• Composites Research
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• v.30 no.6
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• pp.350-355
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• 2017

The new liquid crystalline (LC) epoxy was designed by substituting the phenylcyclohexyl (PCH) mesogen moiety with an alkyl chain at the 2,5 position of the diglycidyl terephthalate. The mesomorphic properties were evaluated by differential scanning calorimetry (DSC) and polarized optical microscopy (POM). All LC epoxy derivatives exhibited an enantiotropic smectic phase upon heating and cooling process. The LC phase temperature range was widened by mixing the eutectic mixture of LC epoxies. Interestingly, the cured LC epoxy exhibited the highest thermal conductivity of $0.4W{\cdot}m^{-1}{\cdot}K^{-1}$. The novel LC epoxy with high thermal conductivity might be used as a composite material for electronic and display devices.

• Composites Research
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• v.30 no.1
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• pp.1-6
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• 2017

Epoxy resin (EP) is one of the most famous thermoset materials. In general, because EP has three-dimensional random network, it possesses thermal properties like a typical heat insulator. Recently, there has been increasing interest in controlling the network structure for making new functionality from EP. Indeed, the new modified EP represented as liquid crystalline epoxy (LCE) is spotlighted as an enabling technology for producing novel functionalities, which cannot be obtained from the conventional EPs, by replacing the random network structure to oriented one. In this paper, we review current progress in the field of LCEs and their application for the highly thermal conductive composite materials.

• Composites Research
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• v.37 no.3
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• pp.215-218
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• 2024

Liquid crystalline thermosetting epoxy oligomer DD-A was synthesized with Diglycidyl ether of 4,4'-dihydroxy-α-methylstilbene (DGE-DHMS) and aniline in a ratio of 2:1 and cured with a catalytic curing agent, 1-Methyl Imidazole. The gelation times and vitrification times were measured to create Time-Temperature-Transition Diagrams with liquid crystalline phase changes. It was found that the gelation and vitrification times were decreased as the concentration of curing agent increased, and the vitrification curve showing a typical S-shape was confirmed.

• Composites Research
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• v.33 no.1
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• pp.25-29
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• 2020

A liquid crystalline thermosetting-epoxy-based composite was fabricated using diglycidyl ether of 4,4'-biphenol, tin(IV) oxide as a filler, and sulfanilamide as a curing agent. To investigate the thermal behavior, Thermogravimetric Analysis and Laser Flash Apparatus were performed using 3.0-7.0 wt% Tin(IV) oxide. The result showed that the activation energy and thermal conductivity were proportional to the amount of added filler.

• Composites Research
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• v.34 no.3
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• pp.180-185
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• 2021

Due to the formation of random three dimensional network structure, which cause a lot of scattering of phonons, the thermal conductivity is low when the liquid crystalline epoxy is cured with amine-based curing agent. This problem is solved by using a cationic initiator that can make mesogen groups to be stacked structure. In this experiment, the thermal stability is compared by investigating the activation energy of isothermal decomposition through TGA of an epoxy using an amine-based curing agent and a cationic initiator. As a result, the energy of the activation of the epoxy using a cationic initiator is high. Compared with the previous experiments, the thermal stability is similar to the thermal conductivity.

• Composites Research
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• v.33 no.1
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• pp.7-12
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• 2020

Over the past decade, liquid crystalline epoxy (LCER) has attracted much attention as a promising matrix for the development of efficient heat dissipation materials. This study presents a comprehensive study including synthesis, preparation and chacterization of polymer/inorganic composites using typical 4,4-diglycidyloxybiphenyl (DP) epoxy among LECR. To confirm the thermal conductivity of composite materials, we have prepared composite samples composed of epoxy resin and single-wall carbon nanotube (SWCNT) as a filler. In particular, DP composites exhibit higher thermal conductivity than commercial epoxy composites that use the same type of filler due to the highly ordered microstructure of the LCER. In addition, the thermal conductivity of the DP composite can be controlled by controlling the amount of filler. In particular, the DP composite containing a SWCNT content of 50 wt% has the highest thermal conductivity of 2.008 W/mK.

• Composites Research
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• v.35 no.2
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• pp.53-60
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• 2022

This study uses Diglycidyl ether of terephthalylidene-bis-(4-amino-3-methylphenol) (DGETAM), an amine hardener 4,4'-diaminodiphenylethane (DDE) and cationic catalyst N-benzylpyrazinium hexafluoroantimonate (BPH) to make epoxy film. For analysis, ¹H_NMR and FT-IR were used to verify proper synthesis, and the liquid crystallinity of DGETAM was checked using Differntial Scanning Calorimetry and Polarized Optical Microscopy. Thermal conductivity of the sample was measured using Laser Flash Apparatus. Thermal stability as well as thermal conductivity is important when used as a packaging material. Activated energy is the energy needed to generate a response, which can be used to estimate the energy required to maintain physical properties. It was obtained using the Arrhenius equation based on the data measured by isothermal decomposition using Thermogravimetric Analysis. Measurement of the thermal conductivity of epoxy films showed higher thermal conductivity when DDE was used, and it was found that thermal conductivity had an effect on thermal stability, given that it represented an activation energy similar to a film with BPH upon 5% decomposition.