• Proceedings of the Korean Vacuum Society Conference
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• 1998.02a
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• pp.90-90
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• 1998

전계 에미터 어레이(FEA)는 진공에서 전계률 인가하여 전극으로부터 전자률 방출시키는 전자원으로서, 마이크로파 소자 및 명판 디스플레이, 센서 둥에 이용된다 .. Transfer Mold 법 은 뾰족한 에미터 립과 게이트 절연막 및 게이트 전극 충올 형성한 후 유리와 같은 기판에 이전 시키는 방법으로, 이러한 방법은 Mold 형태 위에 코탱 충의 두께 조절과, 게이트와 립 높이 조절이 가능하며, 그리고 유리 기판 위에 접착하여 대면적의 평판 디스플레이를 제작 할 수 었다는 장점이 있다[1,2]. 본 연구에서는 일반적으로 사용되는 실리콘 기판올 습식 식 각하여 Mold률 제작하는 방법 대선에, 측벽 스페이스 구조률 이용한 새로운 방법의 Mold 형태률 이용하여 게이트률 가진 에마터 립올 제작하였다. 먼저 실리콘 기판 위에 산화막올 증착하고 그 위에 게이트 전극파 게이트 절연막을 LPCVD 방법으로 증착하여 구명 형태로 패터닝 한 후, BPSG(Boro Phospher Silicate Glass) 박막올 증착하여 고온에서 훌러 내려 뾰족한 형태의 주형(Mold)률 제작한 후 TiN율 증착하여 정전 접합(an여ic bon벼ng)이나 레 진(resine)둥으로 유리률 접합한 후 KOH 용액으로 실리콘 기판옵 뒷면부터 식각해 낸다. 그 다옴, 립과 게이트 위에 있는 절연막올 제거한 후 뾰족한 전계 에미터 어레이륭 제조하 였다. 자세한 제조 공정 및 제작된 에미터 립의 특성은 학회에서 발표될 예정이다.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.24 no.12B
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• pp.2335-2341
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• 1999

The $2\times32$ coupler consists of Mach-Zehnder interferometer and Y branch coupler. For the designs of this coupler, three dimensional rectangular core waveguide decomposed to two-dimensional structure by the effective index method. To optimize the waveguide structure, the confinement factor was investigated with two-dimensional finite difference Beam Propagation Method. The $2\times32$ coupler fabricated by simulation with height between Mach-Zehnder arms, H=$43.6\mu\textrm{m}$(path difference $0.668\mu\textrm{m}$) was showed best characteristics. In the results of dry etching of core layer, the etching rate of core layer was above 2600${\AA}$/min, the etching ratio of SiO2 to Al mask was 30:1 and the uniformity of etching was $\pm$5%. The maximum insertion loss and the uniformity of $2\times32$ coupler were below 19.2dB, 2dB respectively.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.37 no.7
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• pp.1-6
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• 2000

In this study, the effects of the addition of $N_2$ gas into the $Cl_2$ (90)/Ar(10) gas mixture, which has been proposed as the optimized etching gas combination, for etching of platinum was performed. The selectivity of platinum film to $SiO_2$ film etch mask increased with the addition of $N_2$ gas, and etch profile over 75 $^{\circ}$ could be obtained when 20 % additive $N_2$ gas was added. These phenomena were interpreted as the results of a formation of blocking layer such as Si-N or Si-O-N on the $SiO_2$ mask. The maximum etch rate of Pt film and selectivity of Pt to $SiO_2$ are 1425 ${\AA}$/min and 1.71, respectively. These improvements were considered to be due to the formation of more volatile compounds such as Pt-N or Pt-N-Cl.

• Proceedings of the Korean Vacuum Society Conference
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• 2009.08a
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• pp.376-376
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• 2009

• Proceedings of the Korean Vacuum Society Conference
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• 1993.07a
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• pp.78-79
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• 1993

• Korean Chemical Engineering Research
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• v.54 no.4
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• pp.548-554
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• 2016

In this study, semi-aqueous solutions containing carboxylic acids such as oxalic acid (OA), lactic acid (LA) and citric acid (CA) were formulated for the removal of copper etching residues produced at the interconnection process, and their characteristics were analyzed. Carboxylic acids in the solutions were apt to form various copper complexes according to the value of pH. Semi-aqueous solution containing 10 wt% CA showed the lowest etching rate of copper in the range from pH2 to pH7 and the highest selectivity in the range of pH 2 to pH 4. However, the cleaning solution containing 10 wt% LA revealed the superior selectivity at the range from pH 5 to pH 7. Appropriate selection of carboxylic acid should be required to improve the performance of cleaning solution. In the case of CA, the etching selectivity of copper oxide complex to copper was increased with the concentration of CA in the solution, when the solutions contain over 5 wt% CA, the copper interconnection layer has a metallic copper surface more than 88% in the area. The result shows that CA contained semi-aqueous solution has a relatively good cleaning ability.

• Journal of Sensor Science and Technology
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• v.10 no.5
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• pp.304-313
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• 2001

In this research, we investigate wet-etching properties of GaAs in $NH_4OH-H_2O_2-H_2O$, and develop the fabrication method of GaAs microstructures with rectangular cross section using (001) GaAs substrate. For obtaining wet-etching properties with respect to crystallographic orientation, the etch rates and cross-section etch profiles of (001) GaAs with 16 different compositions and the undercut rates with 5 different compositions are measured using $NH_4OH-H_2O_2-H_2O$ mixed solutions. From these experimental data, a new GaAs micromachining method in bulk (001) GaAs is proposed, and used to fabricate a released microbridges with a rectangular cross section. The developed GaAs micromachining method can be very useful for low-loss, highly-tunable capacitors for RF components and for integration with GaAs optical components.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.37 no.12
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• pp.24-28
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• 2000

This paper reports a new calculation method of three dimensional deposeition rate by level set method. To model an advancement of the surface efficiently, we have developed a new iteration method to re-initialize the level set function. For calculating etching and deposition rate by direct flow, we have developed a visibility test module and a refraction and re-sputtering model. Sputter deposition rate with shadow effect and surface refraction is calculated. We report that difference of profiles in cases that sticking coefficient are 1.0 and 0.3. We report that the difference of the deposition rate on bottom of the hole is caused by a difference of visible angle by the shadowing effect.

• Journal of the Korean Ceramic Society
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• v.42 no.3 s.274
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• pp.178-181
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• 2005

Silicon oxynitride (SiON) layers deposited upon a $SiO_2/Si$ buffer layer placed upon silicon wafers have been obtained by using PECVD from $SiH_4,\;N_2O$, and $N_2$. It can be seen that the refractive index, measured by using a prism coupler, for the SiON films can be varied between 1.4480 and 1.4958 at a wavelength of 1552 nm by changing the process parameters. Optical planar waveguides with a thickness of $6{\mu}m$ and a refractive index contrast ($\Delta$n) of $0.36\% have been deposited. Also, etching experiments were performed using ICP dry etching equipment on thick SiON films grown onto Si substrates covered by a thick $SiO_2$ buffer layer. A polarization maintaining single-mode fiber was used for the input and a microscope objective for the output at $1.55{\mu}m$. As a result, a low index contrast SiON based waveguide is fabricated with easily adjustable refractive index of core layer. It illustrates that the output intensity mode is a waveguiding single-mode.

• Journal of the Microelectronics and Packaging Society
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• v.8 no.3
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• pp.69-75
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• 2001

Photoimageable thick film technology is a new technology in that the lithography process such as exposure and development is applied to the conventional thick film process. Line resolution of 25 $\mu\textrm{m}$ width and 25 $\mu\textrm{m}$ space could be obtained by laminating green sheet, printing photoimageable Ag paste, exposing the test patterns, developing, and co-firing. In case of using the alumina substrate, 20 $\mu\textrm{m}$ fine line could be also obtained by similar process. Test results showed that exposing power density and developing time were the most important processing parameters for the fine line formation. Microstrip and series gap resonators with well-defined line morphology and good transmission characteristics in high frequency were formed by this new technology, and thereby dielectric constant and loss of test substrate were calculated.