability and strain aging rsistance are obtained by the addition of alloying elements such as Ti and Nb which can form carbide and nitride easily into Al killed extra low carbon steel. Recrystallization textures and mechanical properties of the three different extra low carbon steels with B containing Nb only, Ti only, and both Nb and Ti, respectively, along with have been compared. Inverse pole figure shows that (100) and (111) texture intensities of Nb containing steel changed a lot during the annealing treatment and the degree of texture-structural change in the steel containing both Nb and Ti is about the same as that in the Ti-containing 5teel. After annealing the pole figure shows that the {Ill} < 110 > and {112} < 110> textures are the strongest in the cold rolled state and the annealed state, respectively. However, there is little difference in texture structure among the three kinds of steels. There is a tendency that the steel containing both Nb and Ti the grain size of which is the smallest is the highest in hardness. Nb-containing steel is the next and Ti -containing steel is the last in hardness.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.30 no.5
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• pp.174-182
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• 2020

The printed electronics field using ink-jet printing technology is in the spotlight as a next-generation technology, especially ink-jet 3D printing, which can simultaneously discharge and precisely control various ink materials, has been actively researched in recent years. In this study, complex structure of an insulating layer and a conductive layer was fabricated with photo-curable silica ink and PVP-added Cu nano ink using ink-jet 3D printing technology. A precise photocured silica insulating layer was designed by optimizing the printing conditions and the rheological properties of the ink, and the resistance of the insulating layer was 2.43 × 10¹³ Ω·cm. On the photo-cured silica insulating layer, a Cu conductive layer was printed by controlling droplet distance. The sintering of the PVP-added nano Cu ink was performed using an IPL flash sintering process, and electrical and mechanical properties were confirmed according to the annealing temperature and applied voltage. Finally, it was confirmed that the resistance of the PVP-added Cu conductive layer was very low as 29 μΩ·cm under 100℃ annealing temperature and 700 V of IPL applied voltage, and the adhesion to the photo-cured silica insulating layer was very good.

• Korean Journal of Materials Research
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• v.4 no.6
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• pp.715-722
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• 1994

Thermochromic $Vo_{2}$ thin films for "smart windows" were prepared by electron beam evaporationmethod on a glass substrate and spectral transmittances were examined by spectrophotometer. Substratetemperature of $300^{\circ}C$ and annealing temperature of $400^{\circ}C$ were found to be effective to give athermochromism on $Vo_{2}$ thin film due to the crystallization of the thin film. Furthermore, annealing of$Vo_{2}$ thin film affected the spectral transmittance and reduced the transmittance significantly at wavelengthbelow 500nm.$V_{0.95}W_{0.05}O_{2}$ thin film doped by 5 atomic percent of W showed semiconductor-metal transition around 0$0^{\circ}V_{0.995}W_{0.005}O_{2}$thin film which contains 0.5 atomic percent Sn showed therrnochrornisrn when it was depositedat substrate temperature of $300^{\circ}C$ and annealed at $450^{\circ}C$ for 5 hours in argon gas. The transitiontemperature of the $V_{0.995}W_{0.005}O_{2}$ thin film was found to be about $25^{\circ}C$ and showed some hysterisis. and showed some hysterisis.

• Journal of the Korean Association of Geographic Information Studies
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• v.9 no.3
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• pp.156-170
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• 2006

Determining the best visibility positions on terrain surface has been one of the frequently used analytical issues in GIS visibility analysis and the search for a solution has been carried out effectively using spatial search techniques. However, the spatial search process provides operational and methodological challenges for finding computational algorithms suitable for solving the best visibility site problem. For this problem, current GIS visibility analysis has not been successful due to limited algorithmic structure and operational performance. To meet these challenges, this paper suggests four algorithms explored robust search techniques: an extensive iterative search technique; a conventional solution based on the Tornqvist algorithm; genetic algorithm; and simulated annealing technique. The solution performance of these algorithms is compared on a set of visibility location problems and the experiment results demonstrate the useful feasibility. Finally, this paper presents the potential applicability of the new spatial search techniques for GIS visibility analysis by which the new search algorithms are of particular useful for tackling extensive visibility optimization problems as the next GIS analysis tool.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.2
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• pp.65-74
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• 2013

The through-silicon via (TSV) technology is essential for 3-dimensional integrated packaging. TSV technology, however, is still facing several reliability issues including interfacial delamination, crack generation and Cu protrusion. These reliability issues are attributed to themo-mechanical stress mainly caused by a large CTE mismatch between Cu via and surrounding Si. In this study, the thermo-mechanical reliability of copper TSV technology is investigated using numerical analysis. Finite element analysis (FEA) was conducted to analyze three dimensional distribution of the thermal stress and strain near the TSV and the silicon wafer. Several parametric studies were conducted, including the effect of via diameter, via-to-via spacing, and via density on TSV stress. In addition, effects of annealing temperature and via size on Cu protrusion were analyzed. To improve the reliability of the Cu TSV, small diameter via and less via density with proper via-to-via spacing were desirable. To reduce Cu protrusion, smaller via and lower fabrication temperature were recommended. These simulation results will help to understand the thermo-mechanical reliability issues, and provide the design guideline of TSV structure.