• Journal of Applied Reliability
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• v.6 no.4
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• pp.307-315
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• 2006

차량 전장품 중 와이어링 하네스에서 큰 전류가 흐르는 회로의 연결 단자가 가지는 전기적 내구 성능 및 기계적 성능을 확보하기 위하여 단자 압착부의 압축율 최적화 기법을 개발하였다. 우선 단자 제작 과정을 표준화한 후 압착부의 주요 인자인 기계적 인장강도와 내부 부식 정도에 의한 전기적 저항 중대로 화재가 발생 가능성 관점에서 접근하였다. 여러 가지 실험을 통하여 얻어진 DATA를 분석한 결과 회귀 2차 모형을 사용하여 대전류 단자 압착부의 전기적/기계적 내구 성능 최적화 구간을 설정 하였으며, 이의 과정을 제시 하였다.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.177.2-177.2
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• 2014

현재 플렉시블 전자기기에 대한 수요가 증가함에 따라 Ag nanowire는 ITO 대체용 투명전극 물질로 주목받고 있다. Ag nanowrie 투명전극은 면저항이 약 $300{\Omega}/sq$ 정도인 PEDOT 투명전극 보다 성능이 우수하지만, 표면에 나노와이어의 적층으로 100 nm 크기의 돌기들이 존재하여 균일한 표면특성이 요구되는 투명전극에 불리한 요인이 된다. Ag nanowire를 투명전극으로 사용하여 OLED를 제조할 경우, 40 nm~100 nm의 두께를 갖는 HTL층보다 투명전극 표면의 Rpv 값이 큰 경우 Leakage current가 증가하므로 이러한 돌기들을 감소시키는 것이 Ag nanowire를 투명전극에 적용할 수 있는 중요한 요건이 된다. 본 연구에서는 PET film 위에 Ag nanowire를 얇게 코팅하여 투과도 약 87%, 면저항 $20{\Omega}/sq$ 이하의 특성을 갖는 투명전극을 제조하였다. 그리고 Ag nanowire를 코팅한 투명전극의 표면 Roughness를 감소시키기 위해 Roll press를 이용하여 나노와이어를 물리적으로 압착하였고, 압착된 Ag nanowire 투명전극 위에 PEDOT를 코팅하여 전도도 및 표면 Roughness를 감소시키는 연구를 진행하였다.

• Proceedings of the Korea Technical Association of the Pulp and Paper Industry Conference
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• 2000.11a
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• pp.63-63
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• 2000

저급의 고지 원료를 두께 방향으로 고온 압착을 가하여 건조함으로써 전반적인 종이 물성 을 향상시키는 콘디벨트 건조 방식은 70년대 중반부터 80년대에 이르는 10여년에 걸친 개발 과정을 거쳤으며 90년대에 들어서 핀랜드의 Inkeroinen에 위치한 V alemt- Tarnpella의 연구 소에 최초의 파일로트 설비가 설치되었으며 그 후 1996년에는 핀랜드 ENSO사의 P Pank밟oski 판지공장에 설치됨으로써 세계 최초의 상업생산설비를 이루게 되었다. 기존의 실린더 건조 기술과 비교할 때 콘디벨트 건조방식은 건조속도를 약 5-15배 향상시킬 수 있 으며, 건조 에너지 절감에 큰 효과가 있을 뿐만 아니라 기존의 실린더 건조시 종이가 폭방 향으로 수축되 어 인장 stiffness와 압축 강도 동의 종이 물성 이 저 하되 는 반면 습윤상태 의 섬유를 120도씨이상에서 가열에 의해 리그닌을 연화시킴과 동시에 섬유의 유연성을 증가시켜 준다. 그리고 높은 압력을 가해줌으로써 섬유간의 결합 면적을 증가시키고 건조시 종이의 폭방향의 수축을 감소시켜 인장강도, 내부결합강도, 밀도, 표면평활성, 투기저항성 등 종이의 물성을 대폭 향상시켜주는 혁신적인 제지기술로 인정받고 있으며 국내의 경우 현재 1998년 부터 상업생산을 이루어짐으로써 그 공헌도는 매우 크다고 할 수 있다. 골판지의 주원료가 되는 국산 골판지 고지 (Korean old corrugated container, K KOCC)의 거듭된 재생처리로 인하여 미세분의 함량이 전체 지료의 절반 이상에 달할 뿐만 아니라, 섬유가 각질화와 단섬유화로 인하여 고온압착 건조처리 만으로는 골판지 고지로 생 산된 원지의 강도를 버진펄프로 생산된 원지가 가지는 강도에 준하는 강도로 향상시키는데 한계점을 가지게 된다. 유럽의 제지선진국들은 골판지 원지의 강도를 향상시키는 방편으로 표변에 전분 사이즈 프레스 처리를 도입하였으며 본 연구에서는 고온 압착 건조 처리 설비를 활용한 전분 표면처리의 가능성을 검토하고 골판지 원지의 강도를 향상시키기 위한 표면처리조건을 탐색하였다.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.1
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• pp.1-6
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• 2014

Flip chip bonded LED packages possess lower thermal resistance than wire bonded LED packages because of short thermal path. In this study, thermal and bonding properties of flip chip bonded high brightness LED were evaluated for Au-Sn thermo-compression bonded LEDs and Sn-Ag-Cu reflow bonded LEDs. For the Au-Sn thermo-compression bonding, bonding pressure and bonding temperature were 50 N and 300oC, respectively. For the SAC solder reflow bonding, peak temperature was $255^{\circ}C$ for 30 sec. The shear strength of the Au-Sn thermo-compression joint was $3508.5gf/mm^2$ and that of the SAC reflow joint was 5798.5 gf/mm. After the shear test, the fracture occurred at the isolation layer in the LED chip for both Au-Sn and SAC joints. Thermal resistance of Au-Sn sample was lower than that of SAC bonded sample due to the void formation in the SAC solder.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.11a
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• pp.421-424
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• 2000

We have examined the impedance characteristics and the rate characteristics of LPB. As results, the impedance of LPB decreased with increased pressing rate of electrodes, adding amounts of PVdF and VGCF. And the rate characteristics of LPB increased with the a increase of pressure-rate, PVdF and VGCF contents. The rate characteristics of LPB was improved by pressing of electrode and adding of VGCF content. And specific capacity of anode was increased with adding amounts of PVdF. Higher pressing rate of electrodes, higher adding amounts of PVdF and VGCF was necessitated good rate characteristics for lithium polymer battery.

• Journal of the Microelectronics and Packaging Society
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• v.13 no.2 s.39
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• pp.21-26
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• 2006

We developed a bonding at low temperature using fine pitch Sn and In bumps, and studied the reliability of the fine pitch In-Sn solder joints. The $30{\mu}m$ pitch Sn and In bumps were joined together at $120^{\circ}C$. A non conductive adhesive (NCA) was applied during solder joining. Thermal cycling test ($0^{\circ}C-100^{\circ}C$, 2 cycles/h) of up to 2000 cycles was carried out to evaluate the reliability of the solder joints. The bondability was evaluated by measuring the contact resistance (Rc) of the joints through the four point probe method. As the content of filler increased, the reliability improved in the solder joints during thermal cycling test because the contact resistance increased little. The filler redistributed the stress and strains from the thermal shock over the entire joint area.

• Membrane Journal
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• v.26 no.3
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• pp.229-237
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• 2016

We prepared heterogeneous ion exchange membranes (hetero-IEMs) for the application of membrane capacitive deionization (MCDI). Hetero-IEMs were fabricated by compressing the mixture of ion exchange resin powders and liner low density polyethylene (LLDPE). Characterization and MCDI desalination experiments were carried for the fabricated membranes. Electrical resistance of membrane decreased and water content increased with increasing the resin content in the hetero-IEMs. However, transport number indicating permselectivity of membrane was similar with that of commercial homogenesous ion exchange membrane. The results of MCDI desalination experiments showed that the adsorption amount for hetero-IEM was about 90% of that of homogeneous membrane due to the high electrical resistance of hetero-IEM. Although desalination performance of hetero-IEM decreased compared with homogeneous membrane, it was thought to be applicable to MCDI because of simple preparation and low price.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.3
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• pp.71-76
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• 2012

A chip interconnection technology for smart fabrics was investigated by using flip-chip bonding of SnBi low-temperature solder. A fabric substrate with a Cu leadframe could be successfully fabricated with transferring a Cu leadframe from a carrier film to a fabric by hot-pressing at $130^{\circ}C$. A chip specimen with SnBi solder bumps was formed by screen printing of SnBi solder paste and was connected to the Cu leadframe of the fabric substrate by flip-chip bonding at $180^{\circ}C$ for 60 sec. The average contact resistance of the SnBi flip-chip joint of the smart fabric was measured as $9m{\Omega}$.

• Journal of the Korean Electrochemical Society
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• v.4 no.1
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• pp.1-5
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• 2001

Composite ratio of $LiMn_2O_4$ in cathode was optimized as function of specific surface area. Binder has to be used as possible as little, and it should maintain adhesive property between cathode composite and current collector even though in electrolytes. For this purpose, We used 'Hot Roll Pressing' method, and it was effective. To prevent separation of cathode composite from current collector, PVDF(Polyvinylidenefluoride) has to be mixed more than $1.1\%$ in weight ratio to sum of surface area of lithium manganese oxide and conducting agents. Specific internal resistance was reduced as by increasing electrical conductivity of cathode. And Ratio of 2C rate discharge capacity to 0.2C rate discharge capacity was increased by $17\%$, as increasing electrical conductivity from 0.019 mS/cm to 0.036 mS/cm.

• Journal of the Korean GEO-environmental Society
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• v.15 no.9
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• pp.87-92
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• 2014

The Ground anchor is reinforcement to resist pull-out through ground that is used supports structure. The pull-out resistance of anchor is constructed by skin friction resistance from compression borehole wall in expanded wings and bearing pressure from the ground. Especially, underreamed ground anchor is reinforcement that adopts active reinforcement to prevent deformation of ground using bearing resistance generated reaming anchorage. This study is conducted to calculate bearing resistance of underreamed ground anchor. Realistic model tests were fulfilled to determine bearing resistance of anchor, and correlate results of tests to Uniaxial Compressive Strengths (UCS) of ground models that assumed weathered rock condition in 8 case. In a comprehensive series of the tests, the bearing resistances were measured by pull-out tests. The bearing resistances derived from tests have a linear correlation with UCS. We also suggest empirical equation between bearing resistance and UCS of rocks by single linear regression analyses. In test results of this study, the bearing resistances were evaluated approximately 13 times higher than UCS of the grounds, and it is qualitatively similar to numerical values of pull-out force derived from theory.