• Journal of Ocean Engineering and Technology
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• v.23 no.6
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• pp.87-92
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• 2009

The effect of aging on the precipitation of the $\sigma$ phase and the corrosion resistance in tungsten substituted super duplex stainless steels was investigated. The volume fraction of the $\sigma$ phase and the current density increased with aging at temperatures up to $750^{\circ}C$ and then decreased. With an increase in aging time, the volume fraction of the $\sigma$ phase and the current density also increased. The $\sigma$ phase hardly influenced the corrosion resistance. With the substitution of tungsten for molybdenum in super duplex stainless steel, the volume fraction of the $\sigma$ phase and the current density decreased remarkably.

• Transactions of the Korean Society of Automotive Engineers
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• v.10 no.2
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• pp.110-116
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• 2002

At elevated temperature, very complex precipitations occur in STS316. To investigate the effect of the precipitation on mechanical properties in SIS316, tensile tests and fatigue crack growth tests were carried out at $650^{\circ}C$ using artificially degraded materials. The material degradation was simulated by aging for up to 20000 hrs. at $750^{\circ}C$, which is equal to 179000hrs (about 20yrs) of service life at $650^{\circ}C$, after conducting solution treatment for 20 min. at $11300^{\circ}C$. The result of the hardness test and the tensile test showed that both properties are closely related to the mean free distance of carbides. Also, from the results of fracture tests at $650^{\circ}C$, ${\triangle}K_{th}$, after values were found to decrease as aging time and microstructure, as the volume fraction of $\sigma$ phase increased.

• Journal of the Microelectronics and Packaging Society
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• v.16 no.1
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• pp.33-38
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• 2009

The use of portable devices has created the need for new reliability criterion of drop impact tests because of the tendency to accidentally drop in the use of these devices. The effects of different PCB surface finishes (organic solderability preservative (OSP) and electroless nickel immersion gold (ENIG)) and high temperature storage (HTS) test on the drop reliability were studied. Various drop test conditions were used to evaluate a drop reliability of assemblies to endure such impact and shock load. In the case of the as-reflowed samples (no HTS test), the SAC/OSP boards exhibited a better drop impact reliability than that of SAC/ENIG. However, the reverse was true if HTS test is performed. In addition, significant decrease of drop reliability was observed for both SAC/ENIG and SAC/OSP assemblies after HTS test. It was also observed that the thickness of intermetallic compound layer do play an important role in the brittle fracture of drop test.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.35 no.7
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• pp.717-722
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• 2011

The purpose of this study is to predict the residual stress in Al6061 during T6 heat treatment. In this study, the variable residual stress in case of the solid solution($530^{\circ}C$, 2h) and artificial ageing($175^{\circ}C$, 9h) of Al6061 subjected to T6 heat treatment is determined at different ageing times. A heat treatment experiment is conducted to determine the heat transfer coefficient, on the basis of which the residual stress during the T6 heat treatment is predicted. In order to take into account the relaxation of residual stress during artificial ageing, a Zener-Wert-Avrami function is used and elasto-plastic nonlinear analysis is conducted through FE-simulation. Further, the residual stress is measured by using the X-ray diffraction(XRD) method, and the result is compared with the result from the FE-simulation. It is found that the residual stress predicted form the FE-simulation is in good agreement with the residual stress measured by using the XRD method.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.07a
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• pp.640-644
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• 2000

The microstructure, wettability, shear strength and aging effect of Sn-3.5Ag/Cu and Alloy42 lead-frame solder joints were measured for comparison. In the case of Sn-3.5Ag/Cu, Ag$_3$Sn and Cu$\sub$6/Sn$\sub$5/ phases in the matrix Sn and 1∼2$\mu\textrm{m}$ thick Cu$\sub$6/Sn$\sub$5/ Phase at the interface of solder/lead-frame were formed. In the case of Sn-3.5AAg/A11oy42, only Ag$_3$Sn Phase of low density in the matrix Sn and 0.5∼1.5$\mu\textrm{m}$ thick FeSn$_2$phase at the interface of solder/lead-frame were formed. Comparing to Cu, Alloy42 shear strength of Alloy 42 solder joints was smaller than that of Cu and all declined after aging. After aging at 180$^{\circ}C$ for 1 week, η-Cu$\sub$6/Sn$\sub$5/ layer was formed on Cu lead-frame, while AgSn$_3$ phase in the matrix and thickened FeSn$_2$at the interface were formed on Alloy42 lead-frame.

• Korean Journal of Materials Research
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• v.10 no.12
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• pp.793-798
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• 2000

The age-hardening behavior of unreinforced 6061 Al alloy and SiCp/6061 Al alloy composites reinforced with different size of SiC particle (average diameter ; 0.7$\mu\textrm{m}$ and 7.0$\mu\textrm{m}$) was investigated by hardness measurement, calorimetric technique and transmission electron microscopy. At 17$0^{\circ}C$ isothermal aging treatment, the peak aging time of 0.7$\mu\textrm{m}$SiCp/6061Al alloy composite and 7.0$\mu\textrm{m}$SiCp/6061Al alloy composite is shorter than that of unreinforced 6061Al alloy, and the aging of 7.0$\mu\textrm{m}$SiCp/6061Al alloy composite is accelerated more than that of 0.7$\mu\textrm{m}$SiCp/6061Al alloy composite. This acceleration is due to the increase of dislocation density by the compositeness with SiCp and the SiC particle size. In the peak aged condition, the major strengthening phase of these materials is intermediate $\beta$ phase(Mg$_2$Si), and the activation energy for the formation of $\beta$ phase is considerably decreased by the compositeness with SiCp and the increasing of SiC Particle site.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.238-238
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• 2012

현재 국내 주얼리(gold alloy) 제품을 생산함에 있어 주조 방법은 크게 대기 중 주조(흡입주조) 방법과 진공주조 방법으로 나누어진다. 국내 주얼리 제조업체의 약 90%이상이 대기 중에서 주조하는 흡입주조방법을 통해 제품을 제작하고 있고, 국외의 경우, 대다수 진공주조방법을 통해 제품을 제작하고 있다. 본 연구에서는 주얼리 제품을 생산할 때 사용되는 합금재료(master alloy)가 동일한 조건에서 주조방법을 달리하여 각각 24개씩 총 48개의 14K yellow gold alloy 제품을 제작한 후 열처리를 통해 각각의 기계적, 물리적 특성분석을 비교 분석하였다. EPMA (Electron Probe Micro Analysis)분석을 통해 합금재료 및 제품의 구성성분을 조사하였고, ICP-MS (Inductively Coupled Plasma Mass Spectroscopy)를 사용하여 성분에 대한 정량분석을 실시하였다. 용체화처리(solid solution treatment)는 $700^{\circ}C$, 30분의 조건으로 실시하였고, 시효경화처리(age-hardening)는 $200{\sim}300^{\circ}C$의 온도범위에서 $50^{\circ}C$ 간격으로 실시하였다. 열처리 전과 후 시료의 grain 들의 배열 및 size 변화를 관찰하기 위해 식각 후 OM (optical microscope) 및 SEM (Scanning Electron Microscope)를 통해 분석하였다. 열처리 전 제품의 경도측정결과 대기 중 흡입주조방법 및 진공 주조방법을 통해 제작된 제품이 각각 119 Hv, 126 Hv로 나타났고, 용체화 처리 후 98 Hv, 92 Hv로 감소하였다. 시효경화 처리 후의 경도변화는 대기 중 흡입주조 및 진공주조방법을 통해 제작된 제품 모두 $270^{\circ}C$에서 각각 154 HV, 166 HV로 가장 높은 경도 값을 나타내었고, $270^{\circ}C$ 이상에서는 과시효(over aging)현상으로 인해 경도 값이 다시 감소하는 경향을 나타내었다. EPMA mapping 분석을 통해 주조방법에 따라 각각 제품의 구성성분분포도를 확인하였다. 이를 통해 열처리 전 다소 불균일하게 분포되었던 성분들이 열처리 후 균일해짐을 확인할 수 있었다.

• Journal of Advanced Marine Engineering and Technology
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• v.26 no.1
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• pp.68-75
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• 2002

Stellite 12 alloy-powders were overlaid on 410 stainless steel valve seat by plasma transferred arc(PTA)process. Variation of microstructure and hardness of overlaid deposit with aging time at $750^{\circ}C$ was investigated. The deposit showed hypoeutectic microstructure, which was consisting of primary cobalt dendrite and networked $M_{7}C_{3}$type eutectic carbides. After aging new M_{23}C_{6}$ carbide was formed by the partial decomposition of $M_7C_3$ type eutectic carbides and finely dispersed $M_{23}C_6$ type carbides were also precipitated in the matrix. Hardness of the deposit was increased with increase of aging time at $750^{\circ}C$ and showed maximum value at 35hours. After showing maximum value, it was fallen down again at 70hours because of overaging. The increase of hardness in aging is ascribed to the formation of new stable $M_{23}C_6$ type carbide by the partial decomposition of $M_7C_3$ type eutectic carbides and also precipitation of finely dispersed $M_{23}C_6$ carbides in matrix.

• Proceedings of the Materials Research Society of Korea Conference
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• 2010.05a
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• pp.46.2-46.2
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• 2010

최근 수송기기 및 전자부품산업에서의 성능향상 요구에 따라 경량고강도 비철금속재료의 수요가 증대되고 있다. 특히, 세계적으로 에너지 절약 및 환경 공해 규제가 대폭 강화됨에 따라 자동차, 항공기 등 수송기기의 소재경량화 소재로 낮은 밀도 기계적 가공성이 우수한 마그네슘 합금이 각광을 받고 있다. 그러나 Mg합금은 알루미늄 합금과는 달리 보호성 산화피막이 형성되지 않아 내식성 및 고온강도가 매우 취약하다. 이를 보안하기 위해서 본 연구에서는 마그네슘의 강도 개선을 위한 원소로써 고용강화 원소로 많이 쓰이는 Zn과 입자 미세화로 인한 항복강도를 증가시키는 Mn의 3원계 합금에 고온에서 안정한 Mg2Sn상이 형성되는 Sn을 첨가하여 시효처리에 따른 기계적 특성과 미세조직을 관찰하였다. 실험 이전에 Pandat Program에 의한 열역학적 분석을 바탕으로 Mg-Zn-Mn 및 Mg-Zn-Mn-Sn의 상태도 계산 및 MgZn와 Mg2Sn 석출분율을 예측하였다. 열역학 계산을 통해 도출된 석출온도를 통해 Mg-Zn-Mn 및 Mg-Zn-Mn-Sn 합금의 열처리에 따른 경도 및 미세구조를 관찰하였다. 또한, 기계적 특성을 평가하기 위해 상온 및 고온 인장시험을 실시하였고 XRD, SEM을 이용하여 석출상을 분석하였다.

• Transactions of the Korean Society of Automotive Engineers
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• v.22 no.3
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• pp.90-96
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• 2014

The conventional SnPb solders were widely used for several decades in the electronic packing system due to the superior mechanical properties such as low melting point, better wettavility and good mechanical fatigue. However, in recent years, owing to adverse effect on the human health and environment, conventional SnPb solders have been replaced by Lead-free solders. In this research, the shear punch(SP) test of Sn-4Ag-(Cu)/Ni pad was performed. Pb-free solder alloys which are the environmentally friendly of the electronic components were performed at $150^{\circ}C$ for 100hr~1000hr to artificial aging processing. In order to evaluate the mechanical properties of solder joints, the SP test was conducted at $30^{\circ}C$ and $50^{\circ}C$. As a result, the maximum shear strength of almost the whole specimens was decreased with the increase in aging time and temperature of SP test. The mechanical properties of Sn-4Ag-0.5Cu solder were most excellent in all Pb-free solder which were produced by the SP test at $30^{\circ}C$.